XC3030-70PC84C Commercial FPGA – Complete Product Guide & Technical Specifications

1. Product Specifications

Detailed Technical Specifications – XC3030-70PC84C

Parameter	Specification
Part Number	XC3030-70PC84C
Manufacturer	AMD (formerly Xilinx)
Product Family	XC3000 Series Commercial FPGA
Speed Grade	-70 (70MHz maximum frequency)
Temperature Grade	Commercial (0°C to +70°C)
Logic Architecture	100 Configurable Logic Blocks (CLBs)
Gate Equivalent	~2,000 gates (1,500 usable gates)
Total RAM Bits	22,176 bits
Maximum Clock Frequency	70 MHz
Package Type	84-Pin PLCC (Plastic Leaded Chip Carrier)
Package Dimensions	29.31mm x 29.31mm x 4.57mm
Operating Voltage	4.75V to 5.25V (5V ± 5%)
User I/O Pins	74 bidirectional pins
Combinatorial Delay (CLB)	9.0ns maximum
Technology Process	CMOS static memory configuration
Configuration Method	SRAM-based reprogrammable

Advanced Architecture Details

The XC3030-70PC84C features a sophisticated programmable logic architecture optimized for commercial applications:

Core Logic Elements:

• 100 Configurable Logic Blocks (CLBs) in 10×10 array configuration
• Input/Output Blocks (IOBs) with flexible electrical characteristics
• Programmable Interconnect Matrix for optimal signal routing
• Configuration Storage using internal SRAM technology

Performance Optimization Features:

• Global Clock Distribution with low-skew clock networks
• High-Speed Interconnect for critical signal paths
• TTL/CMOS Compatible I/O with programmable thresholds
• 3-State Bus Capability for internal bus implementations
• Crystal Oscillator Support with on-chip amplifier

Pin Configuration & Package Details

84-Pin PLCC Package Features:

• Total Pin Count: 84 pins in J-lead configuration
• User I/O Pins: 74 configurable as input, output, or bidirectional
• Power Supply Pins: VCC (+5V), GND (multiple pins for power distribution)
• Configuration Pins: Mode control and programming interface
• Clock Inputs: Dedicated low-skew global clock inputs
• Control Signals: RESET, DONE, PROGRAM_B for system control

Surface Mount Compatible:

• J-lead design for reliable PCB mounting
• Compatible with standard SMT assembly processes
• Excellent thermal and electrical performance
• Industry-standard footprint for easy board layout

2. Pricing Information

Current Market Pricing for XC3030-70PC84C

Important Notice: The XC3030-70PC84C is classified as an obsolete/legacy product. Pricing reflects limited availability from specialized suppliers.

Market Price Ranges:

Quantity Range	Price Per Unit (USD)	Condition
1-9 pieces	$18-35	New Old Stock (NOS)
10-49 pieces	$15-28	New/Refurbished
50-199 pieces	$12-22	Mixed condition
200+ pieces	Contact suppliers	Volume pricing available

Price Influencing Factors:

• ✓ New vs. refurbished/used condition
• ✓ Date code and storage quality
• ✓ Supplier certification and traceability
• ✓ Packaging (tubes, trays, or loose)
• ✓ Testing and quality assurance level

Where to Buy XC3030-70PC84C

Authorized Legacy Distributors:

• Rochester Electronics – Premier obsolete semiconductor specialist
• Electronic Surplus – New and refurbished FPGA inventory
• FPGAkey – Global programmable logic component supplier
• Component Electronics – Industrial electronics distributor

Online Electronic Marketplaces:

• Octopart – Price comparison across multiple suppliers
• Nexelec – Specialized in legacy Xilinx products
• NAC Semi – North American component distributor
• Rich Electronics – European surplus electronics supplier

Procurement Best Practices:

• Request detailed condition reports for critical applications
• Verify authenticity with original manufacturer markings
• Consider anti-static handling and storage requirements
• Plan for potential long lead times due to limited availability

Pricing information based on market research as of 2025. Contact suppliers directly for current availability and quotes.

