The XC2VP7-5FFG896I is a cutting-edge field-programmable gate array (FPGA) from Xilinx’s acclaimed Virtex-II Pro series, designed to deliver exceptional performance for demanding digital signal processing, telecommunications, and embedded processing applications. This industrial-grade FPGA combines programmable logic with integrated PowerPC processors, making it an ideal solution for complex system designs requiring both flexibility and processing power.
Product Specification
The XC2VP7-5FFG896I features a robust architecture built on advanced 90nm process technology. This FPGA contains 4,928 logic cells with 44,096 system gates, providing substantial computational resources for complex algorithms and data processing tasks. The device includes 792 Kbits of Block RAM, offering efficient on-chip memory storage for buffering and temporary data storage requirements.
Key technical specifications include a 896-pin Fine-Pitch Ball Grid Array (FFBGA) package measuring 35mm x 35mm, designed for high-density PCB layouts. The XC2VP7-5FFG896I operates across an industrial temperature range of -40ยฐC to +100ยฐC, ensuring reliable performance in harsh environmental conditions. The device supports multiple I/O standards including LVDS, LVTTL, and LVCMOS, with 396 user I/O pins available for system connectivity.
The integrated PowerPC 405 processor core operates at speeds up to 300 MHz, providing embedded processing capabilities directly within the FPGA fabric. This processor integration eliminates the need for external microcontrollers in many applications, reducing system complexity and board space requirements. The XC2VP7-5FFG896I also includes dedicated multiplier blocks and digital clock managers for enhanced signal processing and clock management functionality.
Price
Pricing for the XC2VP7-5FFG896I varies based on order quantity, delivery requirements, and current market conditions. Industrial-grade FPGAs like the XC2VP7-5FFG896I typically command premium pricing due to their extended temperature range and enhanced reliability specifications. Volume discounts are available for production quantities, with pricing tiers beginning at 100-piece volumes.
For current pricing information and volume quotations, customers should contact authorized Xilinx distributors or visit official pricing portals. Lead times may vary depending on inventory levels and production schedules, with standard delivery typically ranging from 8-16 weeks for custom orders.
Documents & Media
Comprehensive technical documentation supports the XC2VP7-5FFG896I implementation process. The primary datasheet provides detailed electrical specifications, timing parameters, and package information essential for design planning. Pin-out diagrams and package drawings are available in multiple CAD formats, including Altium Designer and Cadence libraries.
Design methodology guides offer step-by-step instructions for implementing designs using Xilinx ISE Development Suite. These documents cover synthesis, place-and-route, and timing closure techniques specific to Virtex-II Pro architecture. Application notes address common design challenges and provide proven solutions for power management, signal integrity, and thermal considerations.
Reference designs demonstrate practical implementations of the XC2VP7-5FFG896I in various applications, including digital communication systems, image processing platforms, and motor control applications. These examples include complete source code, constraint files, and validation reports to accelerate development timelines.
Related Resources
The XC2VP7-5FFG896I integrates seamlessly with Xilinx’s comprehensive development ecosystem. ISE Design Suite provides the primary development environment, offering synthesis, implementation, and debugging tools optimized for Virtex-II Pro devices. ChipScope Pro enables real-time signal monitoring and debugging within the FPGA fabric, essential for complex system validation.
Evaluation boards and development kits featuring the XC2VP7-5FFG896I are available from Xilinx and third-party vendors. These platforms provide immediate access to device capabilities and include essential peripherals for rapid prototyping. Support includes reference designs, example code, and detailed user guides to minimize development time.
Third-party IP cores extend the XC2VP7-5FFG896I functionality across numerous application domains. These pre-verified components include communication protocols, signal processing algorithms, and interface controllers that integrate directly with the device architecture. Xilinx Alliance Program partners provide additional specialized IP solutions and design services.
Environmental & Export Classifications
The XC2VP7-5FFG896I meets stringent environmental and regulatory requirements for industrial applications. RoHS compliance ensures lead-free manufacturing processes, while REACH registration confirms chemical safety standards. The device carries industrial temperature grade classification, validating operation across -40ยฐC to +100ยฐC ambient conditions.
Export control classifications designate the XC2VP7-5FFG896I under specific ECCN (Export Control Classification Number) categories. These classifications determine shipping restrictions and licensing requirements for international customers. Standard commercial export licenses typically apply, though specific end-use applications may require additional documentation.
Environmental testing includes thermal cycling, vibration resistance, and humidity exposure validation according to JEDEC standards. The XC2VP7-5FFG896I demonstrates exceptional reliability metrics, with MTBF calculations exceeding 1 million hours under normal operating conditions. Quality certifications include ISO 9001 manufacturing processes and automotive-grade quality systems where applicable.
The device packaging utilizes halogen-free materials and moisture-sensitive level 3 (MSL-3) handling requirements. Proper storage and handling procedures ensure optimal device reliability throughout the supply chain and assembly processes.
