The XC2VP70-7FFG1704I is a premium Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex-II Pro series, designed to deliver exceptional performance for demanding digital signal processing, communications, and embedded processing applications. This industrial-grade FPGA combines high logic density with embedded PowerPC processors, making it ideal for complex system designs requiring both flexibility and processing power.
Product Specification
The XC2VP70-7FFG1704I features robust specifications that make it suitable for high-performance applications across various industries. This FPGA contains 70,336 logic cells with a speed grade of -7, ensuring fast signal processing and low propagation delays. The device is housed in a 1704-pin Fine-pitch Ball Grid Array (FFG1704) package, providing excellent thermal performance and signal integrity.
Key specifications of the XC2VP70-7FFG1704I include dual embedded PowerPC 405 processors running at up to 400MHz, 328 dedicated multipliers for DSP operations, and 4,176 Kbits of block RAM. The device supports multiple I/O standards including LVDS, SSTL, and HSTL, with 996 user I/O pins available for interfacing with external components. The industrial temperature range (-40ยฐC to +85ยฐC) ensures reliable operation in harsh environments.
The XC2VP70-7FFG1704I incorporates advanced features such as Digital Clock Manager (DCM) blocks for precise clock management, SelectRAM+ memory blocks for flexible data storage, and high-speed serial transceivers for communication interfaces. These features enable designers to implement complex algorithms and protocols efficiently within a single device.
Price
Pricing for the XC2VP70-7FFG1704I varies based on order quantity, distribution channel, and current market conditions. As a high-end FPGA from the Virtex-II Pro family, the XC2VP70-7FFG1704I typically commands premium pricing reflecting its advanced capabilities and industrial-grade specifications.
For current pricing information on the XC2VP70-7FFG1704I, contact authorized Xilinx distributors or visit official semiconductor supplier websites. Volume discounts are typically available for production quantities, and engineering samples may be available for qualified design projects. Lead times can vary depending on inventory levels and manufacturing schedules.
Documents & Media
Comprehensive documentation is available for the XC2VP70-7FFG1704I to support design and implementation processes. The primary datasheet provides detailed electrical characteristics, timing specifications, and package information essential for proper device selection and board design.
Additional technical resources include the Virtex-II Pro Platform FPGA User Guide, which covers architecture details, configuration options, and design guidelines. Application notes demonstrate specific implementation techniques for common design challenges, while reference designs provide starting points for typical applications.
Development tools documentation includes ISE Design Suite guides, ChipScope Pro analyzer manuals, and embedded development kit resources for PowerPC processor utilization. Package and pinout information is available in both PDF and CAD-readable formats to facilitate PCB layout and design verification.
Related Resources
The XC2VP70-7FFG1704I ecosystem includes various development boards, IP cores, and software tools that accelerate design implementation. Evaluation boards featuring the XC2VP70-7FFG1704I provide immediate access to device capabilities for prototyping and proof-of-concept development.
Compatible IP cores include high-performance DSP functions, communication protocol stacks, and processor peripherals that can be integrated into custom designs. The Xilinx LogiCORE IP portfolio offers pre-verified components that reduce development time and improve design reliability.
Software support includes ISE Design Suite for FPGA implementation, EDK (Embedded Development Kit) for PowerPC processor development, and ChipScope Pro for on-chip debugging and analysis. Third-party EDA tools from major vendors also provide comprehensive support for XC2VP70-7FFG1704I-based designs.
Environmental & Export Classifications
The XC2VP70-7FFG1704I meets stringent environmental and regulatory requirements for industrial applications. The device complies with RoHS (Restriction of Hazardous Substances) directive, ensuring environmental responsibility in manufacturing and disposal processes.
Export classification information indicates that the XC2VP70-7FFG1704I may be subject to export control regulations depending on the destination country and intended application. Designers should consult current export control guidelines and obtain necessary approvals for international shipments or applications in restricted markets.
Environmental operating conditions specify the industrial temperature range of -40ยฐC to +85ยฐC junction temperature, with appropriate derating for high-temperature operation. The device is qualified for moisture sensitivity level 3 (MSL3) according to JEDEC standards, requiring proper handling and storage procedures to prevent moisture-related reliability issues.
The XC2VP70-7FFG1704I represents a powerful solution for applications requiring high-performance FPGA capabilities combined with embedded processing functionality. Its comprehensive feature set, robust specifications, and extensive ecosystem support make it an excellent choice for demanding industrial, communications, and signal processing applications.
