The XC3S100E-5TQ144C is a versatile and cost-effective FPGA (Field-Programmable Gate Array) from Xilinx’s proven Spartan-3E family. This programmable logic device delivers exceptional performance for embedded applications, making it an ideal choice for engineers developing digital signal processing, communications, and control systems.
Product Specification
Core Features of XC3S100E-5TQ144C
The XC3S100E-5TQ144C offers robust capabilities in a compact form factor:
Logic Resources:
- 100,000 system gates
- 2,160 logic cells
- 4 dedicated multipliers (18×18-bit)
- 72 Kbits of block RAM
- 108 user I/O pins
Performance Specifications:
- Speed grade: -5 (fastest available for this device)
- Operating frequency up to 320 MHz
- Low power consumption design
- 1.2V core voltage operation
Package Details:
- Package type: TQFP (Thin Quad Flat Package)
- Pin count: 144 pins
- Package size: 20mm x 20mm
- Lead pitch: 0.5mm
- RoHS compliant
Memory Architecture: The XC3S100E-5TQ144C integrates distributed RAM and block RAM resources, providing flexible memory options for data buffering, lookup tables, and temporary storage requirements.
Price
The XC3S100E-5TQ144C offers excellent value proposition in the mid-range FPGA market. Pricing varies based on quantity and supplier:
Typical Price Range:
- Single unit: $15-25 USD
- Volume pricing (100+ units): $8-15 USD
- Engineering samples: Available upon request
Cost Considerations:
- Competitive pricing compared to similar capacity FPGAs
- Lower total system cost due to integrated features
- Reduced external component requirements
Note: Prices are subject to market fluctuations and supplier availability. Contact authorized distributors for current pricing and volume discounts.
Documents & Media
Technical Documentation for XC3S100E-5TQ144C
Data Sheets:
- Spartan-3E FPGA Family Complete Data Sheet
- XC3S100E device-specific specifications
- DC and switching characteristics
- Package thermal specifications
User Guides:
- Spartan-3E FPGA User Guide
- Configuration and programming guide
- Pin assignment and I/O standards reference
- Clock management and timing analysis
Application Notes:
- Power management best practices
- PCB design guidelines for TQFP144 package
- Signal integrity considerations
- Thermal management recommendations
Development Tools:
- ISE Design Suite compatibility information
- Vivado Design Suite migration guide
- IP core compatibility matrix
- Reference design examples
Related Resources
Development Support for XC3S100E-5TQ144C
Development Boards:
- Spartan-3E Starter Kit
- Third-party evaluation boards
- Custom carrier board designs
- Breadboard-compatible modules
Software Tools:
- Xilinx ISE WebPACK (free version)
- ModelSim simulation software
- ChipScope Pro analyzer
- Platform Studio for embedded development
IP Cores and Libraries:
- MicroBlaze soft processor support
- DSP IP cores for signal processing
- Communication protocol stacks
- Memory controller IP
Design Resources:
- Reference designs and tutorials
- Community forums and support
- Training materials and workshops
- Technical support documentation
Compatible Components:
- Configuration memory devices
- Power management ICs
- Clock generation circuits
- Level shifters and I/O expanders
Environmental & Export Classifications
Compliance and Environmental Standards
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC
- Junction temperature: up to +85ยฐC
- Humidity: 10% to 85% non-condensing
- Altitude: up to 2000 meters
Environmental Compliance:
- RoHS compliant (lead-free)
- REACH regulation compliant
- Conflict minerals reporting available
- Green package marking
Quality Standards:
- ISO 9001:2015 certified manufacturing
- Automotive quality (AEC-Q100) available for select grades
- Military temperature range options available
- Extended reliability testing data
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of origin: Various (check specific lot)
- No export license required for most destinations
Packaging and Handling:
- Moisture sensitivity level: MSL 3
- Storage temperature: -65ยฐC to +150ยฐC
- ESD sensitive device (Class 1)
- Tape and reel packaging available
The XC3S100E-5TQ144C represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based designs. Its comprehensive development ecosystem and proven reliability make it a preferred choice for both prototype development and volume production applications.
