Product Overview
The XC2VP4-6FGG456C is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex-II Pro family. This high-performance FPGA delivers exceptional processing capabilities for demanding applications in telecommunications, networking, video processing, and digital signal processing (DSP). Built on advanced 0.13ยตm CMOS technology, the XC2VP4-6FGG456C offers superior performance and reliability for complex digital circuits.
1. Product Specifications
Core Architecture
- Logic Cells: 6,768 programmable logic cells
- Configurable Logic Blocks (CLBs): 752 CLBs for flexible circuit design
- Speed Grade: -6 (high-performance specification)
- Manufacturing Process: 0.13ยตm CMOS nine-layer copper technology
- Operating Voltage: 1.5V
- Maximum Operating Frequency: 1,200 MHz
Memory and Processing Features
- Block SelectRAM+: 28 blocks totaling 504 Kb (516,096 bits) of dedicated RAM
- Embedded Processor: IBM PowerPC 405 processor core (up to 400 MHz)
- Dedicated Multipliers: 12 x 18-bit ร 18-bit multiplier blocks for enhanced DSP performance
- Digital Clock Managers (DCMs): 4 DCMs for precise clock management
Connectivity and I/O
- User I/O Pins: 248 with SelectI/O-Ultra technology
- RocketIO Multi-Gigabit Transceivers: 4 MGTs supporting up to 3.125 Gbps per channel
- Package Type: 456-pin Fine-pitch Ball Grid Array (FBGA)
- Package Code: FGG456 (Fine-pitch BGA, 456 pins)
Operating Conditions
- Junction Temperature Range: -40ยฐC to +100ยฐC
- Storage Temperature: -65ยฐC to +150ยฐC
- Suitable for both commercial and industrial applications
2. Pricing Information
The XC2VP4-6FGG456C is available through authorized distributors and electronic component suppliers. Pricing varies based on:
- Quantity: Volume discounts available for bulk orders
- Market conditions: Pricing fluctuates based on supply and demand
- Lead times: Standard delivery typically 2-8 weeks
- Package condition: New original stock available
For current pricing and availability, contact authorized distributors or request quotes from verified suppliers. The FPGA is classified as a specialty component with pricing reflecting its advanced capabilities and specialized manufacturing process.
3. Documents & Media
Technical Documentation
- Official Datasheet: Comprehensive specifications and electrical characteristics
- User Guide: Implementation guidelines and design recommendations
- Application Notes: Best practices for specific use cases
- Reference Designs: Example implementations and starter projects
Design Tools and Software
- AMD Xilinx Vivado Design Suite: Primary development environment
- ISE Design Tools: Legacy support for established projects
- IP Core Library: Pre-verified intellectual property blocks
- Simulation Models: VHDL and Verilog behavioral models
CAD Models and Resources
- PCB Footprint Libraries: For major CAD platforms
- 3D Models: Mechanical drawings and STEP files
- Pin-out Diagrams: Detailed signal mapping
- Layout Guidelines: PCB design recommendations
4. Related Resources
Development Boards and Evaluation Kits
- Compatible with Virtex-II Pro development platforms
- Third-party evaluation boards available from various vendors
- Reference designs for rapid prototyping
Software Development Tools
- AMD Xilinx Vivado: Modern FPGA design suite with synthesis and implementation
- Platform Studio: Embedded software development environment
- ChipScope Pro: Logic analyzer for in-system debugging
- ModelSim: Industry-standard simulation platform
Technical Support
- AMD Xilinx technical forums and community support
- Application engineering assistance
- Training resources and webinars
- Migration guides from previous FPGA families
Compatible Products
- Other Virtex-II Pro family members (XC2VP2, XC2VP7, XC2VP20, etc.)
- Supporting components: configuration memories, power supplies
- Development tools and accessories
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Check with manufacturer for current status
- REACH Regulation: Complies with EU chemical safety requirements
- Environmental Classification: Industrial grade components
- Packaging: Anti-static protection and ESD-safe handling required
Export Control Information
- ECCN Classification: Subject to U.S. Export Administration Regulations (EAR)
- Typical Classifications: May fall under 3A991 or 3A001 categories depending on configuration
- Export Restrictions: Subject to export controls for certain countries and end-uses
- Compliance Requirements: Exporters must verify appropriate classification
Trade Compliance
- Country Group Restrictions: Limited export to Country Groups D and E
- End-User Screening: Required for sensitive applications
- Re-export Controls: Subject to U.S. and international trade regulations
- Documentation: Proper export documentation required for international shipments
Important Notice
Export control classifications may change without notice. It is the responsibility of the exporter to determine and declare appropriate classifications per applicable laws and regulations. For specific ECCN and trade compliance information, contact AMD Xilinx directly or consult with export compliance professionals.
Key Features Summary:
- Advanced 0.13ยตm CMOS technology for superior performance
- Embedded PowerPC processor for complex processing tasks
- High-speed RocketIO transceivers for modern communication protocols
- Extensive programmable logic resources with 6,768 logic cells
- Industrial-grade operating temperature range
- Comprehensive development tool support
The XC2VP4-6FGG456C represents a proven solution for high-performance FPGA applications, offering the flexibility of programmable logic combined with the processing power of embedded processors and high-speed connectivity options.
