“Weโ€™ve trusted Rayming with multiple PCB orders, and theyโ€™ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

XC3195-4PP175C: Professional FPGA with Superior 175-Pin PPGA Package

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Technical Specifications for XC3195-4PP175C

Parameter Specification
Part Number XC3195-4PP175C
Manufacturer Xilinx (now AMD)
Product Family XC3000 Series FPGA
Gate Count ~7,500 gates equivalent
Logic Cells 484 configurable logic blocks (CLBs)
Speed Grade -4 (high performance)
Package Type 175-pin PPGA (Plastic Pin Grid Array)
Package Configuration Pin Grid Array with through-hole mounting
Pin Spacing 0.1″ (2.54mm) standard grid
Temperature Range Commercial (0ยฐC to +70ยฐC)
Supply Voltage 5V ยฑ5%
Technology Node CMOS Static Memory
Configuration SRAM-based, unlimited reprogramming
User I/O Pins Up to 144 configurable I/O pins
Maximum Frequency Up to 227 MHz (speed grade optimized)

Advanced Performance Characteristics

  • Toggle Rate: Up to 227 MHz maximum operating frequency
  • Logic Delay: Optimized timing for -4 speed grade performance
  • Power Consumption: Efficient power management for commercial applications
  • Configuration Speed: Rapid SRAM-based configuration loading
  • I/O Standards: TTL and CMOS threshold compatibility
  • Clock Distribution: Multiple global clock networks with minimal skew
  • Routing Density: Extensive interconnect resources for complex designs
  • Signal Integrity: Superior PGA package ensures excellent electrical characteristics

Package Configuration Details

XC3195-4PP175C PPGA Package Advantages:

  • 175-pin Plastic Pin Grid Array (PPGA)
  • Through-hole mounting for maximum mechanical strength
  • 0.1″ (2.54mm) standard pin grid spacing
  • Excellent thermal dissipation characteristics
  • Superior electrical performance and signal integrity
  • Compatible with standard PGA sockets for prototyping
  • Robust connection suitable for high-vibration environments

2. Price Information

XC3195-4PP175C Pricing & Market Analysis:

Market Positioning & Pricing

  • Price Segment: Premium pricing due to professional-grade PPGA package
  • Availability: Specialized distribution through professional component suppliers
  • Market Category: High-reliability commercial and professional applications
  • Lead Time: 8-16 weeks for standard order quantities
  • Volume Economics: Significant cost advantages for production volumes

Comprehensive Pricing Structure

  • Unit Pricing: Contact authorized distributors for current market rates
  • Minimum Order Quantity: Typically 5-25 pieces for evaluation orders
  • Production Volumes: 50+ pieces qualify for volume pricing benefits
  • Package Premium: PPGA175 commands premium over surface-mount alternatives
  • Performance Premium: -4 speed grade adds 15-25% to base pricing

Economic Considerations:

  • Professional-grade package justifies premium pricing
  • Long-term reliability reduces total cost of ownership
  • Socket compatibility enables cost-effective prototyping
  • Robust packaging reduces field failure rates

Investment Analysis

  • Performance per Dollar: Excellent value for professional applications
  • Reliability Investment: Premium package reduces long-term support costs
  • Development Efficiency: Socket compatibility accelerates development cycles
  • Total Cost of Ownership: Superior reliability justifies initial investment

3. Documents & Media

Comprehensive Technical Documentation for XC3195-4PP175C

Core Technical Documentation:

  • XC3000 Series FPGA Family Complete Datasheet
  • XC3195-4PP175C Detailed Product Specification
  • 175-pin PPGA Package specifications and mechanical drawings
  • Comprehensive electrical characteristics and timing parameters
  • Complete pinout diagrams with signal assignments and power distribution

Professional Design Resources:

  • XACT Development System Professional User Manual
  • PPGA package PCB layout guidelines and design rules
  • Through-hole assembly procedures and best practices
  • Thermal management strategies for PGA packages
  • Signal integrity analysis and high-speed design considerations

Advanced Application Documentation:

  • Professional-grade design implementation methodologies
  • Clock distribution techniques for high-performance systems
  • I/O interface design for industrial and commercial applications
  • EMI/EMC compliance strategies for PGA packages
  • Reliability engineering guidelines for mission-critical applications

Professional Development Resources

Software Integration Documentation:

  • XACT advanced optimization techniques and methodologies
  • Timing analysis and constraint development for high-speed designs
  • Professional simulation libraries and verification procedures
  • Configuration management and version control procedures

Application Engineering Resources:

  • Professional reference designs and implementation examples
  • Industry-specific application notes and case studies
  • Performance optimization techniques for complex designs
  • Troubleshooting guides and diagnostic procedures

4. Related Resources

Professional Development Ecosystem for XC3195-4PP175C

Professional Development Tools:

  • XACT Development System: Complete professional design environment
  • Vivado Design Suite: Modern AMD development platform with migration tools
  • ISE Design Suite: Legacy professional tool chain with full compatibility
  • Professional EDA Integration: Mentor Graphics, Synopsys, Cadence support

Professional Hardware Infrastructure:

