1. Product Specifications
Core Technical Features
- Part Number: XC3064-70PP132C
- Family: XC3000 Series Field Programmable Gate Arrays
- Logic Capacity: 4,500 maximum logic gates (3,500-4,500 typical range)
- Architecture: 224 Configurable Logic Blocks (CLBs) in 16 x 14 array
- Speed Grade: 70MHz
- Package Type: 132-Pin PPGA (Plastic Pin Grid Array)
- Supply Voltage: 5V (4.75V – 5.25V Commercial, 4.5V – 5.5V Industrial)
Performance Characteristics
- User I/O Pins: 120 maximum user I/Os
- Flip-Flops: 688 maximum flip-flops
- Horizontal Longlines: 32 longlines for high fan-out signal distribution
- Configuration Data: 46,064 configuration data bits
- Technology: High-performance CMOS static memory technology
Key Features
- Guaranteed toggle rates of 70 MHz with low quiescent and active power consumption
- Flexible FPGA architecture with extensive register, combinatorial, and I/O capabilities
- High fan-out signal distribution with low-skew clock networks
- Internal 3-state bus capabilities
- TTL or CMOS input thresholds
- Unlimited reprogrammability for easy design iteration
2. Price
Current Market Pricing:
- Quantity 1-99: Contact for Quote
- Quantity 100-999: Competitive volume pricing available
- Quantity 1000+: Significant quantity discounts available
Note: Pricing fluctuates based on market conditions and supplier inventory. Contact authorized distributors for current pricing and availability.
Cost-Effective Features:
- Long Product Lifecycle: Stable XC3000 series with extensive industry support
- Development Cost Savings: Avoids NRE, time delay, and risk of conventional masked gate arrays
- Flexible Implementation: Reduces overall system costs through integration capabilities
3. Documents & Media
Official Documentation
- Product Datasheet: XC3000 Series Field Programmable Gate Arrays Datasheet (Version 3.1)
- Application Notes: FPGA design implementation guides
- Package Information: 132-Pin PPGA mechanical drawings and specifications
- Pin Configuration: Complete pinout diagrams and I/O specifications
Development Resources
- Development Tools: Complete XACT Development System with schematic capture and automatic place-and-route
- Simulation Tools: Logic and timing simulation capabilities
- Design Software: Interactive design editor for design optimization
- Interface Support: Compatible with Viewlogic, Cadence, Mentor Graphics design environments
Technical Resources
- Configuration Programming Guides
- Timing Calculator Tools
- Pin Assignment Reference
- PCB Layout Guidelines
4. Related Resources
Compatible Products
- XC3064A Series: Enhanced versions with additional features
- XC3000L Series: Low-voltage 3.3V variants
- Configuration PROMs: XC17XX Serial Configuration memory devices
Development Boards & Kits
- Evaluation platforms for XC3000 series
- Reference designs and application examples
- Programming cables and adapters
- Third-party development solutions
Software Tools
- XACT Design System: Primary development environment
- Timing Analysis Tools: Performance optimization utilities
- Place & Route Software: Automated design implementation
- Simulation Packages: Functional and timing verification
Technical Support
- Application engineering assistance
- Design consultation services
- Training programs and workshops
- Online technical forums and resources
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Lead free/RoHS Compliant options available
- Package Material: Plastic (PPGA) with industry-standard materials
- Temperature Ranges:
- Commercial Grade: 0ยฐC to +85ยฐC junction temperature
- Industrial Grade: -40ยฐC to +100ยฐC junction temperature
- Storage Temperature: -65ยฐC to +150ยฐC ambient
Quality & Reliability
- Manufacturing Standard: 100% factory pre-tested devices
- Reliability Rating: Excellent reliability record with robust CMOS design
- ESD Protection: Built-in electrostatic discharge protection circuitry
- Quality Assurance: ISO certified manufacturing processes
Export Classifications
- ECCN: Check current export control classification
- Country of Origin: Varies by manufacturing location
- Trade Compliance: Meets international trade regulations
- Documentation: Certificate of Compliance available upon request
Packaging & Handling
- Anti-Static Packaging: ESD-safe packaging for device protection
- Moisture Sensitivity: Standard MSL rating for plastic packages
- Lead Finish: Industry-standard lead plating
- Marking: Clear part number and date code identification
Applications: Digital signal processing, telecommunications, industrial control, automotive electronics, aerospace systems, and general-purpose logic implementation.
Manufacturer: Xilinx, Inc. (now part of AMD)
Status: Product Obsolete or Under Obsolescence – Contact authorized distributors for current availability and recommended alternatives.
