The XC3S1200E-4FGG400I is a powerful field-programmable gate array (FPGA) from Xilinx’s proven Spartan-3E family, designed to deliver exceptional performance for cost-sensitive applications. This advanced programmable logic device combines high functionality with energy efficiency, making it an ideal choice for digital signal processing, embedded processing, and complex logic implementation.
Product Specifications
The XC3S1200E-4FGG400I features robust technical specifications that make it suitable for demanding applications:
Core Architecture:
- Logic Cells: 1,200,000 system gates
- Configurable Logic Blocks (CLBs): 8,672 logic cells
- Distributed RAM: 166 Kb
- Block RAM: 504 Kb total memory
- Dedicated Multipliers: 28 embedded 18×18 multipliers
I/O and Package Details:
- Package Type: 400-pin Fine-Pitch Ball Grid Array (FBGA)
- User I/O Pins: 304 single-ended I/O
- Speed Grade: -4 (high performance)
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
Performance Characteristics:
- Maximum frequency: Up to 326 MHz
- Power consumption: Optimized for low-power applications
- Configuration time: Fast startup capabilities
- Support for multiple I/O standards including LVDS, SSTL, and HSTL
The XC3S1200E-4FGG400I incorporates advanced clock management with up to 8 Digital Clock Managers (DCMs) for precise timing control and clock distribution throughout your design.
Price Information
Pricing for the XC3S1200E-4FGG400I varies based on quantity, supplier, and current market conditions. The device is positioned as a cost-effective solution in the high-capacity FPGA segment, offering excellent price-to-performance ratio for volume applications.
For current pricing and availability of the XC3S1200E-4FGG400I, contact authorized Xilinx distributors or electronic component suppliers. Bulk pricing discounts are typically available for production quantities, making this FPGA an economical choice for commercial deployments.
Documents & Media
Essential documentation and resources for the XC3S1200E-4FGG400I include:
Technical Documentation:
- Complete datasheet with electrical specifications and timing parameters
- Spartan-3E FPGA Family User Guide covering architecture details
- Package and pinout information for the 400-pin FBGA
- PCB design guidelines and layout recommendations
- Power estimation and thermal management guidelines
Design Tools and Software:
- ISE Design Suite compatibility for synthesis and implementation
- Reference designs and application notes
- Simulation models and timing files
- Configuration and programming utilities
Application Resources:
- Development board schematics and layouts
- Sample VHDL and Verilog code examples
- IP core integration guides
- System-level design methodologies
Related Resources
The XC3S1200E-4FGG400I integrates seamlessly with Xilinx’s comprehensive ecosystem of development tools and IP cores:
Development Platforms:
- Spartan-3E Starter Kit for rapid prototyping
- Third-party development boards featuring the XC3S1200E-4FGG400I
- Custom evaluation modules and reference designs
Compatible IP Cores:
- MicroBlaze soft processor for embedded applications
- DSP cores for signal processing implementations
- Communication protocol stacks including Ethernet and USB
- Memory controllers and interface IP
Design Software:
- Xilinx ISE Design Suite for complete design flow
- ChipScope Pro for in-system debugging
- PlanAhead for design planning and analysis
- EDK (Embedded Development Kit) for processor-based designs
Learning Resources:
- Online tutorials and training materials
- University program resources and courseware
- Technical support forums and knowledge base
- Webinars and technical seminars
Environmental & Export Classifications
The XC3S1200E-4FGG400I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant lead-free package
- REACH regulation compliance
- Conflict minerals reporting compliance
- Environmental management system certifications
Export Control Classifications:
- Export Control Classification Number (ECCN) designation
- International traffic in Arms Regulations (ITAR) status
- Bureau of Industry and Security (BIS) compliance
- Country-specific export licensing requirements
Quality and Reliability:
- Automotive-grade temperature range option
- Extended lifecycle support availability
- Quality management system certifications
- Comprehensive reliability testing and qualification
Package and Handling:
- Moisture sensitivity level classification
- Electrostatic discharge (ESD) protection requirements
- Storage and handling recommendations
- Thermal cycling and stress test results
The XC3S1200E-4FGG400I represents an excellent choice for engineers seeking a high-performance, cost-effective FPGA solution with comprehensive development support and long-term availability. Its combination of advanced features, robust specifications, and extensive ecosystem support makes it ideal for a wide range of applications from industrial automation to telecommunications infrastructure.
