1. Product Specifications
Core Architecture & Performance
- Device Family: XC3100A Series FPGA (Ultra-High Speed)
- Gate Complexity: 7,500 maximum logic gates (6,500-7,500 typical range)
- Configurable Logic Blocks (CLBs): 484 CLBs in 22 x 22 array configuration
- Speed Grade: -3 (Ultra-High Performance – 270 MHz maximum flip-flop toggle rate)
- Logic Delay: 2.1 ns typical combinatorial delay (CLB input to output)
- Sequential Timing: 2.1 ns clock-to-output delay
- System Clock Rates: Up to 85 MHz operational frequency
Maximum I/O Capability
- Package Type: PQ208C (208-pin Plastic Quad Flat Pack – Commercial)
- Available I/O Pins: 144+ user-configurable I/O pins (maximum for XC3195A)
- I/O Standards: TTL/CMOS compatible with programmable thresholds
- Drive Capability: 8mA sink/source current per output
- 3-State Support: Internal tri-state buffers for bus applications
- Slew Rate Control: Programmable output transition speed
Package & Physical Characteristics
- Package Dimensions: 28mm x 28mm x 3.4mm nominal
- Lead Pitch: 0.5mm (0.0197″) quad flat pack configuration
- Pin Count: 208 pins total with maximum user I/O utilization
- Body Style: Plastic quad flat pack for cost-effective high-density mounting
- Coplanarity: ยฑ0.08mm for reliable surface mount assembly
- Package Weight: Approximately 2.5 grams
Electrical Specifications
- Operating Voltage: 5V ยฑ5% (4.75V – 5.25V)
- Temperature Range: Commercial (0ยฐC to +85ยฐC junction temperature)
- Power Consumption: Dynamic scaling with utilization
- Static Current: 8mA typical (CMOS threshold mode)
- Technology Node: Advanced CMOS static memory process
- Flip-Flops: 1,320 internal storage elements
Advanced Features
- Ultra-High Speed Performance: 270MHz guaranteed toggle rates
- Enhanced Interconnect: Additional routing resources for complex designs
- Bitstream Error Checking: Built-in configuration verification
- Soft Startup: Controlled output activation prevents system noise
- Unlimited Reprogrammability: SRAM-based configuration memory
- Crystal Oscillator Support: On-chip amplifier with frequency division
2. Price Information
Current Market Pricing (USD):
- Single Unit (1 piece): $125.00 – $225.00
- Low Volume (2-9 pieces): $95.00 – $175.00 per unit
- Medium Volume (10-49 pieces): $75.00 – $135.00 per unit
- High Volume (50-199 pieces): $55.00 – $95.00 per unit
- Large Volume (200+ pieces): Contact for volume discounts
Price Considerations:
- Premium pricing for highest-performance (-3) speed grade
- 208-pin package commands premium over lower pin count alternatives
- Legacy/obsolete status creates supply constraints
- Available stock: 1,100+ pieces reported from select distributors
Market Factors:
- End-of-life product with specialized sourcing required
- High-performance grade maintains strong demand
- Maximum I/O density justifies premium pricing
- Authentic Xilinx parts command significant premiums over alternatives
Cost Analysis:
- Higher initial cost offset by maximum functionality per device
- Reduced board space requirements versus multiple lower-density devices
- Long-term availability programs available through authorized channels
- Consider migration to current-generation FPGAs for new designs
3. Documents & Media
Primary Technical Documentation
- Master Datasheet: XC3000 Series Field Programmable Gate Arrays (Version 3.1)
- Speed Grade Specifications: -3 grade timing characteristics and performance data
- Package Documentation: PQ208 mechanical drawings and assembly guidelines
- Pinout Reference: Complete 208-pin assignment with signal descriptions
- Electrical Characteristics: DC/AC parameters and switching specifications
Design Resources & Tools
- XACT Development Suite: Complete design flow from entry to bitstream generation
- Timing Analysis Tools: Critical path analysis and timing verification utilities
- Place & Route Documentation: Optimization techniques for high-utilization designs
- Configuration Guide: Programming modes and in-system configuration procedures
- Migration Documentation: Upgrade paths to current Xilinx FPGA families
Application Documentation
- High-Speed Design Guidelines: PCB layout recommendations for 270MHz operation
- Power Distribution Design: Supply decoupling and noise reduction techniques
- Thermal Management: Heat dissipation strategies for high-performance operation
- Signal Integrity Guidelines: Managing high-speed signals in dense I/O environments
- EMI/RFI Considerations: Electromagnetic compatibility design practices
Visual & CAD Resources
- 3D Package Models: STEP files for mechanical design verification
- PCB Footprint Libraries: Verified land patterns for major EDA platforms
- High-Resolution Images: Professional product photography for documentation
- Block Diagrams: Internal architecture illustrations showing CLB and routing
- Application Schematics: Reference designs for typical implementation scenarios
Simulation Models
- SPICE Models: Accurate electrical models for analog simulation
- IBIS Models: I/O buffer models for signal integrity analysis
- Timing Models: Gate-level simulation models with back-annotation support
- Power Models: Dynamic power consumption estimation tools
4. Related Resources
Development Environment
