The XC3S100E-5CP132I is a high-performance field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3E family. This versatile FPGA delivers exceptional value for cost-sensitive applications while maintaining robust functionality for digital signal processing, embedded processing, and general-purpose logic implementations.
Product Specifications
The XC3S100E-5CP132I features a comprehensive set of specifications designed for demanding applications:
Core Architecture:
- Logic cells: 2,160 equivalent gates
- System gates: 100,000
- CLB array: 22 x 16 configurable logic blocks
- Total CLBs: 240
- Slices: 960 (4 LUTs per slice)
- Flip-flops: 1,920
Memory Resources:
- Block RAM: 72 Kbits total
- Block RAM blocks: 4 (18 Kbit each)
- Distributed RAM: 15 Kbits
I/O and Connectivity:
- User I/O pins: 83
- Package type: CP132 (132-pin Chip Scale Package)
- I/O standards support: LVTTL, LVCMOS, SSTL, HSTL
- Differential I/O pairs: 36
Performance Characteristics:
- Speed grade: -5 (commercial temperature range)
- Operating temperature: 0ยฐC to +85ยฐC
- Supply voltage: 1.2V core, 2.5V/3.3V I/O
- Maximum frequency: Up to 250 MHz (speed grade dependent)
Special Features:
- Digital Clock Manager (DCM): 2 DCMs
- Multipliers: 4 dedicated 18×18 multipliers
- JTAG boundary scan support
- IEEE 1149.1 compliant
- Configuration memory: SRAM-based
Pricing Information
The XC3S100E-5CP132I offers competitive pricing in the FPGA market segment. Pricing varies based on order quantity, distribution channel, and current market conditions. For accurate and current pricing information on the XC3S100E-5CP132I, please contact authorized Xilinx distributors or visit official pricing portals. Volume discounts are typically available for quantities exceeding 100 units, with additional savings for annual purchase commitments.
Documents & Media
Comprehensive documentation supports the XC3S100E-5CP132I implementation:
Technical Documentation:
- Spartan-3E FPGA Data Sheet (DS312)
- XC3S100E-5CP132I Package specifications
- Pin-out diagrams and ball map
- DC and switching characteristics
- Configuration user guide
Design Resources:
- ISE Design Suite compatibility guide
- Constraint files (.ucf) for CP132 package
- Reference designs and application notes
- Power estimation spreadsheets
- Thermal management guidelines
Software Tools:
- Xilinx ISE WebPACK (free design software)
- ChipScope Pro analyzer support
- ModelSim simulation compatibility
- Third-party tool integration guides
Related Resources
The XC3S100E-5CP132I ecosystem includes extensive supporting resources:
Development Platforms:
- Spartan-3E Starter Kit compatibility
- Third-party development boards
- Evaluation modules and reference designs
Companion Products:
- Configuration PROMs (XCF series)
- Power management solutions
- Clock generation circuits
- Level translation devices
Design Communities:
- Xilinx user forums and support
- Application notes library
- Video tutorials and webinars
- University program resources
Alternative Devices:
- XC3S50E-5CP132I (smaller capacity)
- XC3S200E-5CP132I (higher capacity)
- XC3S100E-4CP132I (different speed grade)
Environmental & Export Classifications
The XC3S100E-5CP132I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free)
- REACH regulation compliant
- Green package designation
- Halogen-free materials
- MSL (Moisture Sensitivity Level): Level 3
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC
- Extended temperature options available
- Humidity tolerance: 85% RH non-condensing
- Altitude rating: Up to 2,000 meters
Export Classifications:
- ECCN (Export Control Classification Number): EAR99
- Country of origin restrictions apply
- No export license required for most destinations
- Dual-use technology considerations
Quality Standards:
- ISO 9001 manufacturing certification
- Automotive quality grade options (AEC-Q100)
- Industrial temperature grade available
- Extended lifecycle support program
The XC3S100E-5CP132I represents an ideal balance of performance, cost-effectiveness, and reliability for FPGA-based designs. Its comprehensive feature set, robust documentation, and extensive ecosystem support make it an excellent choice for engineers developing next-generation electronic systems.
