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XC3030-100PC84C High-Performance FPGA – Complete Product Guide & Technical Specifications

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Complete Technical Specifications – XC3030-100PC84C

Parameter Specification
Part Number XC3030-100PC84C
Manufacturer AMD (formerly Xilinx)
Product Family XC3000 Series High-Performance Commercial FPGA
Speed Grade -100 (100MHz maximum frequency)
Temperature Grade Commercial (0ยฐC to +70ยฐC)
Package Type 84-Pin PLCC (Plastic Leaded Chip Carrier)
Package Dimensions 29.31mm x 29.31mm x 4.57mm
Logic Architecture 100 Configurable Logic Blocks (CLBs)
Gate Equivalent ~2,000 gates (1,500 usable gates)
Total RAM Bits 22,176 bits
User I/O Pins 74 bidirectional pins
Maximum Clock Frequency 100 MHz
Operating Voltage 4.75V to 5.25V (5V ยฑ 5%)
Combinatorial Delay (CLB) 7.0ns maximum
Technology Process Advanced CMOS static memory configuration
Configuration Method High-speed SRAM-based reprogrammable

High-Performance Architecture Details

The XC3030-100PC84C features the most advanced timing specifications in the XC3030 family:

Optimized Core Logic Resources:

  • 100 Configurable Logic Blocks (CLBs) in high-speed 10×10 array
  • Enhanced I/O Blocks (IOBs) with fast setup and hold times
  • Optimized Interconnect Matrix for maximum routing performance
  • High-Speed Configuration using advanced SRAM technology

Performance-Optimized Features:

  • 100MHz System Clock capability for real-time applications
  • Ultra-Low Skew Clock Distribution for synchronous high-speed designs
  • Fast I/O Switching with minimal propagation delays
  • High-Speed TTL/CMOS Compatibility for fast interface designs
  • Enhanced Drive Capability for high-frequency signal integrity

Advanced Timing Characteristics

High-Speed Performance Specifications:

  • Maximum Clock Frequency: 100MHz (10ns period)
  • CLB Combinatorial Delay: 7.0ns maximum (fastest in series)
  • Setup Time: 3.0ns typical for high-speed operation
  • Hold Time: 1.0ns typical for reliable timing closure
  • Clock-to-Output Delay: 8.0ns maximum for fast I/O response

Timing Optimization Features:

  • Global Clock Networks: Multiple low-skew clock domains
  • Fast Carry Logic: Optimized arithmetic operations
  • High-Speed I/O Standards: TTL/CMOS with fast transition times
  • Timing Constraints: Advanced timing analysis capabilities

Pin Configuration & High-Speed I/O

84-Pin High-Performance Package:

  • Total Pin Count: 84 pins in robust J-lead configuration
  • User I/O Pins: 74 high-speed configurable pins
  • Power Distribution: Multiple VCC/GND pins for stable high-frequency operation
  • Clock Inputs: Dedicated high-speed global clock distribution
  • Configuration Interface: Fast programming for rapid prototyping

High-Speed I/O Capabilities:

  • Fast Rise/Fall Times: Optimized for 100MHz operation
  • Enhanced Drive Strength: Multiple drive options for signal integrity
  • Input Threshold Programming: TTL/CMOS compatibility
  • Output Slew Rate Control: EMI optimization for high-speed switching

2. Pricing Information

Current Market Pricing for XC3030-100PC84C

Important Notice: The XC3030-100PC84C is classified as an obsolete/legacy premium FPGA with limited availability from specialized high-performance component suppliers.