3. Documents & Media

Essential Technical Documentation

Primary Documentation for XC3030-70PC84C:

1. XC3000 Family Datasheet – Comprehensive electrical and functional specifications
2. XC3030-70PC84C Product Brief – Device-specific performance characteristics
3. Pin Assignment Documentation – Complete 84-pin PLCC pinout with signal descriptions
4. AC/DC Characteristics – Timing specifications and electrical parameters
5. Application Guidelines – Design recommendations and best practices

Development Tools & Software

Legacy Development Environment:

• XACT Development System (Historical – no longer supported)
• Foundation Series – Schematic entry and place-and-route tools
• Alliance Series – Advanced FPGA development platform

Last Supported Modern Tools:

• ISE Design Suite 14.7 – Final Xilinx toolchain supporting XC3000 series
• WebPACK ISE – Free version with XC3000 family support
• Third-Party Tools – VHDL/Verilog synthesis alternatives

Programming and Configuration:

• Configuration Bitstream Generation – .bit file creation utilities
• PROM Programming – Serial configuration memory support
• JTAG Boundary Scan – In-system testing and debugging
• Parallel Configuration – Direct programming interfaces

Design Resources & Application Notes

Reference Designs:

• Digital signal processing implementations
• Communication interface controllers
• Custom logic replacement solutions
• Educational and prototyping examples

Key Application Notes:

• XAPP002 – XC3000 Series Design Guidelines
• XAPP025 – Clock Distribution Best Practices
• XAPP055 – I/O Design Considerations
• XAPP080 – Migration Strategies for Legacy Designs

Media & Documentation:

• High-resolution package photographs and mechanical drawings
• Functional block diagrams and architecture illustrations
• Pinout charts and signal reference guides
• Thermal and power consumption analysis charts

4. Related Resources

XC3000 Series Family Members

Pin-Compatible Alternatives:

• XC3030-50PC84C – Lower speed grade (50MHz operation)
• XC3030-100PC84C – Higher performance (100MHz operation)
• XC3030-70PC84I – Industrial temperature range (-40°C to +85°C)
• XC3030A-70PC84C – Enhanced ‘A’ series with improved specifications

Capacity Alternatives:

• XC3020-70PC84C – Smaller logic capacity (64 CLBs)
• XC3042-70PC84C – Increased logic capacity (144 CLBs)
• XC3064-70PC84C – High-capacity option (224 CLBs)

Modern FPGA Migration Options

Recommended Upgrade Paths:

• Spartan-3E Series – Direct architectural successor with enhanced capabilities
• Spartan-6 LX Series – Modern low-power alternative with migration support tools
• Spartan-7 Series – Latest generation with comprehensive backward compatibility

Migration Planning Considerations:

• Voltage Translation: 5V to modern 3.3V/2.5V/1.8V logic levels
• Tool Flow Updates: Transition from ISE to Vivado Design Suite
• Pin Mapping: Package and pinout differences requiring board redesign
• Performance Gains: Opportunity for significant speed and power improvements

Development & Evaluation Resources

Historical Development Platforms:

• XC3000 Series Development Kit (Discontinued)
• Third-party evaluation boards and prototyping systems
• University research and educational platforms

Modern Alternatives for New Designs:

• Digilent Basys 3 – Educational FPGA board with Spartan-7
• Arty S7 Development Board – Professional prototyping platform
• Custom Adapter Solutions – Bridge legacy XC3030 designs to modern FPGAs

Technical Support & Community

Expert Resources:

• Legacy FPGA Forums – Community-driven support for obsolete devices
• Academic Institutions – Universities maintaining XC3000 expertise
• Independent Consultants – Specialists in legacy FPGA system design
• Reverse Engineering Services – Bitstream analysis and design recovery

Documentation Archives:

• AMD/Xilinx legacy product documentation portal
• Technical paper repositories and IEEE digital library
• Open-source FPGA development communities
• Educational resources and course materials

5. Environmental & Export Classifications

Environmental Specifications & Compliance

Operating Environmental Conditions:

• Temperature Range: 0°C to +70°C (Commercial grade operation)
• Storage Temperature: -65°C to +150°C (Non-operating)
• Relative Humidity: 85% non-condensing (operational)
• Junction Temperature: Maximum +125°C with appropriate thermal management

Thermal Characteristics:

• Thermal Resistance (θJA): 35°C/W in still air (typical)
• Power Dissipation: Variable based on design utilization
• Thermal Management: Heat sink recommended for high-utilization designs
• Operating Altitude: Up to 2,000 meters standard atmospheric conditions

Physical Durability:

• Vibration Resistance: Compliant with standard commercial electronics specifications
• Shock Tolerance: Suitable for typical commercial transportation and handling
• Moisture Sensitivity: Level 3 per JEDEC J-STD-020 (requires controlled storage)

