The XC3S1200E-4FTG256I is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3E family, designed to deliver exceptional performance for cost-sensitive applications. This versatile FPGA solution combines advanced processing capabilities with energy efficiency, making it ideal for digital signal processing, embedded control, and system integration projects.
Product Specifications
Core Features of XC3S1200E-4FTG256I
The XC3S1200E-4FTG256I offers robust specifications that meet demanding application requirements:
Logic Capacity & Architecture:
- Logic Cells: 1,200,000 system gates
- Configurable Logic Blocks (CLBs): 8,672 slices
- Dedicated Block RAM: 504 Kbits total
- Distributed RAM: 173 Kbits
- Digital Clock Manager (DCM): 8 units
I/O and Connectivity:
- Package Type: FTG256 (Fine-Pitch Ball Grid Array)
- Total I/O Pins: 190 user I/O pins
- Differential I/O Pairs: 95 pairs
- Supply Voltage: 1.2V core, 3.3V I/O
- Speed Grade: -4 (high performance)
- Temperature Range: Industrial (-40ยฐC to +85ยฐC)
Signal Processing Capabilities:
- Dedicated 18×18 Multipliers: 28 units
- Maximum Clock Frequency: Up to 326 MHz
- Low-power consumption design
- Advanced clock management system
Technical Advantages
The XC3S1200E-4FTG256I delivers superior performance through its optimized architecture, featuring enhanced signal processing blocks and efficient power management. Its industrial temperature rating ensures reliable operation in harsh environments, while the compact FTG256 package provides excellent pin density for space-constrained designs.
Price Information
XC3S1200E-4FTG256I Pricing:
- Unit Price: Contact authorized distributors for current pricing
- Volume Discounts: Available for quantities over 100 units
- Lead Time: Typically 8-12 weeks for standard orders
- Availability: In production, contact suppliers for stock status
Note: Pricing for the XC3S1200E-4FTG256I varies based on quantity, packaging options, and market conditions. Contact authorized Xilinx distributors for the most current pricing information.
Documents & Media
XC3S1200E-4FTG256I Documentation
Access comprehensive technical resources for the XC3S1200E-4FTG256I:
Datasheets & Technical References:
- XC3S1200E-4FTG256I Product Datasheet (PDF)
- Spartan-3E FPGA Family Data Sheet
- DC and Switching Characteristics
- Package and Pinout Information
- PCB Design Guidelines for FTG256 Package
Design Tools & Software:
- Xilinx ISE Design Suite compatibility
- FPGA Editor support files
- Constraint files (.ucf) for XC3S1200E-4FTG256I
- Reference designs and application notes
- Simulation models (Verilog/VHDL)
Development Resources:
- Evaluation boards featuring XC3S1200E-4FTG256I
- Getting started guides and tutorials
- Power estimation tools
- Timing analysis documentation
Related Resources
Compatible Development Tools
The XC3S1200E-4FTG256I integrates seamlessly with industry-standard development environments:
Design Software:
- Xilinx ISE WebPACK (free version available)
- ModelSim simulation environment
- ChipScope Pro analyzer support
- Third-party synthesis tools compatibility
Hardware Accessories:
- Programming cables (Platform Cable USB)
- Evaluation and development boards
- Socket adapters for prototyping
- Heat sinks and thermal management solutions
Application Areas
The XC3S1200E-4FTG256I excels in diverse applications including:
- Digital signal processing systems
- Industrial automation and control
- Communications equipment
- Test and measurement instruments
- Automotive electronics
- Medical device applications
Technical Support
- Xilinx Answer Database with XC3S1200E-4FTG256I specific solutions
- Community forums and user groups
- Application engineer support
- Training courses and webinars
Environmental & Export Classifications
Environmental Compliance
The XC3S1200E-4FTG256I meets stringent environmental standards:
RoHS Compliance:
- Fully RoHS compliant (lead-free)
- WEEE directive compliant
- REACH regulation compliance
- Conflict minerals reporting available
Quality Standards:
- ISO 9001:2015 certified manufacturing
- Automotive quality standards (AEC-Q100)
- Military and aerospace grade options available
- Comprehensive reliability testing
Export Control Information
Trade Compliance for XC3S1200E-4FTG256I:
- Export Control Classification Number (ECCN): Check current regulations
- Country of Origin: Manufactured in various locations
- Export licensing requirements may apply
- Contact Xilinx for specific export documentation
Packaging & Handling:
- Moisture sensitivity level (MSL): Level 3
- Storage temperature: -55ยฐC to +150ยฐC
- ESD sensitive device – proper handling required
- Tape and reel packaging available
Ordering Information
Part Number Breakdown:
- XC3S1200E: Device family and density
- -4: Speed grade (high performance)
- FTG256: Package type (256-pin Fine-Pitch BGA)
- I: Industrial temperature range
The XC3S1200E-4FTG256I represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based designs. Its proven Spartan-3E architecture, comprehensive tool support, and extensive documentation make it an ideal choice for both prototype development and volume production applications.