High-Performance Market Price Ranges:

Quantity Range Price Per Unit (USD) Typical Condition
1-9 pieces $25-45 New Old Stock
10-49 pieces $22-38 Certified High-Performance
50-199 pieces $18-30 Mixed condition
200+ pieces Contact for quotes Volume premium pricing

Performance Premium Factors:

  • 20-30% Higher Cost: Maximum speed grade premium over slower variants
  • Performance Qualification: Enhanced testing for 100MHz operation
  • Limited Availability: Reduced inventory due to high-performance demand
  • Quality Assurance: Advanced screening for timing and performance

Where to Purchase XC3030-100PC84C

High-Performance Component Specialists:

  • Mouser Electronics – Authorized distributor with performance verification
  • FPGAkey – Global high-performance FPGA component marketplace
  • Jotrin Electronics – International electronic component supplier
  • Specialty Parts Inc. – High-performance electronic component specialist

Premium Electronic Component Sources:

  • VEKEMO FPGA – Specialized Xilinx component distributor
  • Datasheet Directory – Global supply chain with performance documentation
  • Performance component brokers – High-speed electronics specialists
  • Research institution surplus – University and lab equipment sources

Procurement Strategy for High-Performance Applications:

  • Performance Verification: Request timing test reports for 100MHz operation
  • Quality Documentation: Ensure proper storage and handling procedures
  • Speed Binning: Verify actual tested speed performance
  • Backup Inventory: Consider multiple sources due to limited availability

Pricing reflects premium high-performance component market as of 2025. Contact specialized performance component suppliers for current availability and speed-verified units.

3. Documents & Media

Essential High-Performance Documentation

Core Technical Documentation for XC3030-100PC84C:

  1. XC3000 High-Speed Family Datasheet – Complete 100MHz timing specifications
  2. Performance Characterization Report – Speed grade verification and timing analysis
  3. High-Speed Design Guidelines – Best practices for 100MHz operation
  4. Timing Constraints Manual – Advanced timing closure techniques
  5. Signal Integrity Analysis – High-frequency design considerations

High-Performance Development Tools

Advanced Development Environment:

  • XACT Development System – Original high-performance design tools
  • Foundation Series Pro – Advanced timing analysis and optimization
  • Alliance Series – Professional FPGA development with timing constraints

Performance-Oriented Design Tools:

  • ISE Design Suite 14.7 – Last version supporting XC3000 with advanced timing
  • Timing Analyzer Pro – Detailed timing analysis for 100MHz designs
  • Signal Integrity Tools – High-frequency design verification

High-Speed Programming and Configuration:

  • Fast Configuration – Optimized bitstream loading for rapid prototyping
  • Performance PROM – High-speed configuration memory options
  • JTAG High-Speed – Fast boundary scan for production testing
  • In-System Programming – Real-time configuration updates

High-Performance Application Resources

Advanced Design Examples:

  • High-speed digital signal processing implementations
  • Real-time video and image processing systems
  • High-frequency communication controllers
  • Performance-critical control systems
  • Fast data acquisition and processing

Key High-Performance Application Notes:

  • XAPP005 – High-Speed Design with XC3000 Series FPGAs
  • XAPP035 – Timing Closure Techniques for 100MHz Operation
  • XAPP060 – Signal Integrity in High-Speed FPGA Designs
  • XAPP085 – Advanced Clock Distribution for Maximum Performance

Performance Media Resources:

  • High-speed timing diagrams and performance curves
  • Signal integrity simulation models and SPICE parameters
  • PCB layout guidelines for 100MHz operation
  • Thermal analysis charts for high-performance applications

4. Related Resources

XC3030 Performance Family Comparison

Speed Grade Performance Hierarchy:

  • XC3030-50PC84C – Entry-level 50MHz operation
  • XC3030-70PC84C – Standard 70MHz performance
  • XC3030-100PC84C – This device – Maximum 100MHz performance
  • XC3030-125PC84C – Ultra-high-speed 125MHz (if available)

Performance vs. Cost Analysis:

  • XC3030-50PC84C: Best cost/performance for moderate speed applications
  • XC3030-70PC84C: Balanced performance for most commercial applications
  • XC3030-100PC84C: Premium performance for time-critical designs
  • XC3030-125PC84C: Ultimate performance for extreme speed requirements

Package Performance Alternatives:

  • XC3030-100PC68C – Compact 68-pin package with 100MHz performance
  • XC3030-100PC44C – Ultra-compact 44-pin package for space-critical designs
  • XC3030-100PG84C – Pin grid array version for enhanced thermal performance

Modern High-Performance FPGA Migration

Advanced Upgrade Paths:

  • Spartan-3E High-Speed – Direct successor with enhanced 100MHz+ capabilities
  • Spartan-6 LX High-Performance – Modern architecture with superior speed/power
  • Spartan-7 Performance – Latest technology with advanced timing closure tools

Performance Migration Considerations:

  • Timing Translation: Converting XC3000 timing constraints to modern tools
  • Clock Domain Migration: Advanced clock management in modern FPGAs
  • Performance Optimization: Leveraging modern architecture advantages
  • Tool Chain Advantages: Enhanced timing analysis and optimization capabilities

High-Performance Development Resources

Performance Evaluation and Testing:

  • High-speed test fixtures and performance verification equipment
  • 100MHz+ signal generators and high-speed oscilloscopes
  • Timing analysis equipment and jitter measurement tools
  • Signal integrity testing and analysis capabilities

High-Performance Design Services:

  • Performance FPGA Consultants – Specialists in high-speed digital design
  • Signal Integrity Analysis – Professional SI simulation and optimization
  • Timing Closure Services – Expert timing constraint development
  • Performance Verification – Complete system validation and testing

Advanced Technical Support:

  • High-Speed Design Forums – Community expertise in performance optimization
  • Academic Research – University labs with high-performance FPGA expertise
  • Professional Services – Commercial timing analysis and optimization
  • Performance Consulting – Independent experts in high-speed FPGA design

Performance Documentation & Resources

Advanced Technical Documentation:

  • High-speed design methodology guides and best practices
  • Signal integrity modeling and simulation resources
  • Timing closure techniques and constraint development
  • Performance optimization case studies and examples

Professional Development Resources:

  • High-speed digital design training and certification
  • FPGA performance optimization workshops
  • Signal integrity and timing analysis courses
  • Advanced FPGA design methodology seminars

5. Environmental & Export Classifications

High-Performance Environmental Specifications

Commercial High-Performance Operating Conditions:

  • Temperature Range: 0ยฐC to +70ยฐC (Commercial grade with performance validation)
  • Storage Temperature: -65ยฐC to +150ยฐC (Extended storage capability)
  • Relative Humidity: 85% non-condensing with performance qualification
  • Junction Temperature: Maximum +125ยฐC with thermal management for 100MHz

Performance-Validated Environmental Testing:

  • High-Speed Temperature Cycling: Performance verified across operating range
  • Accelerated Life Testing: Enhanced reliability at maximum speed operation
  • Thermal Characterization: Power dissipation analysis at 100MHz
  • Environmental Stress Screening: Performance validation under stress conditions

Advanced Thermal Management:

  • Thermal Resistance (ฮธJA): 35ยฐC/W with considerations for 100MHz power
  • Power Dissipation: Dynamic power analysis for high-speed switching
  • Heat Sink Compatibility: Thermal solutions for sustained 100MHz operation
  • Thermal Derating: Performance analysis across temperature range

High-Performance Package Specifications

Advanced Package Construction:

  • Premium Materials: Enhanced plastic compound for high-frequency performance
  • Low-Inductance Lead Frame: Optimized for high-speed signal integrity
  • Enhanced Die Attachment: Superior thermal and electrical performance
  • High-Speed Wire Bonding: Minimized parasitic inductance and capacitance

Performance Package Characteristics:

  • Electrical Performance: Minimized package parasitics for 100MHz operation
  • Thermal Performance: Enhanced heat dissipation for high-speed switching
  • Mechanical Reliability: Robust construction for performance applications
  • Signal Integrity: Package design optimized for high-frequency operation

Performance Compliance & Standards

High-Performance Quality Standards:

  • ISO 9001: Manufacturing under enhanced quality systems for performance parts
  • JEDEC Performance Standards: High-speed device qualification procedures
  • Performance Testing: Enhanced screening for speed grade verification
  • Reliability Standards: Accelerated testing for high-performance operation

RoHS Compliance for Performance Applications:

  • Legacy Status: Non-RoHS compliant (pre-directive manufacturing)
  • Performance Impact: RoHS alternatives may have different speed characteristics
  • Lead Content: Package contains lead requiring specialized handling
  • Performance Migration: Modern RoHS-compliant alternatives available

