The XC2VP4-5FGG256I is a powerful Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex-II Pro family, designed to deliver exceptional performance for demanding applications. This advanced programmable logic device combines high-speed processing capabilities with flexible configuration options, making it ideal for telecommunications, aerospace, defense, and industrial automation systems.
Product Specification
The XC2VP4-5FGG256I features a robust architecture built on Xilinx’s proven Virtex-II Pro platform. This FPGA incorporates advanced 90nm process technology, delivering superior performance while maintaining power efficiency. The device offers substantial logic capacity with distributed RAM and dedicated multipliers, enabling complex digital signal processing and embedded processing applications.
Key specifications include a 256-pin Fine-Pitch Ball Grid Array (FBGA) package configuration, operating across industrial temperature ranges from -40ยฐC to +100ยฐC. The XC2VP4-5FGG256I supports multiple I/O standards and provides flexible clocking resources with integrated Phase-Locked Loops (PLLs) for precise timing control. The device features embedded PowerPC processors, making it suitable for system-on-chip (SoC) implementations.
The FPGA includes configurable logic blocks (CLBs), block RAM resources, and dedicated carry chains for arithmetic operations. High-speed serial connectivity options enable rapid data transfer, while the advanced routing architecture ensures optimal signal integrity across complex designs.
Price
Pricing for the XC2VP4-5FGG256I varies based on order quantity, distribution channel, and current market conditions. Contact authorized Xilinx distributors for current pricing information and volume discounts. Educational institutions and qualifying organizations may be eligible for special pricing programs.
Factors affecting price include packaging options, speed grades, and temperature specifications. The industrial-grade temperature range of the XC2VP4-5FGG256I typically commands a premium over commercial-grade alternatives due to enhanced reliability and extended operating conditions.
Documents & Media
Comprehensive technical documentation supports the XC2VP4-5FGG256I implementation process. The official datasheet provides detailed electrical specifications, timing characteristics, and package information. User guides cover configuration procedures, design methodologies, and best practices for optimal performance.
Application notes demonstrate practical implementation examples, including reference designs and code samples. The Xilinx Development Environment provides integrated design tools, simulation capabilities, and debugging resources specifically optimized for Virtex-II Pro devices.
Technical reference manuals detail the internal architecture, memory organization, and advanced features. Package drawings and mechanical specifications ensure proper PCB layout and thermal management considerations.
Related Resources
The XC2VP4-5FGG256I integrates seamlessly with Xilinx’s comprehensive development ecosystem. The ISE Design Suite provides complete design flow support, from HDL synthesis through place-and-route optimization. ChipScope Pro enables real-time debugging and verification capabilities.
Development boards and evaluation kits accelerate prototyping and proof-of-concept development. These platforms include pre-configured hardware, example designs, and comprehensive documentation to minimize development time.
Third-party IP cores extend functionality for specific applications, including DSP algorithms, communication protocols, and interface standards. The Xilinx IP catalog provides verified, optimized solutions for common design challenges.
Training resources include online tutorials, webinars, and hands-on workshops covering FPGA design fundamentals through advanced implementation techniques.
Environmental & Export Classifications
The XC2VP4-5FGG256I meets stringent environmental and regulatory requirements for industrial applications. The device complies with RoHS directives, ensuring lead-free manufacturing processes and environmental responsibility.
Export classification information is available through official Xilinx channels, with appropriate Export Control Classification Numbers (ECCN) assigned according to international trade regulations. Users must verify compliance with applicable export control laws and regulations based on their specific applications and destinations.
The device maintains operational integrity across extended temperature ranges, with comprehensive qualification testing including thermal cycling, humidity exposure, and mechanical stress validation. Quality certifications ensure consistent performance and reliability in demanding environments.
Environmental considerations include power consumption optimization, thermal management requirements, and end-of-life disposal guidelines. The XC2VP4-5FGG256I supports green design initiatives through efficient power management features and sustainable manufacturing practices.
The XC2VP4-5FGG256I represents Xilinx’s commitment to delivering high-performance, reliable FPGA solutions for mission-critical applications. Contact authorized distributors for availability, pricing, and technical support.
