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XC2S600E-6FGG456Q: Compact High-Performance Spartan-II FPGA for Space-Constrained Applications

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Core Architecture

  • Part Number: XC2S600E-6FGG456Q
  • Family: Xilinx Spartan-II FPGA
  • System Gates: 600,000 gates
  • Logic Cells: 15,552 logic cells
  • Speed Grade: -6 (high-performance grade)
  • Package Type: FGG456 (Fine-pitch Ball Grid Array)
  • Pin Count: 456 pins
  • Temperature Grade: Industrial (-40ยฐC to +85ยฐC)

Memory and Processing Resources

  • Block RAM: 288 Kbits distributed across 32 blocks
  • Distributed RAM: 49,152 bits
  • Input/Output: Up to 333 user I/O pins
  • Global Clock Networks: 4 dedicated global clock networks
  • DLL (Delay Locked Loops): 4 DLLs for precise clock management
  • Multipliers: Dedicated 18×18 multiplier blocks

Performance Characteristics

  • Maximum Operating Frequency: Up to 200 MHz (design dependent)
  • Power Supply: 2.5V core voltage, multiple I/O voltage standards supported
  • Package Dimensions: 23mm x 23mm BGA package
  • Ball Pitch: 1.0mm
  • Moisture Sensitivity Level: MSL-3
  • Junction Temperature: Up to +125ยฐC

Supported I/O Standards

The XC2S600E-6FGG456Q supports comprehensive I/O voltage standards including:

  • LVTTL/LVCMOS (3.3V, 2.5V, 1.8V, 1.5V)
  • PCI (3.3V, 5V tolerant)
  • GTL/GTL+ (Gunning Transceiver Logic)
  • SSTL-2, SSTL-3 (Stub Series Terminated Logic)
  • HSTL Class I, II, III, IV (High Speed Transceiver Logic)
  • Differential signaling standards (LVDS, LVPECL)

Power Consumption

  • Static Power: Typically 50-100mW (standby)
  • Dynamic Power: Varies with utilization and frequency
  • Core Voltage: 2.5V ยฑ5%
  • I/O Voltage: 1.5V to 3.3V (depending on standard)

2. Price

Current Market Pricing

  • Unit Price (1-99 pieces): Contact for current market rates
  • Volume Pricing (100-999 pieces): Quantity discounts available
  • High Volume (1000+ pieces): Substantial volume discounts
  • Lead Time: Typically 6-16 weeks depending on market conditions
  • Minimum Order Quantity: 1 piece
  • Price Currency: USD (subject to market fluctuations)

Cost Considerations

  • Package Premium: FGG456 offers cost savings vs. larger packages
  • Lifecycle Status: Active product with long-term availability
  • Alternative Sourcing: Available through multiple authorized channels

Authorized Distribution Partners

  • Digi-Key Electronics: Global availability, immediate shipping
  • Mouser Electronics: Technical support and rapid delivery
  • Arrow Electronics: Volume pricing and design services
  • Avnet: Complete solution support and engineering services
  • Future Electronics: Specialized in high-volume applications

3. Documents & Media

Technical Documentation Suite

  • Primary Datasheet: XC2S600E Complete Product Specification (DS031-4)
  • Family Overview: Spartan-II FPGA Family Complete Data Sheet
  • Package Documentation: FGG456 Package Specifications and Guidelines
  • Pin Assignment Guide: Complete pinout mapping and constraints

Application Notes and Design Guides

  • XAPP158: Spartan-II FPGA Configuration and Startup Sequences
  • XAPP176: Getting Started with Spartan-II FPGA Design Flow
  • XAPP138: Power Distribution Design for Spartan-II FPGAs
  • XAPP154: Using Block RAM in Spartan-II FPGAs
  • XAPP162: PCB Design Guidelines for BGA Packages

Software and Tools Documentation

  • ISE Design Suite: Compatible with Xilinx ISE 14.7 and earlier versions
  • Constraints Guide: UCF file creation and timing constraint implementation
  • Libraries Guide: Unisim and Simprim library documentation
  • Synthesis Guide: XST synthesis tool optimization techniques

Simulation and Verification Resources

  • IBIS Models: Signal integrity simulation models for FGG456 package
  • SPICE Models: Circuit-level simulation support
  • Timing Models: Setup/hold and propagation delay specifications
  • Power Models: Dynamic and static power consumption estimates

4. Related Resources

Development Environment and Tools

  • Xilinx ISE WebPACK: Free development environment with device support
  • ChipScope Pro: Integrated logic analyzer for real-time debugging
  • FPGA Editor: Advanced placement and routing visualization
  • Timing Analyzer: Static timing analysis and constraint verification
  • Power Analyzer: Power consumption estimation and optimization

