Product Overview
The XC2VP30-FGG676I is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s renowned Virtex-II Pro family. This advanced FPGA delivers exceptional programmable logic capabilities with integrated multi-gigabit transceivers and PowerPC CPU blocks, making it the ideal solution for demanding telecommunications, wireless, networking, video, and DSP applications.
Built on cutting-edge 0.13ฮผm CMOS nine-layer copper process technology, the XC2VP30-FGG676I offers superior performance and flexibility in a 676-pin Fine-pitch Ball Grid Array (FBGA) package. This industrial-grade device operates reliably across extended temperature ranges, making it suitable for critical embedded applications.
1. Product Specifications
Core Specifications
- Part Number: XC2VP30-FGG676I
- Manufacturer: Xilinx Inc.
- Product Family: Virtex-II Pro FPGA
- Logic Elements/Cells: 30,816 cells
- Configurable Logic Blocks (CLBs): 3,424
- Total RAM Bits: 2,506,752
- Maximum Frequency: Up to 1,050MHz – 1,200MHz (speed grade dependent)
Physical Characteristics
- Package Type: 676-pin Fine-pitch Ball Grid Array (FBGA)
- Package Code: FGG676
- Mounting Type: Surface Mount Technology (SMT)
- Lead-Free Status: RoHS Compliant
Electrical Specifications
- Supply Voltage: 1.425V ~ 1.575V (1.5V nominal)
- Operating Temperature Range: -40ยฐC to +100ยฐC (Industrial grade)
- Number of I/O Pins: 416
- Process Technology: 0.13ฮผm/90nm CMOS
Advanced Features
- Multi-Gigabit Transceivers: Up to 20 RocketIO or RocketIO X embedded MGTs
- PowerPC CPU Blocks: Integrated hard processor cores
- Block RAM: Dedicated memory blocks for high-performance applications
- Clock Management: Advanced clocking resources with Digital Clock Managers (DCMs)
2. Price Information
Current Market Pricing
The XC2VP30-FGG676I pricing varies based on quantity, supplier, and current market conditions:
- Small Quantities (1-10 units): Contact authorized distributors for current pricing
- Medium Quantities (10-100 units): Volume discounts available
- Large Quantities (100+ units): Significant volume pricing available
Authorized Distributors
- Digi-Key Electronics
- Mouser Electronics
- Avnet
- Arrow Electronics
- Various regional distributors worldwide
Note: Pricing is subject to change based on market conditions. For current pricing and availability, please contact authorized Xilinx distributors or submit a Request for Quote (RFQ).
3. Documents & Media
Technical Documentation
- Official Datasheet: XC2VP20-5FGG676C.pdf (430 pages) – Comprehensive specifications
- User Guide: Virtex-II Pro Platform FPGA User Guide
- Programming Guide: Configuration and Programming documentation
- Package Information: Mechanical drawings and pin assignment details
Development Resources
- Pinout Information: Complete pin assignment and electrical characteristics
- Reference Designs: Application-specific reference implementations
- IP Cores: Compatible intellectual property cores
- Design Constraints: Timing and placement constraint files
Software Support
- Development Tools: ISE Design Suite (legacy), Vivado Design Suite (with adapter)
- Programming Tools: Impact, ChipScope Pro
- Simulation Models: VHDL/Verilog behavioral and timing models
4. Related Resources
Development Platforms
- Evaluation Boards: Virtex-II Pro development boards (third-party)
- Starter Kits: Educational and prototyping platforms
- Reference Designs: Telecommunications, networking, and DSP examples
Compatible Products
- Similar Variants:
- XC2VP30-5FGG676I (Speed grade -5)
- XC2VP30-6FGG676I (Speed grade -6)
- XC2VP30-7FGG676I (Speed grade -7)
- Alternative package options: FFG896, FF1152
Application Areas
- Telecommunications: Base station processing, optical networking
- Wireless Communications: Software-defined radio, signal processing
- Video Processing: Broadcasting equipment, video compression
- Industrial Control: High-speed data acquisition, motor control
- Networking: Packet processing, protocol acceleration
Technical Support
- Documentation Portal: Xilinx support website
- Community Forums: FPGA development communities
- Application Notes: Specific implementation guidance
- Training Resources: Webinars and educational materials
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Lead-free and RoHS compliant
- REACH Regulation: Compliant with EU REACH requirements
- Conflict Minerals: Sourced from conflict-free suppliers
- Environmental Management: ISO 14001 certified manufacturing
Operating Conditions
- Temperature Range: -40ยฐC to +100ยฐC (Junction temperature)
- Humidity: Standard industrial specifications
- Altitude: Standard commercial/industrial ratings
- Shock and Vibration: Meets JEDEC standards
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS Code: 8542.31.0001
- Country of Origin: Various (check specific lot)
- Export Restrictions: Subject to US and international export regulations
Quality and Reliability
- Quality Standard: ISO 9001 certified manufacturing
- Reliability Testing: Full qualification per JEDEC standards
- Electrostatic Discharge (ESD): Class 1C (>1000V) protection
- Latch-up Immunity: >100mA at 125ยฐC
Packaging and Handling
- Anti-static Packaging: ESD-safe packaging and handling
- Moisture Sensitivity: Level 3 (168 hours at 30ยฐC/60% RH)
- Storage Temperature: -55ยฐC to +150ยฐC
- Shelf Life: Unlimited with proper storage
Key Benefits of XC2VP30-FGG676I
High Performance: Industry-leading speed and capacity for demanding applications
Integration: Embedded processors and transceivers reduce system complexity
Flexibility: Reconfigurable architecture enables rapid prototyping and updates
Reliability: Industrial-grade specifications for mission-critical applications
Legacy Support: Proven platform with extensive development ecosystem
For technical support, documentation, or purchase inquiries regarding the XC2VP30-FGG676I, please contact authorized Xilinx distributors or visit the official Xilinx support portal.
