Product Specifications
The XC3S100E-4TQG144C is a versatile field-programmable gate array (FPGA) from Xilinx’s Spartan-3E family, engineered for cost-effective digital signal processing and embedded control applications. This FPGA delivers robust performance in a compact 144-pin TQFP package, making it ideal for space-constrained designs.
Key Technical Specifications:
- Logic Cells: 100,000 system gates equivalent
- Package Type: 144-pin Thin Quad Flat Pack (TQFP)
- Speed Grade: -4 (industrial temperature range)
- Operating Temperature: -40ยฐC to +100ยฐC
- Supply Voltage: 1.2V core, 3.3V I/O
- Clock Management: Up to 4 Digital Clock Managers (DCMs)
- Memory: 180 Kbits of block RAM
- Multipliers: 4 dedicated 18×18 multipliers
- I/O Pins: Up to 108 user I/O pins
The XC3S100E-4TQG144C features advanced architecture with distributed RAM, shift register capabilities, and flexible I/O standards support including LVDS, SSTL, and HSTL.
Price
The XC3S100E-4TQG144C is competitively priced for volume applications, with costs varying based on order quantity and supplier. Typical pricing ranges from $15-25 per unit in moderate quantities, with significant volume discounts available for orders exceeding 1,000 pieces. For current pricing and availability, contact authorized Xilinx distributors or electronic component suppliers.
Pricing Factors:
- Order quantity and volume breaks
- Lead time requirements
- Packaging options (tape and reel vs. tray)
- Market conditions and semiconductor availability
Documents & Media
Essential Documentation:
- Datasheet: Complete electrical specifications and pin configurations for the XC3S100E-4TQG144C
- User Guide: Spartan-3E FPGA Family Complete Data Sheet with design guidelines
- Package Information: Mechanical drawings and thermal characteristics for the 144-pin TQFP package
- Design Files: Reference designs and example projects
- Application Notes: Power management, signal integrity, and PCB layout recommendations
Development Tools:
- Xilinx ISE Design Suite compatibility
- Vivado Design Suite support (legacy)
- Hardware debugging capabilities with ChipScope Pro
Technical Resources:
- Pin assignment tables and I/O planning worksheets
- Timing analysis guidelines and constraint examples
- Configuration and programming documentation
Related Resources
Development Boards and Evaluation Kits:
- Spartan-3E Starter Kit featuring the XC3S100E-4TQG144C
- Third-party development boards with onboard programming interfaces
- Breadboard-friendly breakout modules
Compatible IP Cores:
- Xilinx LogiCORE IP portfolio including DSP functions
- Processor cores (MicroBlaze soft processor)
- Communication interfaces (UART, SPI, I2C)
- Memory controllers and interface IP
Design Support:
- Reference clock circuits and power supply designs
- PCB layout guidelines for optimal signal integrity
- Thermal management solutions for industrial applications
- Configuration memory options (SPI Flash, PROM)
Alternative Devices:
- XC3S50E-4TQG144C (lower logic density)
- XC3S200E-4TQG144C (higher logic capacity)
- Pin-compatible variants in different speed grades
Environmental & Export Classifications
Environmental Compliance: The XC3S100E-4TQG144C meets stringent environmental standards for industrial and commercial applications:
- RoHS Compliant: Lead-free construction meeting EU RoHS directive requirements
- REACH Regulation: Compliant with European chemical safety standards
- Conflict Minerals: Responsibly sourced materials certification
Operating Conditions:
- Temperature Range: -40ยฐC to +100ยฐC junction temperature
- Humidity: Non-condensing environments
- Shock and Vibration: Meets JEDEC standards for handling and operation
Export Classification:
- ECCN: Export Control Classification Number as per US Department of Commerce
- HTS Code: Harmonized Tariff Schedule classification for international shipping
- Country of Origin: Manufacturing location and assembly information
Quality Standards:
- ISO 9001:2015 manufacturing quality management
- Automotive qualification available (AEC-Q100)
- Military and aerospace screening options
Packaging and Handling:
- Moisture sensitivity level (MSL) rating for storage requirements
- ESD protection guidelines for handling and assembly
- Tape and reel packaging for automated assembly processes
The XC3S100E-4TQG144C provides designers with a reliable, cost-effective FPGA solution backed by comprehensive documentation, development tools, and technical support for successful project implementation.
