XC2S600E-6FGG676C – AMD Xilinx Spartan-IIE FPGA

1. Product Specifications

Core Features

• Device Family: Spartan-IIE 1.8V FPGA Family
• System Gates: 600,000 gates (maximum)
• Logic Cells: 15,552 logic cells
• CLB Array: 48 x 72 Configurable Logic Blocks (3,456 total CLBs)
• Speed Grade: -6 (Standard Performance)
• Operating Voltage: 1.8V core (VCCINT), 1.5V/2.5V/3.3V I/O (VCCO)
• Temperature Range: Commercial (0°C to +85°C)

Memory Resources

• Block RAM: 288K bits (72 blocks of 4K bits each)
• Distributed RAM: Up to 221,184 bits
• SelectRAM™ Hierarchical Memory: 16 bits/LUT distributed RAM with configurable 4K-bit true dual-port block RAM

I/O Capabilities

• Maximum User I/O: 514 pins
• Differential I/O Pairs: 205 maximum
• I/O Standards Supported: 19 high-performance standards including LVTTL, LVCMOS, HSTL, SSTL, AGP, CTT, GTL, LVDS, and LVPECL
• Package: 676-pin Fine-pitch Ball Grid Array (FBGA)
• Pin Pitch: 1.0mm
• Package Dimensions: 27 x 27 x 2.60mm

Performance Specifications

• Maximum Frequency: Beyond 200 MHz system performance
• Technology Node: 0.15 micron CMOS process
• Architecture: Streamlined features based on Virtex-E FPGA architecture
• Clock Distribution: 4 dedicated global clock networks with DLL support
• Delay-Locked Loops (DLLs): 4 DLLs for advanced clock control and skew elimination

Advanced Features

• Hot Swap Support: CompactPCI friendly hot insertion capability
• Configuration Options: Multiple modes including Master Serial, Slave Serial, Slave Parallel (SelectMAP), and Boundary Scan
• Boundary Scan: IEEE 1149.1 compatible JTAG support
• Unlimited Reprogrammability: In-system reconfiguration capability
• RoHS Compliance: Lead-free and environmentally friendly

2. Price Information

Note: Pricing for XC2S600E-6FGG676C varies by supplier, quantity, and market conditions. This component is considered a legacy part (marked as “NOT RECOMMENDED for NEW DESIGN” as of the latest datasheet revision).

• Market Status: Legacy/Obsolete (discontinued as of August 2013 per XCN12026)
• Availability: Available through authorized distributors and surplus inventory
• Typical Stock: Various distributors report 69-2,780 pieces in stock
• Price Range: Contact authorized distributors for current pricing
• Minimum Order: Varies by supplier

For current pricing and availability, please contact authorized AMD Xilinx distributors or electronic component suppliers.

3. Documents & Media

Official Documentation

• Primary Datasheet: DS077 – Spartan-IIE FPGA Family Data Sheet (August 9, 2013)
• Module 1: Introduction and Ordering Information (DS077-1)
• Module 2: Functional Description (DS077-2)
• Module 3: DC and Switching Characteristics (DS077-3)
• Module 4: Pinout Tables (DS077-4)

Configuration File Size

• Bitstream Size: 3,961,632 bits
• Configuration Memory: Static SRAM-based configuration cells

Package Documentation

• Package Drawing: PK155_FG676 (standard package)
• MDDS: PK111_FGG676 (Pb-free package)
• IBIS Models: Available for signal integrity analysis

Thermal Characteristics

• θJA (Still Air): 14.5°C/W
• θJA (500 LFM): 8.6°C/W
• θJC: 3.4°C/W
• θJB: 6.9°C/W
• Package Mass: 3.1g (±10%)

4. Related Resources

Development Tools

• ISE Development System: Comprehensive design environment with automatic mapping, placement, and routing
• CORE Generator™: IP library including DSP functions and soft processors
• ChipScope Pro: Real-time debugging and analysis tool
• Platform Flash: In-system programmable configuration PROMs

Reference Designs

• Evaluation Boards: XC2S600E development and evaluation platforms
• Application Notes:
  • XAPP179: Using SelectIO Interfaces in Spartan-II and Spartan-IIE FPGAs
  • XAPP174: DLL Usage and Applications
  • XAPP176: Configuration and Readback
  • XAPP450: Power-On Current Requirements

Software Support

• Vivado Design Suite: Latest AMD Xilinx design environment (legacy support)
• ISE WebPACK: Free development software (archived)
• HDL Synthesis: Support for Verilog, VHDL, and SystemVerilog

Migration and Alternatives

Since the XC2S600E-6FGG676C is obsolete, consider these modern alternatives:

• Spartan-7 Series: XC7S25, XC7S50 for new designs
• Artix-7 Series: XC7A25T, XC7A35T for higher performance
• Pin-compatible alternatives: Contact AMD Xilinx for migration recommendations

5. Environmental & Export Classifications

Environmental Compliance

• RoHS Status: Lead-free/RoHS Compliant (Pb-free version available with “G” designator)
• Package Material: Environmentally friendly materials
• Halogen-Free: Available upon request
• REACH Compliance: Meets European chemical safety requirements

Operating Conditions

• Commercial Temperature Range: 0°C to +85°C junction temperature
• Supply Voltage Tolerance: VCCINT ±5%, VCCO application-dependent
• Maximum Junction Temperature: +125°C
• Storage Temperature: -65°C to +150°C

Export Classification

• ECCN: 3A001.A.7.A (US Export Administration Regulations)
• HTS Code: 8542.33.0001 (Harmonized Tariff Schedule)
• Country of Origin: Varies by manufacturing location
• Export License: May be required for certain destinations

Quality Standards

• Manufacturing Standard: ISO 9001:2015 certified facilities
• Reliability: Extensive qualification and reliability testing
• Quality Grade: Commercial grade (C-temp range)
• Traceability: Full manufacturing traceability available

ESD Protection

• ESD Rating: Class 1 (>1000V Human Body Model)
• Handling: ESD precautions required during handling and assembly
• Packaging: Anti-static packaging provided

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The XC2S600E-6FGG676C represents proven FPGA technology for cost-sensitive applications requiring moderate gate counts and comprehensive I/O capabilities. While obsolete for new designs, it remains available through various channels for legacy system support and maintenance.