The XC2VP70-6FFG1517C is a premium field-programmable gate array (FPGA) from Xilinx’s acclaimed Virtex-II Pro series, engineered for demanding applications requiring exceptional processing power and versatility. This advanced FPGA delivers robust performance for telecommunications, aerospace, defense, and high-end computing applications.
Product Specifications
The XC2VP70-6FFG1517C features a comprehensive set of specifications that make it ideal for complex digital signal processing and system integration:
Core Architecture:
- 70,000 system gates providing extensive logic capacity
- Advanced Virtex-II Pro architecture with embedded PowerPC processors
- High-speed I/O capabilities for demanding interface requirements
- Integrated block RAM for efficient memory utilization
Package Details:
- FFG1517 package type in fine-pitch ball grid array (FBGA) format
- 1517-pin configuration for maximum connectivity options
- Speed grade -6 for optimal performance characteristics
- Commercial temperature range operation
Performance Features:
- Low power consumption with advanced power management
- High-speed serial connectivity support
- Flexible clocking architecture with multiple clock domains
- Built-in configuration memory and debugging capabilities
Price Information
The XC2VP70-6FFG1517C is positioned as a premium FPGA solution, with pricing reflecting its advanced capabilities and high-performance specifications. Contact authorized Xilinx distributors for current pricing, volume discounts, and availability information. Pricing varies based on order quantity, delivery requirements, and market conditions.
Documents & Media
Technical Documentation:
- XC2VP70-6FFG1517C datasheet with complete electrical specifications
- Virtex-II Pro family user guide and reference manual
- Package and pinout documentation for FFG1517 configuration
- Design guidelines and best practices documentation
Development Resources:
- Xilinx ISE Design Suite compatibility information
- Reference designs and application notes
- Timing analysis and constraint files
- Package footprint and layout guidelines
Support Materials:
- Product change notifications and errata documents
- Quality and reliability reports
- Thermal management guidelines
- EMI/EMC compliance documentation
Related Resources
Development Tools:
- Xilinx ISE Design Suite for FPGA development
- ChipScope Pro for in-system debugging
- EDK (Embedded Development Kit) for PowerPC development
- ModelSim simulation software compatibility
Compatible Products:
- Virtex-II Pro family evaluation boards
- Development and prototyping platforms
- Programming cables and configuration devices
- Memory and interface components
Application Areas:
- Digital signal processing applications
- Telecommunications infrastructure equipment
- Aerospace and defense systems
- High-performance computing solutions
- Industrial automation and control systems
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant for environmental responsibility
- REACH regulation compliance for chemical safety
- Commercial temperature range: 0ยฐC to +85ยฐC
- Moisture sensitivity level and storage requirements specified
Export Classifications:
- Export control classification number (ECCN) as per US regulations
- Country of origin marking and documentation
- Compliance with international trade regulations
- Dual-use technology considerations for certain applications
Quality Standards:
- ISO 9001 manufacturing quality certification
- Automotive-grade reliability testing where applicable
- Conflict minerals compliance reporting
- Full traceability and quality documentation
The XC2VP70-6FFG1517C represents Xilinx’s commitment to delivering cutting-edge FPGA technology that meets the most demanding performance requirements while maintaining environmental responsibility and regulatory compliance. This versatile solution provides the foundation for next-generation electronic systems across multiple industries.
