The XC2VP50-6FFG1152C is a powerful Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex-II Pro series, designed to deliver exceptional performance for demanding digital signal processing, communications, and embedded processing applications. This advanced FPGA combines high-speed logic capabilities with integrated PowerPC processors, making it an ideal solution for complex system implementations.
Product Specification
The XC2VP50-6FFG1152C features robust technical specifications that position it as a premium choice for high-performance applications. This FPGA incorporates 50,000 logic cells with a -6 speed grade, ensuring fast signal processing and low propagation delays. The device comes in a 1152-pin Fine-Pitch Ball Grid Array (FFG) package, providing excellent thermal performance and signal integrity.
Key technical specifications of the XC2VP50-6FFG1152C include dual embedded PowerPC 405 processors running at up to 400 MHz, 2,448 Kbits of distributed RAM, and 2,592 Kbits of block RAM. The FPGA supports multiple I/O standards including LVDS, SSTL, and HSTL, with 692 user I/O pins available. The device operates across a temperature range of 0ยฐC to 85ยฐC, making it suitable for commercial applications.
The XC2VP50-6FFG1152C integrates advanced clock management resources with up to 8 Digital Clock Managers (DCMs) and 4 Phase-Locked Loops (PLLs). These features enable precise timing control and clock domain management for complex multi-clock designs. The FPGA also includes 232 dedicated multipliers for high-speed arithmetic operations.
Price
Pricing for the XC2VP50-6FFG1152C varies based on quantity, distributor, and market conditions. The device is typically available through authorized Xilinx distributors and electronic component suppliers. Enterprise customers can access volume pricing through direct Xilinx sales channels.
For current pricing information on the XC2VP50-6FFG1152C, contact authorized distributors or visit the Xilinx official website. Educational institutions and research organizations may qualify for special academic pricing programs. The price reflects the device’s advanced features, integrated processors, and high-performance capabilities.
Documents & Media
Comprehensive documentation supports the XC2VP50-6FFG1152C implementation process. The primary datasheet provides detailed electrical characteristics, timing specifications, and package information. The Virtex-II Pro Platform FPGA User Guide offers extensive guidance on device architecture, configuration, and design methodology.
Additional resources include the XC2VP50-6FFG1152C packaging and pinout documentation, which details pin assignments and mechanical specifications. Application notes cover specific design techniques, power management strategies, and performance optimization methods. The Xilinx ISE Design Suite provides complete development tools and IP cores for the XC2VP50-6FFG1152C.
Technical reference manuals describe the embedded PowerPC processors, memory interfaces, and I/O capabilities. Errata documents outline any known device limitations or workarounds. Video tutorials and webinars demonstrate practical implementation techniques and best practices for the XC2VP50-6FFG1152C.
Related Resources
The XC2VP50-6FFG1152C ecosystem includes various development tools, IP cores, and reference designs. The Xilinx Platform Studio (XPS) provides a complete embedded development environment for PowerPC processor-based designs. ChipScope Pro enables real-time debugging and verification of FPGA implementations.
Compatible IP cores include high-speed communication interfaces, DSP functions, and memory controllers optimized for the XC2VP50-6FFG1152C architecture. Reference designs demonstrate common applications such as digital signal processing, video processing, and communication protocol implementations.
Development boards featuring the XC2VP50-6FFG1152C provide rapid prototyping platforms for system evaluation. Third-party tools and IP vendors offer additional solutions compatible with this FPGA. The Xilinx Alliance Program connects users with certified partners providing complementary products and services.
Environmental & Export Classifications
The XC2VP50-6FFG1152C meets stringent environmental and regulatory requirements for global deployment. The device complies with RoHS (Restriction of Hazardous Substances) directives, ensuring environmentally responsible manufacturing processes. Lead-free packaging options support green electronics initiatives.
Export classification for the XC2VP50-6FFG1152C follows applicable trade regulations and technology transfer restrictions. The device may be subject to export control laws depending on the destination country and end-use application. Customers should consult current export documentation and comply with all applicable regulations.
Environmental operating specifications include commercial temperature range operation and humidity tolerance. The XC2VP50-6FFG1152C packaging provides protection against environmental factors while maintaining reliable operation. Proper handling and storage procedures ensure device longevity and performance consistency.
Quality certifications demonstrate the XC2VP50-6FFG1152C commitment to reliability and manufacturing excellence. The device undergoes comprehensive testing throughout the production process, including electrical, thermal, and environmental stress testing. ISO 9001 certified manufacturing facilities ensure consistent quality standards.
The XC2VP50-6FFG1152C represents a mature, proven FPGA solution for applications requiring high performance, integrated processing capabilities, and reliable operation. Its combination of advanced features, comprehensive support resources, and environmental compliance makes it suitable for diverse commercial and industrial applications.
