The XC2VP7-6FF672C is a high-performance field-programmable gate array (FPGA) from Xilinx’s Virtex-II Pro family, designed for demanding applications requiring advanced processing capabilities and flexible programmable logic. This powerful FPGA combines traditional programmable logic with embedded PowerPC processors, making it ideal for complex digital signal processing, telecommunications, and high-speed data processing applications.
Product Specification
The XC2VP7-6FF672C features a robust architecture built on advanced 90nm process technology. This FPGA contains 4,928 logic cells and 44 dedicated 18×18 multipliers, providing exceptional computational power for mathematical operations and signal processing tasks. The device includes 792 Kbits of distributed RAM and supports high-speed I/O operations through its 396 user I/O pins.
Key specifications of the XC2VP7-6FF672C include dual embedded PowerPC 405 processors running at speeds up to 400 MHz, enabling software-based functionality alongside hardware acceleration. The device supports various I/O standards including LVDS, GTL, and SSTL, ensuring compatibility with diverse system requirements. The FF672 package provides a fine-pitch ball grid array configuration measuring 27mm x 27mm, optimizing board space utilization while maintaining excellent thermal performance.
The speed grade -6 designation indicates this device operates at moderate speed performance levels, making it suitable for applications where power efficiency and cost-effectiveness are prioritized over maximum speed. The commercial temperature range ensures reliable operation from 0ยฐC to 85ยฐC, meeting standard industrial application requirements.
Price
Pricing for the XC2VP7-6FF672C varies based on quantity, packaging options, and supplier relationships. Contact authorized Xilinx distributors for current pricing information, as costs fluctuate based on market conditions and volume commitments. Educational institutions and development teams may qualify for special pricing programs. For accurate pricing specific to your requirements, request quotes from multiple suppliers to ensure competitive rates.
Documents & Media
Comprehensive documentation supports the XC2VP7-6FF672C implementation and development process. The official Xilinx datasheet provides detailed electrical characteristics, timing specifications, and package information essential for board design and system integration. Application notes cover specific implementation guidance for common use cases, including DSP applications, embedded processor integration, and high-speed I/O design.
Development tools include Xilinx ISE Design Suite compatibility, enabling complete design flow from HDL synthesis through place-and-route implementation. The Embedded Development Kit (EDK) supports PowerPC processor development, providing software tools, libraries, and reference designs. Technical reference manuals detail the PowerPC processor architecture and system integration requirements.
Additional resources include evaluation boards, demonstration designs, and community forums where engineers share implementation experiences and solutions. Video tutorials and webinar recordings provide visual learning resources for both beginner and advanced users working with the XC2VP7-6FF672C.
Related Resources
The XC2VP7-6FF672C integrates seamlessly with Xilinx’s broader ecosystem of development tools, IP cores, and compatible devices. ChipScope Pro software enables real-time debugging and signal analysis, crucial for complex system verification. The extensive library of IP cores includes communication protocols, signal processing functions, and interface controllers that accelerate development timelines.
Compatible evaluation platforms include the Virtex-II Pro development boards, which provide ready-to-use hardware for prototyping and demonstration purposes. Third-party development boards from various manufacturers offer alternative form factors and feature sets tailored to specific application domains.
Training resources include online courses, certification programs, and hands-on workshops that help engineers maximize their proficiency with the XC2VP7-6FF672C. The Xilinx University Program provides academic resources and support for educational institutions incorporating FPGA technology into their curricula.
Environmental & Export Classifications
The XC2VP7-6FF672C meets stringent environmental standards ensuring reliable operation across diverse deployment scenarios. RoHS compliance confirms the device contains no restricted hazardous substances, supporting environmentally responsible manufacturing practices. The commercial temperature grade ensures stable operation within the 0ยฐC to 85ยฐC range, suitable for most indoor and controlled environment applications.
Export classification follows standard semiconductor industry protocols, with specific classifications varying by destination country and end-use application. The device typically falls under standard export control regulations for commercial electronic components. Users should verify current export requirements with appropriate regulatory authorities before international shipment or deployment.
Environmental testing includes thermal cycling, humidity resistance, and mechanical shock verification, ensuring the XC2VP7-6FF672C maintains performance integrity under normal operating conditions. The device packaging materials are selected for long-term reliability and compatibility with standard PCB assembly processes.
Power consumption characteristics support energy-efficient system design, with various power management features enabling optimization for battery-powered or thermally constrained applications. The XC2VP7-6FF672C represents a balance of performance, power efficiency, and cost-effectiveness within the Virtex-II Pro family, making it an excellent choice for applications requiring embedded processing capability combined with programmable logic flexibility.
