The XC2VP4-6FG456CES is a cutting-edge Field-Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex-II Pro family, engineered for demanding applications in telecommunications, networking, video processing, and digital signal processing (DSP). This high-performance FPGA delivers exceptional flexibility and processing power for complex digital circuit implementations.
Product Specifications
Core Architecture
- Logic Cells: 6,768 configurable logic cells
- Configurable Logic Blocks (CLBs): 752 CLBs organized in efficient grid structure
- Slices: 1,408 slices for optimized logic implementation
- Speed Grade: -6 (high-performance configuration)
- Technology: Advanced 0.13ฮผm CMOS nine-layer copper process
Memory and Storage
- Block RAM: 28 Block SelectRAM+ blocks totaling 504 Kbit dedicated RAM
- Memory Type: 18-bit x 18-bit block RAM architecture
- Data Buffer Capacity: Extensive buffering for complex algorithms
Processing Capabilities
- Embedded Processor: IBM PowerPC 405 processor core (up to 400 MHz)
- Dedicated Multipliers: 12 dedicated 18×18 multipliers for DSP applications
- Arithmetic Processing: Enhanced capabilities for digital signal processing
High-Speed Connectivity
- RocketIO Transceivers: 4 Multi-Gigabit Transceivers (MGTs)
- Data Rate: Up to 3.125 Gbps per channel
- Serial Communication: High-speed protocols for telecommunications
Input/Output Features
- User I/O Pins: 248 user I/O pins with SelectI/O-Ultra technology
- Package Type: 456-pin Fine-Pitch Ball Grid Array (FBGA)
- I/O Standards: Support for multiple I/O standards and voltage levels
- Clock Management: 4 Digital Clock Managers (DCMs) for precise timing
Operating Conditions
- Supply Voltage: 1.5V core voltage
- Junction Temperature Range: -40ยฐC to +100ยฐC
- Package: Commercial grade (C suffix)
- Operating Frequency: Up to 1200 MHz
Price
The XC2VP4-6FG456CES pricing varies based on quantity and distributor. Key pricing information:
- Availability: In stock at authorized distributors
- Quantity Available: Limited quantities (58+ pieces reported in stock)
- Pricing Model: Request for Quote (RFQ) based on volume requirements
- Lead Time: Typically 5-16 business days for standard orders
- Status: Legacy product – limited production, recommend securing inventory early
Note: Due to the legacy status of this FPGA, prices may vary significantly. Contact authorized distributors for current pricing and availability.
Documents & Media
Technical Documentation
- Official Datasheet: XC2VP4-6FG456CES.pdf (available from Xilinx/AMD)
- User Guide: Virtex-II Pro Platform FPGAs User Guide
- Development Tools: Vivado Design Suite compatibility
- Legacy Support: ISE Design Tools (for older designs)
CAD Models and Design Resources
- ECAD Models: Available for major PCB design software
- Footprint Libraries: 456-pin FBGA package models
- Schematic Symbols: Standard FPGA symbols with pin assignments
- 3D Models: Package dimensions and thermal modeling data
Application Notes
- Power Management: Guidelines for supply voltage and thermal design
- Signal Integrity: High-speed design considerations
- Configuration: Programming and bitstream loading procedures
- Migration Guides: Upgrading from earlier Virtex families
Related Resources
Development Platforms
- Evaluation Boards: Compatible with Virtex-II Pro development boards
- Reference Designs: Telecommunications and networking examples
- IP Cores: Access to Xilinx LogiCORE IP library
- Software Tools: Vivado HLS for high-level synthesis
Compatible Products
- Alternative Speed Grades: XC2VP4-5FG456CES, XC2VP4-7FG456CES
- Package Variants: XC2VP4-6FGG456CES (leaded package option)
- Pin-Compatible Options: XC2VP4-6FG456I (industrial temperature range)
Technical Support
- Community Forums: Xilinx developer community access
- Documentation Portal: Comprehensive technical library
- Application Engineers: Design consultation services
- Training Resources: FPGA design methodology courses
Migration Path
- Newer Alternatives: Recommended migration to Kintex or Virtex UltraScale+ families
- Tool Support: Legacy design migration assistance
- Compatibility: Pin and software compatibility analysis
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: RoHS 6/6 compliant (lead-free)
- REACH Regulation: EU REACH compliant
- Conflict Minerals: Responsible sourcing certification
- Green Initiative: Part of AMD’s environmental sustainability program
Package Information
- Material: Lead-free solder ball construction
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) classification
- Storage Requirements: Anti-static packaging required
- Shelf Life: Standard semiconductor storage guidelines
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- Country of Origin: Manufactured in approved facilities
- Export Restrictions: Subject to US export regulations
- License Requirements: Check current export control lists
Quality and Reliability
- Quality Standard: Manufactured to automotive quality standards
- Reliability Testing: Extensive qualification and stress testing
- Traceability: Full manufacturing lot traceability
- Warranty: Standard semiconductor warranty terms
Thermal Classifications
- Junction Temperature: Commercial grade (-40ยฐC to +100ยฐC)
- Thermal Resistance: Package-specific thermal characteristics
- Power Dissipation: Detailed thermal design guidelines available
- Cooling Requirements: Natural convection to forced air cooling
The XC2VP4-6FG456CES represents proven FPGA technology for mission-critical applications. While newer alternatives are available, this device continues to serve specialized applications requiring its specific feature set and proven reliability.