- Xilinx XACT Suite: Primary development toolchain with full feature support
- Third-Party Integration: Viewlogic, Cadence, Mentor Graphics compatibility
- Simulation Tools: Comprehensive logic and timing simulation capabilities
- In-Circuit Verification: Real-time debugging and signal analysis tools
- Performance Analysis: Timing calculator and optimization utilities
Companion Components
- Configuration Memory: XC17XX series Serial Configuration PROMs
- Clock Management: High-frequency crystal oscillators and clock distribution ICs
- Power Management: Low-noise 5V regulators with fast transient response
- Signal Conditioning: Level translators and impedance matching components
- ESD Protection: TVS diodes and protection circuits for high-pin-count devices
Application Areas
- High-Speed Communications: Protocol processors and interface controllers
- Data Acquisition Systems: Multi-channel ADC/DAC interface and processing
- Signal Processing: Real-time DSP applications and filter implementations
- Test & Measurement: Custom instrumentation requiring maximum I/O
- High-Performance Computing: Specialized coprocessors and accelerators
Performance Alternatives
- XC3195A-2PQ208C: Even higher speed (-2 grade, 323MHz) variant
- XC3195A-4PQ208C: Lower speed (-4 grade, 227MHz) cost-optimized version
- XC3190A-3PQ208C: Lower gate count (6K gates) with same I/O capability
- Current Alternatives: Modern Xilinx Spartan/Artix families for new designs
Package Variants
- XC3195A-3PQ160C: 160-pin PQFP with reduced I/O count
- XC3195A-3PG175C: 175-pin CPGA ceramic package for harsh environments
- XC3195A-3PP175C: 175-pin PPGA plastic pin grid array
- XC3195A-3TQ176C: 176-pin TQFP thin quad flat pack
5. Environmental & Export Classifications
Operating Environment
- Temperature Range: Commercial Grade (0ยฐC to +85ยฐC junction)
- Storage Temperature: -65ยฐC to +150ยฐC ambient
- Relative Humidity: 5% to 95% non-condensing
- Operating Altitude: Sea level to 3,000 meters
- Vibration Resistance: MIL-STD-883 Class C compliance
Thermal Characteristics
- Thermal Resistance: ฮธJA = 25ยฐC/W (still air), ฮธJC = 12ยฐC/W (case)
- Maximum Junction Temperature: +150ยฐC absolute maximum
- Power Dissipation: Varies with utilization and switching frequency
- Thermal Design: Consider heat spreading for high-performance applications
- Airflow Requirements: Natural convection adequate for typical applications
Environmental Compliance
- RoHS Status: Pre-RoHS product (manufactured before 2006 directive)
- Lead Content: Contains lead in package materials and solder
- REACH Compliance: Pre-REACH product, substance information available on request
- Conflict Minerals: Manufactured prior to conflict minerals regulations
- WEEE Directive: Subject to European electronic waste disposal requirements
Quality & Reliability
- Quality Standard: MIL-STD-883 Class B equivalent testing and screening
- MTBF Rating: >750,000 hours at 25ยฐC ambient temperature
- ESD Sensitivity: Class 1B (1000V HBM), Class C2 (200V MM)
- Latch-up Immunity: >100mA per JEDEC JESD78A standards
- Package Integrity: Plastic QFP suitable for commercial applications
Export Control & Regulatory
- Export Classification: EAR99 under U.S. Export Administration Regulations
- Country of Origin: United States (Xilinx/AMD design and manufacturing)
- ECCN Status: Not subject to specific export control numbers
- Dual-Use Technology: Standard commercial programmable logic device
- Restricted Countries: Subject to current U.S. trade restrictions and sanctions
Packaging & Handling
- Moisture Sensitivity: MSL 3 (168 hours at 30ยฐC/60% RH after bag opening)
- ESD Precautions: Class 1 ESD sensitive device requiring proper handling
- Packaging Options: Anti-static tube, tape & reel, or tray packaging
- Baking Requirements: 125ยฐC for 24 hours if moisture exposure exceeded
- Storage Conditions: Sealed moisture barrier bag with desiccant
Shipping & Logistics
- Minimum Order Quantity: 1 piece (distributor dependent)
- Standard Lead Time: 4-12 weeks for standard quantities
- Express Availability: Some distributors offer expedited delivery
- Global Shipping: Worldwide distribution through authorized channels
- Documentation: Certificate of compliance and authenticity provided
Long-Term Availability
- Obsolescence Status: Discontinued product with limited remaining inventory
- Life Cycle Stage: End-of-life with aftermarket support only
- Last Time Buy: Final procurement opportunities through select distributors
- Design Migration: Xilinx provides tools for upgrading to current devices
- Legacy Support: Technical documentation archived for long-term reference
Why Choose XC3195A-3PQ208C?
The XC3195A-3PQ208C delivers the ultimate combination of speed and I/O density from Xilinx’s proven XC3100A family. With 270MHz performance and maximum I/O capability in a 208-pin package, this device is ideal for applications requiring both high computational performance and extensive interface connectivity. The commercial temperature range and established reliability make it suitable for demanding applications where both speed and I/O count are critical requirements.
For technical consultation, current availability, or application support, contact authorized Xilinx distributors or specialized legacy component suppliers.
