Product Specifications
The XC2VP70-5FFG1517I is a high-performance field-programmable gate array (FPGA) from Xilinx’s Virtex-II Pro family, designed for demanding applications requiring advanced processing capabilities and multi-gigabit connectivity.
Key Technical Specifications
- Logic Cells: 74,448 logic cells
- Package Type: 1517-pin Fine Pitch Ball Grid Array (FCBGA)
- I/O Count: 964 user I/O pins
- Technology: 0.13ยตm CMOS nine-layer copper process
- Core Voltage: 1.5V
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
- Speed Grade: -5 (1050MHz maximum frequency)
- RocketIO Transceivers: Up to 20 high-speed serial transceivers
- Embedded Processors: PowerPC RISC CPU blocks
- Package Designation: FFG1517I (Fine Pitch FCBGA, 1517 pins, Industrial grade)
Architecture Features
The XC2VP70-5FFG1517I incorporates advanced Virtex-II Pro architecture optimized for platform-based designs:
- Multi-Gigabit Transceivers: Integrated RocketIO transceivers supporting data rates up to 3.125 Gbps
- Embedded PowerPC Processors: 32-bit RISC processors for embedded processing applications
- DSP Capabilities: Enhanced multiply-accumulate functionality for digital signal processing
- Memory Resources: Distributed and block RAM for data storage and buffering
- Clock Management: Advanced digital clock management (DCM) units
Application Areas
- Telecommunications infrastructure
- Wireless communication systems
- Networking equipment
- Video processing applications
- Digital signal processing (DSP)
- High-performance computing
- Industrial automation
Pricing
Pricing for the XC2VP70-5FFG1517I varies by quantity, supplier, and market conditions. As a specialized industrial-grade FPGA component, pricing typically ranges from several hundred to over a thousand dollars per unit for small quantities.
Pricing Factors:
- Order quantity (volume discounts available)
- Lead time requirements
- Market availability
- Distributor margins
- Package and grade specifications
For current pricing and availability, contact authorized distributors or request quotes from verified suppliers. Many suppliers offer competitive pricing for bulk orders and provide real-time inventory status.
Documents & Media
Technical Documentation
- Primary Datasheet: Virtex-II Pro Platform FPGA Complete Data Sheet (DS083)
- User Guide: Virtex-II Pro and Virtex-II Pro X Platform FPGAs User Guide
- Configuration Guide: Virtex-II Pro Configuration User Guide
- Package Information: FF1517 Package Specifications and Pin Assignment
- Design Guidelines: Virtex-II Pro PCB Design Guidelines
Development Tools
- ISE Design Suite: Complete FPGA development environment
- EDK (Embedded Development Kit): For PowerPC processor development
- ChipScope Pro: Hardware debugging and verification tool
- ModelSim: Simulation and verification software
- Synthesis Tools: XST (Xilinx Synthesis Technology) support
Reference Designs
- Networking reference designs
- DSP application examples
- Communication system templates
- Embedded processor examples
Related Resources
Development Boards and Kits
While specific development boards for the XC2VP70-5FFG1517I may be limited due to the specialized nature of this device, related development platforms include:
- Virtex-II Pro Development Boards: Various third-party boards supporting Virtex-II Pro devices
- Evaluation Modules: Custom evaluation platforms for specific applications
- Reference Design Platforms: Industry-specific development platforms
Software Support
- Vivado Design Suite: Next-generation design tools (for newer devices)
- ISE Design Suite: Legacy support for Virtex-II Pro family
- SDK (Software Development Kit): For embedded processor development
- PetaLinux: Embedded Linux development tools
Training and Support
- Technical documentation and application notes
- Online training courses and tutorials
- Community forums and support resources
- Field Application Engineer (FAE) support
Compatible Devices
- Other Virtex-II Pro family members (XC2VP50, XC2VP100)
- Virtex-II Pro X devices with enhanced transceivers
- Pin-compatible alternatives in different speed grades
Environmental & Export Classifications
Environmental Ratings
- Operating Temperature Range: -40ยฐC to +100ยฐC (Industrial grade)
- Storage Temperature Range: -65ยฐC to +150ยฐC
- Humidity: 10% to 85% non-condensing
- Thermal Resistance: Package-dependent specifications available in datasheet
Compliance Standards
- RoHS Compliant: Lead-free package options available
- REACH Compliance: Meets European chemical regulations
- Conflict Minerals: Compliant with Section 1502 of the Dodd-Frank Act
- Quality Standards: ISO 9001 certified manufacturing
Export Control Information
- ECCN (Export Control Classification Number): Varies by configuration and capabilities
- Export Licensing: May require export licenses for certain countries and applications
- ITAR Status: Not subject to International Traffic in Arms Regulations (ITAR)
- Country of Origin: Manufactured in various locations subject to Xilinx/AMD supply chain
Package and Handling
- Moisture Sensitivity Level (MSL): MSL 3 (168 hours at 30ยฐC/60% RH)
- ESD Protection: Class 1C (>1000V HBM, >200V MM)
- Package Marking: Standard Xilinx marking with part number, date code, and lot code
- Shipping: Anti-static packaging and ESD protection standard
Reliability and Lifecycle
- MTBF (Mean Time Between Failures): >1,000,000 hours at operating conditions
- Product Lifecycle: Legacy product with limited availability
- Recommended for New Designs: No (superseded by newer FPGA families)
- Long-Term Support: Available through authorized distributors and surplus suppliers
The XC2VP70-5FFG1517I represents proven FPGA technology for legacy applications requiring high-performance processing and multi-gigabit connectivity. While newer FPGA families offer enhanced capabilities, this device continues to serve critical applications in telecommunications, networking, and industrial systems.
