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XC3190A-3PQ208C – High-Performance Field Programmable Gate Array (FPGA)

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Core Architecture

  • Device Family: XC3100A Family Field Programmable Gate Array
  • Logic Capacity: 6,000 gates (typical range: 5,000-6,000 gates)
  • Configurable Logic Blocks (CLBs): 320 cells arranged in 16 x 20 array
  • Maximum User I/Os: 144 pins
  • Maximum Flip-Flops: 928
  • Horizontal Longlines: 40

Electrical Specifications

  • Supply Voltage: 5V (4.75V – 5.25V commercial, 4.5V – 5.5V industrial)
  • Operating Frequency: Up to 270MHz toggle rate
  • System Clock Speed: Over 85MHz
  • Logic Delays: 7 to 1.5 ns
  • Technology: High-performance CMOS static memory technology

Package Details

  • Package Type: 208-Pin Plastic Quad Flat Package (PQFP)
  • Pin Count: 208 pins
  • Package Code: PQ208
  • Speed Grade: -3 (270MHz performance)
  • Temperature Range:
    • Commercial: 0ยฐC to +85ยฐC junction temperature
    • Industrial options available: -40ยฐC to +100ยฐC

Key Features

  • Reprogrammability: Unlimited reprogramming capability for design iteration
  • Configuration Memory: Static memory cells with high reliability and noise immunity
  • Input/Output Options: TTL or CMOS input thresholds selectable
  • Clock Distribution: Two low-skew clock distribution networks
  • Built-in Oscillator: On-chip crystal oscillator amplifier
  • 3-State Bus Support: Internal 3-state bus capabilities for complex designs

Architecture Components

  • I/O Blocks (IOBs): Configurable input/output blocks around the perimeter
  • Configurable Logic Blocks (CLBs): Core array providing user-specified logic functions
  • Interconnect Resources: Programmable interconnection for signal routing
  • Configuration Data: 64,160 bits total configuration memory

2. Price Information

Current Market Pricing for XC3190A-3PQ208C:

The XC3190A-3PQ208C is available through authorized distributors and independent electronic component suppliers. Pricing varies based on quantity, lead time, and supplier. As this is a legacy component from Xilinx’s XC3000 series (now part of AMD), availability may be limited to existing stock from distributors.

Price Factors:

  • Quantity breaks available for volume purchases
  • Lead times may vary due to legacy status
  • Pricing fluctuates based on market demand and available inventory
  • Original manufacturer: Xilinx (now AMD)

Note: For current pricing and availability, please contact authorized distributors or submit a request for quotation (RFQ) as prices change frequently based on market conditions.

3. Documents & Media

Available Documentation

  • Official Datasheet: XC3000 Series Field Programmable Gate Arrays datasheet (Version 3.1, November 1998)
  • User Guide: Comprehensive product description covering architecture and features
  • Application Notes: Design guidelines and implementation examples
  • Configuration Guide: Programming and configuration procedures
  • Pin-out Diagrams: Detailed pin assignments for 208-pin PQFP package

Development Tools

  • Design Software: XACT Development System for schematic capture and auto place-and-route
  • Programming Tools: Configuration bitstream generation and device programming utilities
  • Simulation Tools: Logic and timing simulation capabilities
  • Verification: In-circuit emulation and design verification tools

Technical Support Resources

  • Product specifications and electrical characteristics
  • Package mechanical drawings and footprint information
  • Programming examples and reference designs
  • Timing calculator for performance analysis
  • Design optimization guidelines

4. Related Resources

Compatible Products

  • XC3190A variants: Different speed grades (-2, -4, -5) and package options
  • Configuration PROMs: XC17XX Series Serial Configuration PROMs
  • Development Boards: Evaluation and development platforms (contact suppliers)
  • Programming Cables: Xilinx programming and configuration interfaces

Alternative Packages

  • XC3190A-3PC84C: 84-Pin PLCC package option
  • XC3190A-3TQ144I: 144-Pin TQFP industrial temperature version
  • XC3190A-3PQ160C: 160-Pin PQFP package alternative

Software Tools

  • Legacy Tools: ISE Design Suite (for legacy FPGA families)
  • Modern Alternative: Vivado Design Suite (recommended for current projects)
  • Third-Party Support: Compatible with various EDA tools from major vendors

Technical Support

  • Design Consultation: FPGA technical engineering support available
  • Documentation Access: Datasheets, user guides, and application notes
  • Community Resources: FPGA forums and developer communities
  • Training Materials: Design methodologies and best practices

5. Environmental & Export Classifications

Environmental Compliance

  • RoHS Status: Legacy product – verify compliance requirements with supplier
  • Operating Temperature:
    • Commercial grade: 0ยฐC to +85ยฐC junction temperature
    • Industrial grade: -40ยฐC to +100ยฐC junction temperature (if available)
  • Storage Temperature: -65ยฐC to +150ยฐC ambient
  • Humidity: Standard commercial electronics environmental specifications

Package Environmental Data

  • Lead-Free: Verify with supplier for lead-free package options
  • Moisture Sensitivity: Level 3 (standard for PQFP packages)
  • Soldering Temperature: Maximum 260ยฐC for 10 seconds
  • ESD Rating: Standard CMOS handling precautions required

Export and Trade Compliance

  • Export Classification: Check current export control regulations
  • Country of Origin: Manufactured by Xilinx (USA)
  • Trade Restrictions: Verify current trade compliance requirements
  • ECCN Classification: Consult with trade compliance for current classification

Quality and Reliability

  • Quality Standard: 100% factory pre-tested devices
  • Reliability Testing: Extensive qualification and reliability testing performed
  • Package Reliability: Proven PQFP package technology with excellent field history
  • Configuration Memory: High reliability with no observed soft errors under normal conditions

Handling and Storage

  • Packaging: Anti-static packaging with ESD protection
  • Storage Requirements: Dry storage conditions recommended
  • Handling: Standard CMOS ESD precautions required
  • Shipping: Professional electronic component packaging and handling

The XC3190A-3PQ208C represents proven FPGA technology from Xilinx’s heritage XC3000 series, offering reliable performance for legacy system maintenance and specialized applications requiring this specific device.