The XC2VP7-FF896C is a cutting-edge Field-Programmable Gate Array (FPGA) from Xilinx’s renowned Virtex-II Pro series, engineered to deliver exceptional performance for demanding digital signal processing and embedded system applications. This versatile programmable logic device combines advanced architecture with robust functionality, making it an ideal choice for telecommunications, aerospace, defense, and industrial automation projects.
Product Specification
The XC2VP7-FF896C features a comprehensive set of technical specifications that establish it as a premium FPGA solution. This device incorporates 4,928 configurable logic blocks (CLBs) with 19,712 logic cells, providing substantial processing capability for complex digital designs. The FPGA includes 44 dedicated 18×18 multipliers and 44 Block RAM modules, each offering 18 Kbits of memory for efficient data storage and manipulation.
Built on advanced 90nm process technology, the XC2VP7-FF896C operates at core voltages of 1.5V with I/O voltages supporting multiple standards including 3.3V, 2.5V, 1.8V, and 1.5V levels. The device features 396 user I/O pins in the FF896 package, providing extensive connectivity options for interfacing with external components and systems.
The XC2VP7-FF896C supports maximum operating frequencies up to 420 MHz, enabling high-speed digital signal processing applications. The device includes two embedded PowerPC 405 processors running at up to 300 MHz, making it suitable for processor-intensive applications requiring both hardware acceleration and software flexibility.
Price
The XC2VP7-FF896C is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities and performance specifications. Current market pricing for the XC2VP7-FF896C typically ranges from $800 to $1,200 per unit, depending on order quantity, supplier, and specific commercial terms. Volume purchasing opportunities are available for customers requiring larger quantities, with significant cost reductions possible for orders exceeding 100 units.
Pricing may vary based on package options, speed grades, and temperature specifications. The commercial temperature range version (0ยฐC to +85ยฐC) represents the standard pricing tier, while extended temperature range variants command premium pricing. Customers should contact authorized Xilinx distributors for current pricing information and volume discount schedules.
Documents & Media
Comprehensive technical documentation is available for the XC2VP7-FF896C, including detailed datasheets, user guides, and application notes. The primary datasheet provides complete electrical characteristics, timing specifications, and package information essential for design implementation. Xilinx provides extensive development tools documentation, including ISE Design Suite guides and constraint file templates.
Application notes covering specific use cases such as high-speed serial I/O implementation, embedded processor integration, and power management optimization are available through Xilinx’s technical library. Reference designs and example projects demonstrate practical implementation techniques for common applications including digital signal processing, communications protocols, and embedded system development.
Video tutorials and webinar recordings provide additional learning resources for engineers working with the XC2VP7-FF896C. These multimedia resources cover topics from basic FPGA concepts to advanced implementation strategies specific to the Virtex-II Pro architecture.
Related Resources
The XC2VP7-FF896C ecosystem includes numerous complementary products and development resources that enhance its utility in system designs. Compatible development boards such as the ML310 and ML403 provide immediate prototyping capabilities with pre-configured hardware interfaces and example designs.
Xilinx’s ISE Design Suite offers comprehensive design entry, synthesis, and implementation tools specifically optimized for the XC2VP7-FF896C architecture. The software includes timing analysis tools, power estimation utilities, and debugging capabilities essential for successful FPGA implementation.
Third-party IP cores are available for common functions including DDR memory controllers, Ethernet MAC implementations, and various communication protocol stacks. These pre-verified IP solutions accelerate development timelines and reduce design risk for the XC2VP7-FF896C platform.
Training courses and certification programs provide structured learning paths for engineers developing expertise with the XC2VP7-FF896C and related Virtex-II Pro devices. These educational resources cover both theoretical concepts and practical implementation techniques.
Environmental & Export Classifications
The XC2VP7-FF896C meets stringent environmental and reliability standards required for commercial and industrial applications. The device is RoHS compliant and meets JEDEC standards for moisture sensitivity and electrostatic discharge protection. Temperature specifications include commercial (0ยฐC to +85ยฐC) and extended (-40ยฐC to +100ยฐC) operating ranges.
Export classification for the XC2VP7-FF896C falls under ECCN 3A001.a.2, requiring appropriate export licenses for shipment to certain countries and end-use applications. The device complies with US Export Administration Regulations (EAR) and International Traffic in Arms Regulations (ITAR) where applicable.
Environmental testing includes temperature cycling, vibration resistance, and humidity exposure verification according to industry standards. The XC2VP7-FF896C demonstrates excellent reliability characteristics with Mean Time Between Failures (MTBF) ratings exceeding 1 million hours under normal operating conditions.
Quality certifications include ISO 9001 manufacturing standards and AS9100 aerospace quality requirements where applicable. The device undergoes comprehensive testing including functional verification, parametric testing, and accelerated aging to ensure consistent performance across production lots.
The XC2VP7-FF896C represents a proven solution for advanced FPGA applications requiring high performance, reliability, and extensive I/O capabilities. Its combination of embedded processors, abundant logic resources, and robust development ecosystem makes it an excellent choice for next-generation digital system designs.
