Product Specifications
The XC3S1000L-4FTG256I is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-3L family, specifically engineered for low-power applications. This advanced programmable logic device delivers exceptional functionality and performance while maintaining optimal power efficiency for cost-sensitive consumer electronics and embedded applications.
Key Technical Specifications
- FPGA Family: Xilinx Spartan-3L Low Power
- System Gates: 1,000,000 (1M Gates)
- Logic Cells: 17,280 configurable logic cells
- Total RAM: 442,368 bits of on-chip memory
- Package Type: 256-pin FTBGA (Fine-Pitch Ball Grid Array)
- Package Size: 17mm x 17mm compact footprint
- Operating Voltage: 1.2V core voltage
- Process Technology: Advanced 90nm technology
- Speed Grade: -4 (Industrial grade performance)
- Temperature Range: Industrial (-40°C to +100°C)
- Maximum Operating Frequency: Up to 630MHz
- I/O Count: 173 user I/O pins
- Compliance: RoHS compliant and lead-free
Advanced Features
The XC3S1000L-4FTG256I incorporates numerous enhancements derived from Xilinx’s proven Virtex-II platform technology, including:
- Enhanced clock management functions for superior timing performance
- Abundant on-chip memory resources for data-intensive applications
- Advanced I/O capabilities with flexible configuration options
- Low-power design optimized for battery-powered and energy-efficient systems
- Field-programmable architecture enabling design upgrades without hardware replacement
Price Information
Current Market Pricing:
- XC3S1000L-4FTG256I: Contact authorized distributors for current pricing
- Related Models:
- XC3S1000-4FTG256I: $56.08+ (1+ units)
- XC3S1000-4FTG256C: $17.50+ (1+ units)
Pricing varies by distributor, quantity, and market conditions. Contact authorized Xilinx distributors for the most current pricing and availability information.
Documents & Media
Technical Documentation
- Official Datasheet: Available through AMD/Xilinx Technical Information Portal
- Product Brief: Spartan-3L Low Power FPGA overview
- User Guide: Complete implementation and configuration guide
- Application Notes: Design best practices and implementation examples
- PCB Design Guidelines: Layout recommendations for optimal performance
Development Resources
- Vivado Design Suite: Primary development environment
- ISE Design Tools: Legacy support for existing designs
- IP Core Library: Pre-verified intellectual property blocks
- Reference Designs: Sample projects and implementation examples
CAD Models
- ECAD Models: Available for major PCB design tools
- 3D Models: Mechanical CAD files for system integration
- Footprint Libraries: Verified PCB footprints for accurate layout
Related Resources
Compatible Development Boards
- Spartan-3L starter kits and evaluation boards
- Custom development platforms supporting 256-pin FTBGA packages
- Third-party evaluation and prototyping boards
Design Tools & Software
- Vivado Design Suite: Advanced synthesis, implementation, and debugging
- ModelSim: HDL simulation and verification
- ChipScope Pro: On-chip debugging and analysis
- Platform Studio: Embedded system development environment
Alternative & Equivalent Parts
- XC3S1000L-4FTG256C: Commercial temperature grade variant
- XC3S1000-4FTG256I: Standard Spartan-3 (non-low-power) equivalent
- XC3S1500L-4FTG456I: Higher capacity option within Spartan-3L family
- XC3S700L-4FTG256I: Lower capacity alternative
Application Areas
- Consumer Electronics: Set-top boxes, digital cameras, portable devices
- Industrial Automation: Motor drives, control systems, data acquisition
- Communications: Wireless infrastructure, protocol processing
- Medical Devices: Portable diagnostic equipment, patient monitoring
- Automotive Electronics: Infotainment systems, driver assistance
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets European Union Restriction of Hazardous Substances directive
- Lead-Free: Pb-free package and assembly process
- REACH Compliant: Complies with EU chemical safety regulations
- Conflict Minerals: Sourced from conflict-free supply chains
Quality Standards
- ISO 9001: Manufactured under certified quality management systems
- IPC Standards: Meets industry packaging and reliability standards
- JEDEC Qualified: Passes standard semiconductor reliability testing
- MSL Rating: Moisture Sensitivity Level classification for proper handling
Export Control Information
- ECCN Classification: Export control classification number as per US regulations
- Country of Origin: Manufactured in certified facilities
- Export License: Check current export regulations for destination countries
- Restricted Destinations: Verify compliance with current trade restrictions
Operating Environment
- Storage Temperature: -65°C to +150°C
- Operating Humidity: 5% to 95% non-condensing
- Shock Resistance: Meets JEDEC standards for mechanical stress
- ESD Protection: Built-in electrostatic discharge protection
The XC3S1000L-4FTG256I represents Xilinx’s commitment to delivering high-performance, low-power FPGA solutions for demanding applications. Its combination of advanced features, compact packaging, and proven reliability makes it an ideal choice for next-generation embedded systems and consumer electronics.
