The XC3S1200E-4FTG256C is a powerful field-programmable gate array (FPGA) from Xilinx’s acclaimed Spartan-3E family, engineered to deliver exceptional performance for a wide range of digital signal processing and embedded system applications. This versatile FPGA combines robust functionality with cost-effective design, making it an ideal choice for engineers developing complex digital systems.
Product Specifications
The XC3S1200E-4FTG256C features impressive technical capabilities that set it apart in the FPGA market:
Core Architecture:
- Logic cells: 1,200,000 system gates
- Configurable Logic Blocks (CLBs): 8,672 slices
- Block RAM: 504 Kb total memory
- Distributed RAM: 166 Kb
- Multipliers: 28 dedicated 18×18 multipliers
Package Details:
- Package type: Fine-pitch Ball Grid Array (FTBGA)
- Pin count: 256 pins
- Package size: 17mm x 17mm
- Speed grade: -4 (high performance)
- Operating temperature: Commercial grade (0ยฐC to +85ยฐC)
I/O Capabilities:
- User I/O pins: 173 maximum
- Differential I/O pairs: 86
- Digital Clock Manager (DCM): 4 units
- Maximum frequency: 326 MHz
The XC3S1200E-4FTG256C supports multiple I/O standards including LVTTL, LVCMOS, LVDS, and SSTL, ensuring compatibility with diverse system requirements.
Price
The XC3S1200E-4FTG256C is competitively priced to provide excellent value for high-performance FPGA applications. Pricing varies based on quantity, distribution channel, and current market conditions. For accurate pricing information on the XC3S1200E-4FTG256C, contact authorized Xilinx distributors or visit official semiconductor marketplace platforms. Volume discounts are typically available for production quantities.
Documents & Media
Comprehensive technical documentation supports the XC3S1200E-4FTG256C implementation:
Technical Documentation:
- XC3S1200E-4FTG256C datasheet with complete electrical specifications
- Spartan-3E FPGA family user guide
- Package thermal and mechanical specifications
- Pin assignment and package drawings
- Configuration and programming guidelines
Design Resources:
- Xilinx ISE Design Suite compatibility information
- Reference designs and application notes
- Power consumption analysis tools
- Signal integrity guidelines for FTBGA256 package
Software Tools:
- Xilinx Vivado Design Suite support
- IP core libraries and reference designs
- Simulation models and timing analysis tools
- Programming and debugging utilities
Related Resources
The XC3S1200E-4FTG256C ecosystem includes extensive development resources:
Development Platforms:
- Spartan-3E starter kits and evaluation boards
- Third-party development modules featuring XC3S1200E-4FTG256C
- Prototyping boards with FTG256 socket compatibility
Design Tools Integration:
- ModelSim simulation environment support
- ChipScope Pro integrated logic analyzer compatibility
- Third-party synthesis tool support
- MATLAB and Simulink integration capabilities
Community Resources:
- Xilinx community forums and support portal
- Application notes specific to XC3S1200E-4FTG256C implementations
- Video tutorials and webinar series
- University program resources for educational applications
Environmental & Export Classifications
The XC3S1200E-4FTG256C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant lead-free package
- REACH regulation compliance
- Halogen-free package option available
- Green package marking for environmental identification
Quality Standards:
- Automotive-grade versions available (extended temperature range)
- Industrial temperature grade: -40ยฐC to +100ยฐC options
- MSL (Moisture Sensitivity Level): Level 3
- ESD protection: Human Body Model (HBM) Class 2
Export Classifications:
- Export Control Classification Number (ECCN): 3A991.a.2
- HTS (Harmonized Tariff Schedule) code: 8542.33.0001
- Country of origin marking compliance
- Standard commercial export classification
Reliability Specifications:
- MTBF (Mean Time Between Failures): >1,000,000 hours
- Junction temperature rating: 125ยฐC maximum
- Package integrity tested per JEDEC standards
- Qualification per automotive AEC-Q100 (select grades)
The XC3S1200E-4FTG256C represents an optimal balance of performance, flexibility, and cost-effectiveness for demanding FPGA applications. Its comprehensive feature set, robust documentation, and broad ecosystem support make it an excellent choice for both prototype development and volume production across telecommunications, industrial automation, medical devices, and consumer electronics applications.
