1. Product Specifications
Core Architecture
- Device Family: XC3000A Enhanced Series FPGA
- Logic Capacity: 3,000+ equivalent logic gates
- Package Type: PG175C (175-pin Ceramic Pin Grid Array)
- Speed Grade: -5 (High-performance grade)
- Operating Voltage: 5V ยฑ5% (tighter tolerance than standard series)
- Process Technology: Advanced CMOS with enhanced performance features
Performance Characteristics
- Maximum System Clock: Up to 80 MHz (design-dependent)
- Pin-to-Pin Delay: Optimized for high-speed applications
- Clock-to-Output Delay: Industry-leading timing performance
- Power Consumption: Enhanced power efficiency with dynamic management
- Operating Temperature: Commercial (0ยฐC to +70ยฐC)
- Junction Temperature: Up to +125ยฐC maximum
I/O and Package Features
- Total Package Pins: 175 pins
- Maximum User I/O: 144 user-configurable I/O pins
- I/O Standards: TTL, CMOS, and enhanced drive capabilities
- Output Drive Options: Multiple drive strength configurations
- Input Protection: Enhanced ESD protection circuitry
- Package Material: High-reliability ceramic construction
Enhanced Features (A-Series)
- Improved Routing Architecture: Enhanced interconnect for better performance
- Additional I/O Options: More flexible I/O banking and configuration
- Enhanced Timing: Improved setup and hold time characteristics
- Better Noise Immunity: Enhanced signal integrity features
2. Pricing Information
Market Pricing Overview:
- Current Unit Price: Contact authorized distributors for competitive pricing
- Minimum Order Quantity: Typically 10+ units for standard pricing
- Volume Pricing: Significant discounts available for orders over 50 units
- Extended Temperature Versions: Premium pricing for industrial/military grades
- Lead Time: 10-16 weeks (subject to semiconductor supply conditions)
Pricing Factors:
- Speed Grade Premium: -5 speed grade commands higher pricing than standard grades
- Package Type: PG175C ceramic package pricing reflects premium construction
- Market Availability: Legacy product pricing subject to allocation
Contact certified Xilinx distributors or sales representatives for current XC3190A-5PG175C pricing and availability information.
3. Documents & Media
Technical Documentation
- Complete Datasheet: XC3190A-5PG175C electrical specifications and AC/DC parameters
- Family User Guide: XC3000A Series comprehensive design and implementation guide
- Package Documentation: PG175C mechanical specifications and PCB footprint data
- Characterization Report: Performance data across temperature and voltage ranges
- Application Notes: Design optimization techniques specific to XC3190A devices
Design Support Materials
- Pin Assignment Guidelines: Optimal pin utilization strategies for PG175C package
- Timing Analysis Models: Accurate timing models for static timing analysis
- Power Estimation Tools: Power consumption calculation utilities
- Layout Guidelines: PCB design best practices for high-speed performance
- Signal Integrity Guidelines: Maintaining signal quality in high-speed designs
Software and Tools Documentation
- ISE Design Suite Compatibility: Tool version requirements and settings
- Constraint File Templates: Sample UCF files for common design patterns
- Simulation Models: Behavioral and timing simulation libraries
- Programming Guide: Device configuration and bitstream generation procedures
4. Related Resources
Development and Design Tools
- Xilinx ISE Design Suite: Primary development environment supporting XC3190A-5PG175C
- Xilinx CORE Generator: Pre-optimized IP cores and functions
- ModelSim Simulator: Advanced simulation and verification capabilities
- Timing Analyzer: Comprehensive timing analysis and optimization tools
- FPGA Editor: Low-level design editing and optimization environment
Hardware Development Resources
- XC3000A Evaluation Boards: Development platforms supporting PG175C socket
- Programming Hardware: Compatible download cables and programming adapters
- Socket Solutions: ZIF sockets and adapters for prototyping
- Oscilloscopes and Logic Analyzers: Recommended test equipment for validation
Related FPGA Devices
- XC3195A-5PG175C: Higher gate count alternative in same package
- XC3190A-4PG175C: Same device with -4 speed grade option
- XC3190A-5PC84C: Same core with different package option
- Modern Migration Path: Current Xilinx FPGA families for new designs
Technical Support and Training
- Xilinx Technical Support: Expert assistance for design challenges
- Online Documentation: Comprehensive technical library and knowledge base
- Training Courses: FPGA design methodology and tool training
- Community Forums: Peer support and design sharing platforms
- Application Engineering: Regional support for complex implementations
5. Environmental & Export Classifications
Environmental Compliance Standards
- RoHS Compliance: Fully compliant with RoHS 2011/65/EU directive restrictions
- REACH Compliance: Meets European Union REACH regulation requirements
- Conflict Minerals: Compliant with Dodd-Frank conflict minerals provisions
- Green Status: Qualified as environmentally preferred product
- Lead-Free: Compatible with lead-free assembly processes
Regulatory and Quality Standards
- UL Recognition: UL file number E29179 for safety compliance
- CSA Certification: Canadian Standards Association approved
- VDE Compliance: European safety standard compliance
- ISO 9001: Manufactured under ISO 9001 quality management system
- AS9100: Aerospace quality standard compliance where applicable
Export Control Classifications
- ECCN Classification: 3A001.a.2 (Export Control Classification Number)
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule classification)
- Country of Origin: Manufacturing location varies (USA/Asia)
- Export License: May require export license for certain destinations
- EAR Compliance: Subject to Export Administration Regulations
Handling and Storage Requirements
- ESD Classification: Class 1C (>1000V Human Body Model protection)
- MSL Rating: Moisture Sensitivity Level 3 (168 hours at 30ยฐC/60% RH)
- Storage Temperature: -65ยฐC to +150ยฐC non-operating
- Storage Humidity: <85% relative humidity, non-condensing
- Shelf Life: 24 months in original sealed packaging
- Anti-Static Handling: Required ESD precautions during handling and assembly
Reliability and Testing Standards
- JEDEC Standards: Compliant with JEDEC solid-state reliability standards
- Temperature Cycling: Tested per JEDEC JESD22-A104 standard
- Thermal Shock: Qualified per JEDEC JESD22-A106 requirements
- Accelerated Aging: Life testing per JEDEC JESD22-A108 protocol
- Qualification Level: Military-standard reliability testing available
Application Considerations
The XC3190A-5PG175C excels in applications requiring high I/O count and superior timing performance. Its ceramic PG175C package provides excellent thermal characteristics and signal integrity, making it particularly suitable for high-frequency applications and environments with demanding reliability requirements.
When designing with the XC3190A-5PG175C, consider the enhanced routing architecture and improved timing characteristics of the A-series. These features enable more efficient implementations and higher operating frequencies compared to standard XC3000 series devices.
Conclusion
The XC3190A-5PG175C represents an enhanced solution in Xilinx’s proven FPGA portfolio, offering improved performance and expanded I/O capabilities in a reliable ceramic package. While part of a mature product family, this device continues to serve applications where its specific combination of features, proven reliability, and extensive I/O count provide optimal solutions. Designers should evaluate both legacy support requirements and migration paths to current-generation devices when planning new implementations.
For technical specifications, current pricing, and availability of the XC3190A-5PG175C, please contact your regional Xilinx authorized distributor or field applications engineer.
