1. Product Specifications
Core Technical Specifications
- Part Number: XC3090-70PG175B
- Manufacturer: Xilinx (now AMD Xilinx)
- Product Family: XC3000 Series FPGAs
- Technology: CMOS Logic Cell Array (LCA)
- Package Type: 175-Pin CPGA (Ceramic Pin Grid Array)
- Operating Voltage: 5V
- Operating Frequency: 70MHz
- Logic Gates: 6,000 gates
- Logic Cells: 320 cells
- Configurable Logic Blocks (CLBs): 320
- Temperature Range: Extended (-40ยฐC to +105ยฐC)
Architecture Features
- User-Programmable Array Architecture: Flexible, extendable design
- Configuration Elements:
- Perimeter of I/O Blocks (IOBs)
- Core array of Configurable Logic Blocks (CLBs)
- Comprehensive interconnection resources
- Configuration Storage: External EEPROM, EPROM, or ROM support
- On-Chip Initialization Logic: Automatic program loading at power-up
- Compatible with XC17XX Serial Configuration PROMs
Development Tools Support
- XACT Development System: Schematic capture and auto place-and-route
- Design Verification: Logic and timing simulation, in-circuit emulation
- Design Editor: Interactive design optimization capabilities
- Modern Tool Support: Compatible with Xilinx Vivado Design Suite and ISE
2. Pricing Information
The XC3090-70PG175B pricing varies based on quantity, supplier, and current market conditions. As a legacy component from the XC3000 series, prices fluctuate frequently due to supply availability.
Pricing Considerations
- Market Status: Legacy/Obsolete component with limited new production
- Price Volatility: Costs vary significantly based on inventory levels
- Volume Discounts: Available for bulk purchases
- Regional Variations: Pricing differs by geographic location and distributor
Quote Request
For current pricing and availability, contact authorized distributors:
- Request quotes from multiple suppliers for competitive pricing
- Minimum order quantities (MOQ) may apply
- Lead times vary from same-day to several weeks depending on stock levels
3. Documents & Media
Technical Documentation
- Official Datasheet: Complete electrical and mechanical specifications
- Pin Configuration Diagrams: Detailed pinout information for 175-pin CPGA package
- Application Notes: Implementation guidelines and best practices
- Programming Guides: Configuration and development instructions
- Reference Designs: Example circuits and starter projects
Development Resources
- XACT Development System Documentation
- Vivado Design Suite Compatibility Guide
- Programming Tool Manuals
- Configuration PROM Selection Guide
- PCB Layout Guidelines
Media Files
- Package Drawings: Mechanical specifications and dimensions
- Thermal Characteristics: Heat dissipation and thermal management data
- EDA/CAD Models: PCB footprint and symbol libraries
- 3D Package Models: For mechanical design verification
4. Related Resources
Development Boards & Kits
- XC3090 Evaluation Boards: For prototyping and testing
- XC3000 Series Development Kits: Complete starter packages
- Reference Design Platforms: Pre-built demonstration circuits
Compatible Components
- XC17XX Configuration PROMs: Serial configuration memory
- Support Circuits: Clock generators, voltage regulators
- Interface Components: Level shifters, drivers, and receivers
Alternative Products
- XC3090-70PG175C: Commercial temperature range variant
- XC3090-70PP175C: Plastic package alternative
- XC3090-100PG175B: Higher speed grade option
- Modern FPGA Alternatives: Current Xilinx/AMD FPGA families for new designs
Software Tools
- Xilinx Vivado Design Suite: Modern FPGA development environment
- ISE Design Tools: Legacy development platform
- Third-Party Tools: LabVIEW FPGA, ModelSim simulation tools
Technical Support
- Application Engineering: Design consultation and troubleshooting
- Documentation Libraries: Comprehensive technical resources
- Community Forums: User support and knowledge sharing
- Training Materials: Tutorials and educational content
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Lead-free manufacturing process
- Environmental Rating: Green/RoHS compliant
- Packaging Materials: Environmentally responsible packaging
- Recycling Information: End-of-life disposal guidelines
Export Classifications
- ECCN (Export Control Classification Number): Subject to US export regulations
- Country of Origin: Manufactured according to international standards
- Trade Compliance: Meets international trade requirements
- Restricted Destinations: May require export licenses for certain countries
Quality Standards
- Manufacturing Standards: ISO 9001 certified facilities
- Quality Assurance: Comprehensive testing and validation
- Reliability Standards: Military and industrial grade options available
- Traceability: Full supply chain documentation
Handling & Storage
- ESD Sensitivity: Electrostatic discharge precautions required
- Storage Conditions: Controlled temperature and humidity requirements
- Shelf Life: Extended storage capability with proper handling
- Transportation: Secure packaging for global shipping
Note: The XC3090-70PG175B is a legacy component that may have limited availability. For new designs, consider modern FPGA alternatives that offer enhanced performance, lower power consumption, and continued long-term support. Contact authorized distributors for current availability, pricing, and technical support.
