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XC3S1200E-4FT256I: High-Performance Spartan-3E FPGA for Advanced Digital Design

Original price was: $20.00.Current price is: $19.00.

The XC3S1200E-4FT256I is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3E family, designed to deliver exceptional performance for a wide range of digital signal processing and embedded system applications. This versatile FPGA combines high logic density with cost-effective implementation, making it an ideal choice for engineers developing sophisticated electronic systems.

Product Specifications

Core Architecture

The XC3S1200E-4FT256I features a robust architecture built on advanced 90nm process technology, delivering optimal power efficiency and performance. This FPGA incorporates 1,200,000 system gates with 8,672 logic cells, providing ample resources for complex digital designs.

Key Technical Features

  • Logic Elements: 8,672 logic cells with distributed RAM capability
  • Block RAM: 504 Kbits of dedicated block RAM for data storage
  • Digital Clock Managers (DCMs): 8 DCMs for advanced clock management
  • Maximum User I/O: 190 user I/O pins for flexible connectivity
  • Package Type: FT256 – 256-pin Fine-Pitch Ball Grid Array (FBGA)
  • Speed Grade: -4 (fastest speed grade available)
  • Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)

Performance Characteristics

The XC3S1200E-4FT256I delivers exceptional performance with its -4 speed grade, ensuring minimal propagation delays and maximum operating frequencies. The industrial temperature range qualification makes this FPGA suitable for demanding applications in harsh environments.

Pricing Information

The XC3S1200E-4FT256I is competitively priced within the Spartan-3E family, offering excellent value for its feature set. Pricing varies based on:

  • Volume Requirements: Bulk pricing available for production quantities
  • Distribution Channel: Authorized distributors offer competitive rates
  • Regional Availability: Pricing may vary by geographic location
  • Market Conditions: Subject to semiconductor market fluctuations

For current pricing and availability of the XC3S1200E-4FT256I, contact authorized Xilinx distributors or electronic component suppliers.

Documents & Media

Technical Documentation

Essential documentation for the XC3S1200E-4FT256I includes:

  • Product Data Sheet: Comprehensive electrical and timing specifications
  • User Guide: Detailed implementation guidelines and best practices
  • Package Information: Mechanical drawings and pin-out diagrams
  • Migration Guide: Instructions for upgrading from previous FPGA families
  • Application Notes: Design examples and optimization techniques

Development Tools

The XC3S1200E-4FT256I is fully supported by Xilinx development tools:

  • ISE Design Suite: Complete design environment for FPGA development
  • ChipScope Pro: Advanced debugging and verification tools
  • CORE Generator: Pre-verified IP cores for rapid development

Related Resources

Compatible Development Boards

Several development platforms support the XC3S1200E-4FT256I:

  • Spartan-3E Starter Kit: Ideal for prototyping and evaluation
  • Custom Development Boards: Third-party solutions for specific applications
  • Evaluation Modules: Targeted solutions for specific market segments

Design Resources

Engineers working with the XC3S1200E-4FT256I can access:

  • Reference Designs: Proven implementations for common applications
  • IP Cores: Pre-verified intellectual property for rapid development
  • Community Forums: Technical support and design discussions
  • Training Materials: Educational resources and certification programs

Application Areas

The XC3S1200E-4FT256I excels in various applications:

  • Digital Signal Processing: High-performance signal processing applications
  • Communications: Protocol processing and data packet manipulation
  • Industrial Control: Real-time control systems and automation
  • Medical Electronics: Precision instrumentation and diagnostic equipment
  • Test and Measurement: Advanced measurement and analysis systems

Environmental & Export Classifications

Environmental Compliance

The XC3S1200E-4FT256I meets stringent environmental standards:

  • RoHS Compliant: Lead-free manufacturing process
  • REACH Regulation: Compliance with European chemical safety standards
  • Conflict Minerals: Responsibly sourced materials certification
  • ISO 14001: Environmental management system compliance

Operating Conditions

  • Operating Temperature Range: -40ยฐC to +100ยฐC (Industrial grade)
  • Storage Temperature: -65ยฐC to +150ยฐC
  • Relative Humidity: 10% to 90% non-condensing
  • Altitude: Up to 2000 meters above sea level

Export Classifications

The XC3S1200E-4FT256I is subject to export control regulations:

  • ECCN Classification: Export Control Classification Number as designated
  • Country Restrictions: Compliance with international trade regulations
  • End-Use Monitoring: Adherence to export administration regulations
  • Documentation Requirements: Proper export licensing when applicable

Quality Standards

Manufacturing quality assurance includes:

  • ISO 9001: Quality management system certification
  • Automotive Standards: AEC-Q100 qualification for automotive applications
  • Reliability Testing: Extended temperature and stress testing
  • Statistical Quality Control: Comprehensive manufacturing process monitoring

The XC3S1200E-4FT256I represents an excellent choice for engineers seeking a high-performance, cost-effective FPGA solution. Its combination of advanced features, industrial-grade reliability, and comprehensive development support makes it suitable for a wide range of demanding applications across multiple industries.