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XC2VP2-5FGG256C: High-Performance Virtex-II Pro FPGA for Advanced Applications

Original price was: $20.00.Current price is: $19.00.

The XC2VP2-5FGG256C is a cutting-edge Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex-II Pro family, engineered to deliver exceptional performance for demanding digital signal processing and embedded system applications. This versatile programmable logic device combines advanced architecture with robust functionality to meet the needs of modern electronic designs.

Product Specifications

The XC2VP2-5FGG256C features a comprehensive set of specifications that make it ideal for high-performance applications:

Core Architecture:

  • Logic cells: 2,016 configurable logic blocks
  • System gates: Approximately 60,000
  • Block RAM: 72 Kb distributed across multiple blocks
  • Speed grade: -5 (high-performance variant)
  • Operating voltage: 1.5V core, 3.3V I/O

Package Details:

  • Package type: Fine-pitch Ball Grid Array (FBGA)
  • Pin count: 256 pins
  • Package size: 17mm x 17mm
  • Pitch: 0.8mm ball spacing
  • Temperature range: Commercial grade (0ยฐC to +85ยฐC)

Performance Characteristics:

  • Maximum frequency: Up to 420 MHz
  • Low power consumption with advanced power management
  • High-speed differential I/O support
  • Integrated clock management resources
  • Support for multiple I/O standards including LVDS, SSTL, and HSTL

Price Information

The XC2VP2-5FGG256C is competitively priced for its performance tier within the Virtex-II Pro family. Pricing varies based on order quantity, with volume discounts available for large-scale deployments. For current pricing and availability, contact authorized Xilinx distributors or visit the official Xilinx website. Educational and development discounts may be available for qualifying institutions and prototyping projects.

Documents & Media

Comprehensive documentation and resources are available for the XC2VP2-5FGG256C:

Technical Documentation:

  • Complete datasheet with electrical specifications and timing parameters
  • Pin-out diagrams and package drawings
  • Application notes for optimal design implementation
  • Reference designs and example projects
  • Power consumption analysis and thermal management guides

Development Tools:

  • Xilinx ISE Design Suite compatibility
  • ChipScope Pro debugging support
  • ModelSim simulation models
  • Constraint files and UCF templates
  • Board design guidelines and layout recommendations

Software Resources:

  • IP core libraries and reference implementations
  • Device-specific optimization guides
  • Migration guides from other FPGA families
  • Video tutorials and webinar recordings

Related Resources

The XC2VP2-5FGG256C ecosystem includes various complementary products and resources:

Development Boards:

  • Xilinx evaluation boards featuring the XC2VP2-5FGG256C
  • Third-party development platforms and starter kits
  • Custom carrier boards for specific applications

Compatible Components:

  • Configuration memory devices
  • Power management solutions
  • High-speed connectors and interfaces
  • Debugging and programming cables

Design Services:

  • Xilinx Alliance Program partners
  • FPGA design consulting services
  • Training programs and certification courses
  • Technical support and customer service resources

Environmental & Export Classifications

The XC2VP2-5FGG256C meets stringent environmental and regulatory standards:

Environmental Compliance:

  • RoHS compliant (lead-free manufacturing)
  • WEEE directive compliance
  • Halogen-free package options available
  • Environmental stress testing per JEDEC standards

Export Classifications:

  • Export Control Classification Number (ECCN): 3A001.a.7
  • Harmonized System (HS) code: 8542.39.0001
  • Country of origin: Various (check specific lot markings)
  • Compliance with international trade regulations

Quality Standards:

  • ISO 9001 certified manufacturing
  • Automotive qualification available (AEC-Q100)
  • Military and aerospace grades available
  • Extended temperature range variants

Packaging and Handling:

  • Moisture sensitivity level (MSL): Level 3
  • ESD sensitive device classification
  • Tape and reel packaging for automated assembly
  • Dry pack shipping for humidity-sensitive applications

The XC2VP2-5FGG256C represents an excellent choice for engineers seeking a reliable, high-performance FPGA solution with comprehensive support resources and proven reliability in demanding applications. Its combination of advanced features, competitive pricing, and extensive documentation makes it an ideal component for next-generation electronic systems.