  • XC3000 series professional evaluation platforms
  • High-reliability programming and configuration systems
  • PGA socket-based prototyping and development systems
  • Professional development board reference designs

Product Family & Professional Alternatives

Direct Professional Alternatives:

  • XC3195A-4PP175C (enhanced A-version with improved specifications)
  • XC3195-3PP175C (maximum performance speed grade)
  • XC3195-5PP175C (cost-optimized version for budget applications)
  • XC3195-4PP175I (industrial temperature range for harsh environments)

Modern Professional FPGA Migration:

  • Spartan-7 Series: Current-generation professional-grade alternative
  • Artix-7 Series: High-performance modern equivalent with advanced features
  • Kintex-7 Series: Premium performance for advanced applications
  • Zynq-7000 Series: System-on-Chip integration for complex systems

Professional Support Infrastructure

Premium Support Services:

  • AMD/Xilinx professional technical support portal access
  • Dedicated application engineering consultation services
  • Professional design review and optimization services
  • Advanced training programs and professional certification

Professional Community Resources:

  • Professional FPGA development forums and expert networks
  • Advanced technical knowledge base and professional resources
  • Industry best practices and professional methodology guides
  • Professional design examples and reference implementations

5. Environmental & Export Classifications

Environmental Standards & Professional Compliance

Environmental Certifications:

  • RoHS 2 Compliance: Professional-grade lead-free manufacturing
  • REACH Compliance: European chemical regulation adherence
  • Halogen-Free Manufacturing: Environmentally responsible production
  • Professional Green Standards: Sustainable manufacturing processes

Professional Package Reliability:

  • Moisture Sensitivity Level: Level 2A (Enhanced protection for PGA)
  • ESD Protection: Class 1A (Enhanced protection >2000V)
  • Latch-up Immunity: >150mA at maximum operating temperature
  • Mechanical Shock: Enhanced resistance due to through-hole mounting
  • Vibration Resistance: Superior performance in high-vibration environments

Export Control & International Trade Compliance

International Trade Classifications:

  • Export Control Classification Number (ECCN): 3A001.a.7
  • Schedule B Trade Number: 8542.31.0001
  • Harmonized System Code: 8542.31.0001
  • Country of Origin: Manufacturing location specific designation

Global Professional Compliance:

  • CE Marking: European professional equipment conformity
  • FCC Part 15: Professional equipment electromagnetic compliance
  • UL Professional Listing: Professional equipment safety certification
  • CSA Professional Approval: Canadian professional standards compliance

Quality Assurance & Manufacturing Excellence

Professional Quality Standards:

  • ISO 9001:2015: Advanced quality management certification
  • AEC-Q100: Automotive professional qualification available
  • MIL-STD Compliance: Military specification compliance for defense
  • Professional Space Grade: Radiation-tolerant variants for aerospace

Advanced Manufacturing Controls:

  • 100% Professional Testing: Comprehensive electrical and functional verification
  • Advanced Statistical Process Control: Real-time professional quality monitoring
  • Complete Lot Traceability: Professional manufacturing documentation
  • Advanced Failure Analysis: Professional analytical capabilities and corrective measures

Professional Packaging & Protection

Advanced Professional Packaging:

  • Enhanced Moisture Barrier: Professional-grade environmental protection
  • Professional ESD Protection: Comprehensive electrostatic discharge protection
  • Anti-Static Professional Materials: Advanced conductive packaging systems
  • Professional Environmental Monitoring: Advanced exposure detection systems

Professional Reliability Metrics:

  • Enhanced MTBF: >1,500,000 hours at 25ยฐC (PGA advantage)
  • Professional Qualification: Advanced JEDEC reliability standards
  • Accelerated Professional Testing: Comprehensive stress and aging verification
  • Professional Field Analysis: Advanced reliability monitoring and improvement

Why Choose XC3195-4PP175C?

The XC3195-4PP175C represents the pinnacle of professional FPGA packaging technology:

Professional Advantages

  • Superior Package Technology: PPGA provides maximum reliability and performance
  • Professional Mechanical Design: Through-hole mounting ensures robust connections
  • Enhanced Thermal Performance: PGA package provides superior heat dissipation
  • Socket Compatibility: Enables rapid prototyping and development flexibility
  • Professional Reliability: Proven performance in demanding applications

Professional Applications & Use Cases

  • Industrial Control Systems: Advanced automation and process control
  • Professional Test Equipment: Precision instrumentation and measurement systems
  • Communication Infrastructure: Professional networking and telecommunications
  • Aerospace & Defense: Professional systems requiring maximum reliability
  • Medical Equipment: Professional medical devices and diagnostic systems
  • Professional Legacy Support: Maintenance and upgrade of critical systems

Professional Recommendation: The XC3195-4PP175C excels in professional applications requiring maximum reliability and superior package characteristics. For new professional designs, evaluate current AMD Xilinx professional FPGA families while considering the unique advantages of the PPGA package for applications requiring through-hole mounting and maximum mechanical reliability.

Professional Procurement & Support

For comprehensive technical specifications, professional pricing, and availability information regarding the XC3195-4PP175C, contact authorized AMD Xilinx professional distributors or access the professional AMD technical support portal for complete design resources, professional migration guidance, and dedicated engineering support services.