Product Specifications
The XC3090-70PG175C features a robust architecture built for performance and reliability:
Core Features:
- Gate count: 9,000 equivalent gates
- Speed grade: -70 (high-performance variant)
- Package type: PG175 (175-pin plastic grid array)
- Operating temperature range: Commercial grade (0ยฐC to +70ยฐC)
- Advanced CMOS technology for low power consumption
- Reprogrammable architecture for design flexibility
Technical Specifications:
- Logic cells: High-density configurable logic blocks (CLBs)
- I/O pins: Multiple user-programmable I/O pins
- Memory: Distributed RAM capability within logic blocks
- Programming: SRAM-based configuration memory
- Power supply: Standard 5V operation
- Maximum operating frequency: Optimized for high-speed applications
Package Details:
- Package: 175-pin Plastic Grid Array (PG175)
- Mounting: Through-hole technology
- Pitch: Standard grid array spacing
- RoHS compliant packaging available
Price
The XC3090-70PG175C is competitively priced within the high-performance FPGA market segment. Pricing varies based on order quantity, delivery requirements, and current market conditions. For accurate pricing information and volume discounts, please contact authorized Xilinx distributors or sales representatives. Educational and development pricing may be available for qualifying institutions and projects.
Documents & Media
Technical Documentation:
- XC3090-70PG175C datasheet with complete electrical specifications
- XC3000 series user guide and programming manual
- Application notes for optimal design implementation
- Package and pinout diagrams
- Timing specifications and AC characteristics
- Power consumption analysis and thermal considerations
Design Resources:
- Reference designs and example projects
- Development board schematics featuring the XC3090-70PG175C
- Programming file formats and configuration guidelines
- CAD library symbols and footprints for PCB design
- Simulation models for various EDA tools
Software Support:
- Compatible with Xilinx development tools
- Programming and debugging utilities
- Device-specific constraint files
- Synthesis and place-and-route optimization guides
Related Resources
Development Tools:
- Xilinx ISE (Integrated Software Environment) for design entry and implementation
- Hardware debuggers and programming cables
- Evaluation boards and development kits
- Third-party EDA tool compatibility information
Complementary Products:
- Configuration memory devices (PROMs, Flash)
- Power management solutions optimized for FPGA applications
- Clock generation and distribution components
- Interface and connectivity solutions
Support Resources:
- Technical support documentation and FAQs
- Community forums and user groups
- Training materials and design methodology guides
- Migration guides for design upgrades and optimizations
Environmental & Export Classifications
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant versions available
- REACH (Registration, Evaluation, Authorization of Chemicals) compliance
- Conflict minerals reporting available upon request
- Lead-free package options for environmentally sensitive applications
Operating Conditions:
- Commercial temperature range: 0ยฐC to +70ยฐC
- Humidity: Standard commercial ratings
- Altitude: Sea level to specified maximum elevation
- Vibration and shock resistance per industry standards
Export Classification:
- Export Control Classification Number (ECCN) as per US Department of Commerce
- Country of origin documentation available
- Export licensing requirements vary by destination country
- Dual-use technology considerations for international shipments
Quality Standards:
- Manufactured to ISO 9001 quality management standards
- Device reliability testing per industry standards
- Qualification data available for mission-critical applications
- Traceability documentation for aerospace and automotive requirements
The XC3090-70PG175C represents a proven solution for engineers requiring high-performance programmable logic capabilities. Its combination of gate density, speed performance, and package flexibility makes it suitable for a wide range of applications from prototyping to volume production deployments.
