Product Specification
The XC2VP70-6FF1704I is a premium field-programmable gate array (FPGA) from Xilinx’s Virtex-II Pro family, engineered for demanding applications requiring exceptional processing power and flexibility. This industrial-grade device features a robust -6 speed grade rating, ensuring reliable performance in challenging environments.
Key specifications of the XC2VP70-6FF1704I include:
Core Architecture: Built on advanced Virtex-II Pro technology, this FPGA delivers 70,000 logic cells with integrated PowerPC processors, making it ideal for system-on-chip (SoC) implementations. The device incorporates high-speed serial transceivers and abundant I/O resources to support complex digital signal processing applications.
Package Configuration: The FF1704 package provides 1704 pins in a flip-chip ball grid array (BGA) format, offering maximum connectivity options while maintaining compact footprint requirements. This fine-pitch BGA packaging ensures excellent thermal performance and signal integrity.
Operating Conditions: The industrial temperature range (-40ยฐC to +100ยฐC) qualification makes the XC2VP70-6FF1704I suitable for harsh environmental conditions where commercial-grade components would fail. The device operates reliably across extended voltage ranges with built-in power management features.
Performance Characteristics: With its -6 speed grade, this FPGA achieves superior timing performance, enabling implementation of high-frequency designs up to several hundred MHz. The architecture supports parallel processing capabilities essential for real-time applications.
Price
The XC2VP70-6FF1704I pricing varies based on quantity, distributor, and current market conditions. As a specialized industrial-grade component, expect premium pricing reflecting its advanced capabilities and reliability standards. For accurate pricing information:
- Contact authorized Xilinx distributors for volume pricing
- Consider lead times, as this mature product may have extended availability
- Compare pricing across multiple suppliers to ensure competitive rates
- Factor in additional costs for programming, testing, and support tools
Enterprise customers often benefit from negotiated pricing agreements, especially for large-volume deployments or long-term contracts.
Documents & Media
Essential documentation for the XC2VP70-6FF1704I includes:
Datasheet: The official Xilinx datasheet provides comprehensive electrical specifications, timing parameters, and package information. This document serves as the primary reference for design engineers implementing the XC2VP70-6FF1704I in their systems.
User Guide: Detailed implementation guidelines covering design flow, configuration options, and best practices for maximizing device performance. The user guide includes practical examples and troubleshooting recommendations.
Package Information: Mechanical drawings, pin assignments, and thermal characteristics specific to the FF1704 package. This documentation is crucial for PCB layout and mechanical design considerations.
Application Notes: Xilinx provides numerous application notes demonstrating specific use cases, optimization techniques, and integration strategies relevant to Virtex-II Pro devices.
Development Tools: Access to Xilinx ISE Design Suite documentation, including synthesis, implementation, and debugging tool references specific to the XC2VP70-6FF1704I.
Related Resources
The XC2VP70-6FF1704I ecosystem includes various supporting resources:
Development Boards: Evaluation platforms and reference designs enable rapid prototyping and proof-of-concept development. These boards typically include the XC2VP70-6FF1704I along with supporting circuitry, connectors, and debugging interfaces.
IP Cores: Xilinx and third-party intellectual property cores provide pre-verified functionality for common applications such as DSP, networking, and video processing. These cores accelerate development while ensuring reliable operation.
Software Tools: The Xilinx development environment includes specialized tools for FPGA design, simulation, and verification. Updated software versions may provide enhanced support for the XC2VP70-6FF1704I.
Training Resources: Technical training materials, webinars, and certification programs help engineers maximize their proficiency with Virtex-II Pro devices and associated development tools.
Community Support: Online forums, user groups, and technical communities provide valuable peer support and knowledge sharing for XC2VP70-6FF1704I implementations.
Environmental & Export Classifications
The XC2VP70-6FF1704I meets stringent environmental and regulatory requirements:
Environmental Compliance: This device complies with RoHS (Restriction of Hazardous Substances) directives, ensuring minimal environmental impact through restricted use of hazardous materials in manufacturing processes.
Temperature Classification: Industrial temperature range qualification (-40ยฐC to +100ยฐC) enables deployment in automotive, aerospace, and industrial applications where extended temperature operation is required.
Quality Standards: The device meets automotive and industrial quality standards, including appropriate screening and testing procedures to ensure long-term reliability in mission-critical applications.
Export Classifications: As a high-performance FPGA, the XC2VP70-6FF1704I may be subject to export control regulations. Customers should verify current export classification status and obtain necessary licenses for international shipments, particularly to restricted countries or end-users.
Packaging Standards: The device packaging meets international standards for handling, shipping, and storage, including moisture sensitivity level (MSL) ratings and electrostatic discharge (ESD) protection requirements.
