The XC2VP4-5FG456I is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s renowned Virtex-II Pro family, designed to deliver exceptional performance for demanding digital signal processing, communications, and embedded processing applications. This industrial-grade FPGA combines high-speed processing capabilities with flexible programmability, making it an ideal choice for complex system designs.
Product Specification
The XC2VP4-5FG456I features a robust architecture built on advanced 90nm process technology. This FPGA contains 4,928 logic cells and 88 dedicated 18×18 multipliers, providing substantial computational power for arithmetic-intensive applications. The device includes 556 Kb of block RAM, offering ample on-chip memory for data buffering and storage requirements.
Key specifications of the XC2VP4-5FG456I include a maximum operating frequency that supports high-speed designs, with I/O capabilities spanning multiple voltage standards from 1.2V to 3.3V. The device supports over 200 user I/O pins, enabling connectivity to various external components and systems. Power consumption is optimized for industrial applications, with multiple power management features integrated into the silicon.
The XC2VP4-5FG456I comes in a 456-pin Fine-pitch Ball Grid Array (FBGA) package, providing excellent thermal performance and signal integrity. The industrial temperature grade (-40ยฐC to +85ยฐC) ensures reliable operation in harsh environmental conditions, making it suitable for automotive, aerospace, and industrial control applications.
Price
Pricing for the XC2VP4-5FG456I varies based on order quantity, distribution channel, and current market conditions. The device is typically available through authorized Xilinx distributors and electronic component suppliers. Volume pricing and custom packaging options may be available for large-scale production requirements. Contact authorized distributors for current pricing information and availability status.
Documents & Media
Comprehensive technical documentation supports the XC2VP4-5FG456I implementation process. The official datasheet provides detailed electrical specifications, timing parameters, and package information. Pin-out diagrams and package drawings are available in multiple formats including PDF and CAD-compatible files.
Development resources include reference designs, application notes, and design guidelines specifically tailored for Virtex-II Pro devices. The Xilinx ISE Design Suite provides complete development tools, including synthesis, place-and-route, and timing analysis capabilities. Hardware description language (HDL) templates and IP core libraries accelerate development time and reduce design complexity.
User guides cover topics such as power estimation, thermal management, and PCB design considerations. These resources help engineers optimize their designs for performance, power consumption, and reliability when using the XC2VP4-5FG456I.
Related Resources
The XC2VP4-5FG456I integrates seamlessly with Xilinx’s comprehensive ecosystem of development tools and IP solutions. The Vivado Design Suite offers advanced synthesis and implementation capabilities, while the Xilinx Software Development Kit (SDK) supports embedded software development for integrated processor systems.
Evaluation boards and development kits provide hands-on experience with the XC2VP4-5FG456I architecture. These platforms include reference designs, example projects, and debugging interfaces that accelerate prototype development and proof-of-concept validation.
Third-party tool support includes simulation software, verification tools, and specialized IP cores from Xilinx partners. Training resources, webinars, and technical forums provide ongoing support for engineers working with the XC2VP4-5FG456I and related Virtex-II Pro devices.
Environmental & Export Classifications
The XC2VP4-5FG456I complies with international environmental regulations including RoHS (Restriction of Hazardous Substances) directives. The device meets JEDEC standards for moisture sensitivity and electrostatic discharge protection, ensuring reliable handling and assembly processes.
Export classification information is available through official Xilinx channels, with appropriate Export Control Classification Numbers (ECCN) assigned according to current regulations. The device manufacturing processes follow ISO quality standards and environmental management systems.
Packaging materials are selected for recyclability and environmental responsibility. The XC2VP4-5FG456I supports green manufacturing initiatives while maintaining the high reliability standards required for industrial applications. Conflict minerals compliance documentation is available to support responsible sourcing requirements.
Temperature cycling, humidity resistance, and long-term reliability testing validate the XC2VP4-5FG456I performance across its specified operating range. These qualifications ensure consistent operation in demanding environmental conditions throughout the product lifecycle.
