The XC2VP70-5FFG1704C is a premium field-programmable gate array (FPGA) from Xilinx’s Virtex-II Pro series, engineered to deliver exceptional processing power for demanding digital signal processing and embedded system applications. This advanced FPGA combines high-density logic resources with embedded PowerPC processors, making it an ideal choice for complex telecommunications, aerospace, and industrial control systems.
Product Specification
The XC2VP70-5FFG1704C features robust specifications that set it apart in the FPGA market. This device incorporates 70,000 logic cells with a -5 speed grade, ensuring optimal performance for time-critical applications. The FPGA utilizes a 1704-pin Fine-Pitch Ball Grid Array (FBGA) package, providing extensive I/O capabilities for complex interfacing requirements.
Key technical specifications of the XC2VP70-5FFG1704C include dual embedded PowerPC 405 processors operating at up to 450 MHz, 328 dedicated 18×18 multipliers for high-speed arithmetic operations, and 4.1 Mb of distributed block RAM. The device supports multiple I/O standards including LVDS, SSTL, and HSTL, enabling seamless integration with various system architectures.
The XC2VP70-5FFG1704C operates across a commercial temperature range of 0ยฐC to 85ยฐC, with power consumption optimized for demanding applications. Its advanced 90nm process technology ensures reliable performance while maintaining power efficiency across extended operational periods.
Price
Pricing for the XC2VP70-5FFG1704C varies based on quantity, supplier, and current market conditions. As a high-end FPGA from the Virtex-II Pro series, this device typically commands premium pricing reflecting its advanced capabilities and embedded processor features. Volume discounts are generally available for production quantities, with pricing tiers often starting at 100, 500, and 1000+ unit volumes.
For current XC2VP70-5FFG1704C pricing information, customers should consult authorized Xilinx distributors or electronic component suppliers. Pricing factors include lead times, packaging options, and specific speed grade requirements that may affect final costs.
Documents & Media
Comprehensive documentation supports the XC2VP70-5FFG1704C implementation and development process. The primary datasheet provides detailed electrical characteristics, pinout information, and timing specifications essential for system design. Additional documentation includes the Virtex-II Pro User Guide, which offers in-depth architectural details and design guidelines.
Development resources for the XC2VP70-5FFG1704C include reference designs, application notes, and design constraint files compatible with Xilinx ISE Design Suite. Power estimation tools and thermal analysis guidelines help engineers optimize system performance while ensuring reliable operation.
Configuration and programming documentation covers JTAG programming procedures, bitstream generation, and debugging techniques specific to the XC2VP70-5FFG1704C. These resources streamline the development process from initial design through production deployment.
Related Resources
The XC2VP70-5FFG1704C ecosystem includes numerous development tools and support resources. Xilinx ISE Design Suite provides comprehensive synthesis, implementation, and verification tools optimized for Virtex-II Pro devices. The Embedded Development Kit (EDK) specifically supports PowerPC processor development within the FPGA fabric.
Evaluation boards and development kits featuring the XC2VP70-5FFG1704C or similar Virtex-II Pro devices enable rapid prototyping and system validation. These platforms typically include reference designs, example projects, and hardware debugging capabilities.
Third-party IP cores and design services complement the XC2VP70-5FFG1704C development environment, offering pre-verified functional blocks for common applications such as digital signal processing, networking protocols, and memory controllers.
Environmental & Export Classifications
The XC2VP70-5FFG1704C complies with international environmental standards including RoHS directive compliance for lead-free manufacturing. The device meets JEDEC moisture sensitivity level requirements and standard ESD protection specifications for safe handling during manufacturing and assembly processes.
Export classification for the XC2VP70-5FFG1704C falls under standard semiconductor export control regulations. The device is classified as dual-use technology, which may require export licensing for certain international destinations or applications. Customers should verify current export control requirements based on their specific application and target markets.
Environmental operating specifications for the XC2VP70-5FFG1704C include commercial temperature range operation with appropriate derating for extended temperature applications. The device packaging meets standard industry reliability requirements with specified mean time between failures (MTBF) ratings for mission-critical applications.
Quality and reliability testing for the XC2VP70-5FFG1704C follows automotive and industrial standards, ensuring consistent performance across production lots. The device undergoes comprehensive testing including functional verification, timing validation, and environmental stress screening before shipment.