Package & Material Specifications

Package Construction:

• Body Material: Flame-retardant plastic compound (UL94-V0 rated)
• Lead Frame: Copper alloy with tin-lead plating (Pre-RoHS construction)
• Die Attachment: Gold-silicon eutectic for reliable thermal and electrical connection
• Wire Bonding: Gold wire for optimal electrical performance and longevity

Environmental Impact Considerations:

• Lead Content: Contains lead in solder plating (Pre-RoHS manufacturing)
• Recycling Classification: Electronic waste requiring specialized disposal
• Precious Metal Content: Gold recovery potential for large quantities

Regulatory Compliance & Standards

Quality Standards Compliance:

• ISO 9001: Manufacturing under certified quality management systems
• JEDEC Standards: Compliant with solid-state technology reliability standards
• IPC Standards: Compatible with industry PCB assembly and soldering processes

RoHS Compliance Status:

• Current Status: Non-RoHS compliant (contains lead in package construction)
• Manufacturing Date: Pre-RoHS directive implementation (manufactured before 2006)
• Modern Alternatives: Contact manufacturer for RoHS-compliant replacement options

Export Control & Trade Classifications

Export Control Classification Number (ECCN):

• Standard Classification: 3A001.a.7 (General-purpose integrated circuits)
• Export License Requirements: No License Required (NLR) for most destinations
• Restricted Destinations: Check current Bureau of Industry and Security (BIS) Entity List

International Trade Information:

• Country of Origin: United States (Original Xilinx manufacturing)
• Harmonized Tariff Code: 8542.31.0001 (Processors and controllers)
• NAFTA/USMCA: Eligible for preferential trade treatment
• Certificate of Origin: Available upon request for customs clearance

Import/Export Documentation:

• Standard commercial electronics classification
• No special licensing required for civilian applications
• Military/aerospace end-use may require additional export documentation
• Dual-use technology considerations for certain applications

End-of-Life & Disposal Considerations

Sustainable Disposal Practices:

• E-Waste Recycling: Partner with certified electronics recyclers
• Precious Metal Recovery: Gold and copper content suitable for reclamation
• Lead Management: Requires hazardous material handling procedures
• Documentation: Maintain disposal records for environmental compliance

Component Lifecycle Management:

• Inventory Planning: Consider long-term availability for critical applications
• Obsolescence Management: Develop migration strategies for new designs
• Spare Parts Planning: Adequate backup inventory for maintenance applications

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Summary

The XC3030-70PC84C represents a proven commercial-grade FPGA solution from AMD’s XC3000 legacy series, engineered for reliable performance in standard commercial operating environments (0°C to +70°C). This device features 100 configurable logic blocks operating at 70MHz in a compact 84-pin PLCC package, making it an excellent choice for cost-sensitive applications requiring moderate performance and proven reliability.

Commercial Advantages of XC3030-70PC84C:

• ✅ Cost-Effective Design – Optimized for commercial applications with competitive pricing
• ✅ Proven Reliability – Decades of field-proven performance in commercial systems
• ✅ 5V Operation – Direct compatibility with legacy TTL/CMOS systems
• ✅ Standard SMT Package – 84-pin PLCC suitable for automated assembly processes
• ✅ Comprehensive Documentation – Extensive application resources and design guides

Ideal Applications:

• Consumer electronics and appliances
• Telecommunications equipment
• Industrial instrumentation and controls
• Educational and research projects
• Prototyping and development systems
• Legacy system maintenance and upgrades

Technical Highlights:

• 70MHz maximum operating frequency for moderate-speed applications
• 74 user I/O pins providing flexible interface capabilities
• SRAM-based configuration enabling unlimited reprogrammability
• Compatible with standard FPGA development methodologies
• Excellent signal integrity and electrical characteristics

While the XC3030-70PC84C is now classified as obsolete, it remains valuable for maintaining existing commercial systems and cost-sensitive applications where 5V operation and proven reliability are essential. For new commercial designs, consider modern Spartan series FPGAs with enhanced features, lower power consumption, and continued manufacturing support.

Sourcing Recommendations:

• Purchase from reputable obsolete parts specialists to ensure authenticity
• Verify electrical specifications and date codes for critical applications
• Consider adequate backup inventory due to limited future availability
• Plan migration to modern FPGA families for new product development

For technical documentation, application support, or commercial pricing information for the XC3030-70PC84C, contact specialized FPGA distributors or AMD’s legacy product support resources.