Export Control & High-Performance Applications

Performance Export Classification:

  • ECCN Classification: 3A001.a.7 with potential performance considerations
  • High-Performance License: Enhanced controls for certain performance applications
  • Technology Transfer: Restrictions on high-speed design methodologies
  • Performance Documentation: Controlled distribution of timing specifications

International High-Performance Trade:

  • Country of Origin: United States (AMD/Xilinx high-performance manufacturing)
  • Performance Standards: Compliance with international high-speed electronics standards
  • Technology Export: Enhanced documentation for high-performance applications
  • Performance Certification: Quality certificates for international performance markets

High-Performance Import/Export Considerations:

  • Performance Classification: High-speed electronics vs. standard components
  • Technology Transfer: Restrictions on performance optimization techniques
  • Documentation Requirements: Enhanced paperwork for performance applications
  • End-Use Verification: Performance application disclosure requirements

Performance Lifecycle Management

High-Performance Waste Management:

  • Performance Component Recycling: Specialized disposal for high-value components
  • Precious Metal Recovery: Enhanced recovery procedures for premium components
  • Performance Documentation: Disposal tracking for performance applications
  • Technology Security: Secure disposal for performance-sensitive applications

Performance Component Lifecycle:

  • Obsolescence Management: Long-term availability planning for performance systems
  • Performance Migration: Upgrade strategies for performance-critical applications
  • Speed Verification: Ongoing testing for performance component inventory
  • Performance Archival: Documentation preservation for critical applications

Summary

The XC3030-100PC84C represents the pinnacle of performance in the XC3030 series, delivering maximum 100MHz operation for the most demanding commercial applications requiring high-speed programmable logic. This premium FPGA combines advanced timing characteristics with proven XC3000 architecture reliability, making it the ideal choice for performance-critical applications where speed and timing precision are paramount.

High-Performance Advantages of XC3030-100PC84C:

  • โœ… Maximum Speed Performance – 100MHz operation for time-critical applications
  • โœ… Advanced Timing Specifications – 7.0ns CLB delay for fastest logic response
  • โœ… Premium Quality Grade – Enhanced testing and speed verification
  • โœ… High-Speed I/O Capability – 74 pins optimized for 100MHz operation
  • โœ… Performance-Validated Design – Proven reliability at maximum speed
  • โœ… Professional-Grade Solution – Premium component for demanding applications

Ideal High-Performance Applications:

  • Real-time digital signal processing systems
  • High-speed data acquisition and processing
  • Performance-critical control and automation
  • Fast video and image processing applications
  • High-frequency communication systems
  • Time-sensitive embedded system controllers

Technical Performance Highlights:

  • 100MHz maximum clock frequency for real-time processing capabilities
  • 7.0ns combinatorial delay enabling fastest logic operations in XC3030 series
  • 74 high-speed I/O pins providing extensive interface capabilities
  • Advanced clock distribution for reliable high-speed synchronous designs
  • Enhanced signal integrity characteristics for professional applications

Design Considerations for 100MHz Operation:

  • Timing Closure: Advanced constraint development and timing analysis required
  • Signal Integrity: High-speed PCB design and layout considerations essential
  • Power Management: Thermal analysis and heat dissipation planning necessary
  • Performance Verification: Speed testing and validation recommended

While the XC3030-100PC84C is now classified as obsolete, it remains the premium choice for performance-critical applications requiring maximum speed in the XC3030 architecture. The 100MHz speed grade provides the fastest possible performance for applications where timing is critical and standard commercial FPGA speeds are insufficient.

Performance Procurement Strategy:

  • Source from certified high-performance component specialists with speed verification
  • Request performance test data and timing characterization reports
  • Verify proper anti-static handling and temperature-controlled storage
  • Consider backup inventory from multiple sources due to limited premium availability
  • Plan performance migration to modern high-speed FPGA families for new designs

For performance documentation, timing specifications, or high-speed design support for the XC3030-100PC84C, contact specialized high-performance FPGA distributors or professional design services with advanced timing analysis capabilities.