Compatible Hardware Solutions

  • Configuration Devices:
    • XC18V02 (2Mbit) for basic configurations
    • XC18V04 (4Mbit) for complex designs
    • Serial Flash memory alternatives
  • Development Boards:
    • Spartan-II Starter Kit
    • Custom evaluation platforms
    • Third-party development systems

Design IP and Cores

  • LogiCORE IP: Xilinx-verified IP blocks including:
    • DSP cores (FIR filters, FFT, DDS)
    • Communication cores (UART, SPI, I2C)
    • Memory controllers (SDRAM, DDR)
    • Math functions (CORDIC, multipliers)

Application Domains

The XC2S600E-6FGG456Q excels in:

  • Telecommunications: Protocol processing and packet switching
  • Industrial Control: Real-time control and monitoring systems
  • Medical Devices: Signal processing and data acquisition
  • Automotive Electronics: Advanced driver assistance systems
  • Aerospace: Avionics and flight control systems
  • Test Equipment: High-speed data processing and analysis

Design Services and Support

  • Xilinx Alliance Program: Certified design service providers
  • Application Engineering: Technical consultation and design review
  • Training Programs: Online and instructor-led FPGA design courses
  • Community Support: Forums, knowledge base, and peer assistance

5. Environmental & Export Classifications

Environmental Compliance Standards

  • RoHS Directive: Fully compliant with EU RoHS 2011/65/EU
  • REACH Regulation: Compliant with EU REACH (EC 1907/2006)
  • Halogen-Free: Package and materials meet halogen-free requirements
  • Conflict Minerals: Complies with Section 1502 of Dodd-Frank Act
  • California Proposition 65: Meets California environmental standards

Quality and Reliability Standards

  • Quality System: ISO 9001:2015 certified manufacturing
  • Reliability Testing:
    • JEDEC JESD47 stress test methods
    • MIL-STD-883 Method 5004 for die shear
    • JEDEC JESD22 environmental test methods
  • Package Qualification: Extensive testing per JEDEC standards
  • Temperature Cycling: -65ยฐC to +150ยฐC, 1000 cycles minimum

Export Control and Trade Compliance

  • ECCN Classification: 3A991.a.2 (Export Administration Regulations)
  • Export License Requirements: May require license for certain destinations
  • Dual-Use Technology: Subject to export control regulations
  • Country of Origin: Multiple manufacturing locations globally
  • Harmonized Tariff Code: 8542.31.0001

Packaging and Environmental Information

  • Moisture Sensitivity: MSL-3 per IPC/JEDEC J-STD-020
  • Storage Conditions:
    • Temperature: -55ยฐC to +150ยฐC
    • Humidity: <85% RH non-condensing
    • Shelf Life: 12 months in moisture barrier bag
  • ESD Classification: Class 1 (>1000V Human Body Model)
  • Package Materials: Lead-free, environmentally friendly compounds

Certifications and Approvals

  • UL Recognition: Component recognition where applicable
  • CSA Certification: Canadian safety standards compliance
  • CE Marking: European conformity when integrated in systems
  • FCC Part 15: EMI/EMC compliance for radio frequency applications
  • ITAR Classification: Not subject to International Traffic in Arms Regulations

Waste Electrical and Electronic Equipment (WEEE)

  • WEEE Directive: Compliant with EU WEEE 2012/19/EU
  • Recycling Information: Semiconductor recycling guidelines available
  • End-of-Life: Proper disposal and recycling procedures documented

Why Choose XC2S600E-6FGG456Q?

The XC2S600E-6FGG456Q delivers the perfect combination of high performance and compact footprint for space-constrained applications. With its 456-pin FGG package providing excellent I/O density while maintaining the full 600K gate capacity of the Spartan-II architecture, this device is ideal for applications requiring maximum functionality in minimal board space.

Key advantages include:

  • Space Efficiency: 23mm x 23mm package saves valuable PCB real estate
  • Cost Optimization: Smaller package reduces overall system cost
  • Industrial Reliability: -40ยฐC to +85ยฐC operation ensures robust performance
  • Design Flexibility: 333 user I/O pins support complex interface requirements
  • Proven Architecture: Mature Spartan-II technology with extensive design resources

Whether you’re developing compact communication systems, portable test equipment, or space-constrained industrial controllers, the XC2S600E-6FGG456Q provides the programmable logic performance and reliability your application demands in an efficiently sized package.

For technical support, current pricing, or design assistance with the XC2S600E-6FGG456Q, contact your local Xilinx representative or authorized distributor today.