The XC3S1200E-5FT256C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3E family, designed to deliver exceptional performance for a wide range of digital applications. This versatile programmable logic device combines high-density architecture with cost-effective solutions for engineers and developers working on complex digital designs.
Product Specifications
Core Architecture
The XC3S1200E-5FT256C features a robust architecture built on advanced CMOS technology, offering superior performance and reliability. This FPGA delivers 1.2 million system gates, providing ample resources for implementing sophisticated digital circuits and embedded systems.
Key Technical Specifications:
- Logic Cells: 17,280 logic cells for complex digital implementations
- System Gates: 1,200,000 gates for extensive design capacity
- Block RAM: 504 Kbits of dedicated block RAM for data storage
- Distributed RAM: 336 Kbits for flexible memory solutions
- Multipliers: 28 dedicated 18×18 multipliers for DSP applications
- I/O Pins: 190 user I/O pins for comprehensive connectivity
- Package Type: FT256 (Fine-Pitch Ball Grid Array)
- Speed Grade: -5 (indicating high-performance operation)
- Operating Voltage: 1.2V core, 3.3V I/O
Package Details
The XC3S1200E-5FT256C comes in a compact FT256 package, measuring 17mm x 17mm with a 1.0mm ball pitch. This fine-pitch BGA package provides excellent thermal performance and signal integrity while maintaining a small footprint ideal for space-constrained applications.
Price Information
The XC3S1200E-5FT256C is competitively priced within the mid-range FPGA market segment. Pricing varies based on quantity, distributor, and market conditions. For current pricing and volume discounts:
- Contact authorized Xilinx distributors for real-time quotes
- Volume pricing available for quantities over 100 units
- Educational discounts may apply for academic institutions
- Consider lifecycle and availability when planning long-term projects
Note: Prices are subject to change based on market conditions and availability.
Documents & Media
Essential Documentation
Access comprehensive technical resources to maximize your XC3S1200E-5FT256C implementation:
Datasheets and Technical References:
- Product datasheet with complete electrical specifications
- Spartan-3E family overview and architecture guide
- Package and pinout information for FT256 configuration
- DC and switching characteristics documentation
- Configuration and programming specifications
Design Resources:
- Application notes for common design patterns
- Reference designs and example projects
- PCB layout guidelines and recommendations
- Thermal management and power consumption guides
- Signal integrity considerations for high-speed designs
Software and Tools:
- ISE Design Suite compatibility information
- Vivado Design Suite migration guidelines
- IP core compatibility matrix
- Simulation models and timing files
Related Resources
Development Tools
Maximize your XC3S1200E-5FT256C development efficiency with these essential tools and resources:
Hardware Development:
- Spartan-3E starter kits and evaluation boards
- Compatible development platforms and expansion modules
- Programming cables and debugging interfaces
- Reference schematics for custom board designs
Software Solutions:
- Xilinx ISE Design Suite (legacy support)
- Third-party synthesis and simulation tools
- IP core libraries and pre-built functions
- Design verification and testing utilities
Learning Resources:
- Online tutorials and training materials
- Community forums and technical support
- Application examples and case studies
- Best practices documentation
Compatible Products
Explore complementary products that work seamlessly with the XC3S1200E-5FT256C:
- Configuration memory devices
- Power management solutions
- Clock generation and distribution ICs
- Interface and connectivity components
Environmental & Export Classifications
Environmental Compliance
The XC3S1200E-5FT256C meets stringent environmental standards and regulations:
RoHS Compliance: Fully compliant with RoHS (Restriction of Hazardous Substances) directives, ensuring environmentally responsible manufacturing without lead, mercury, cadmium, or other restricted materials.
Operating Conditions:
- Temperature range: -40ยฐC to +85ยฐC (commercial grade)
- Humidity tolerance: Up to 95% non-condensing
- Altitude rating: Up to 3,000 meters
- Vibration and shock resistance per industry standards
Export Control Information
Export Classification: The XC3S1200E-5FT256C is subject to export control regulations:
- ECCN (Export Control Classification Number): 3A001.a.7
- Country of origin restrictions may apply
- End-use and end-user verification required for certain destinations
- Compliance with local export control laws mandatory
Regulatory Certifications:
- FCC Part 15 Class B compliance
- CE marking for European market access
- IC certification for Canadian market
- Additional regional certifications available upon request
Quality and Reliability
The XC3S1200E-5FT256C undergoes rigorous quality testing to ensure long-term reliability in demanding applications. Each device is manufactured in ISO 9001 certified facilities and subjected to comprehensive electrical and functional testing before shipment.
The XC3S1200E-5FT256C represents an excellent balance of performance, features, and cost-effectiveness for mid-range FPGA applications. Whether you’re developing communications equipment, industrial control systems, or embedded processing solutions, this versatile FPGA provides the resources and reliability needed for successful project implementation.
