1. Product Specifications
Core Architecture Specifications
| Specification | Value |
|---|---|
| Part Number | XC2S600E-6FGG456I |
| Product Family | Xilinx Spartan-IIE 1.8V FPGA |
| System Gates | 600,000 |
| Logic Cells | 15,552 |
| Configurable Logic Blocks (CLBs) | 864 |
| Maximum User I/O | 372 pins |
| Total Package Pins | 456 |
Performance Characteristics
| Parameter | Specification |
|---|---|
| Maximum Frequency | 357MHz |
| Speed Grade | -6 (Commercial) |
| Core Voltage | 1.8V ยฑ5% |
| I/O Voltage | 1.8V to 3.3V |
| Technology Node | 0.15ฮผm CMOS |
| Power Consumption | Low-power design |
Package Information
| Attribute | Details |
|---|---|
| Package Type | Fine-Pitch Ball Grid Array (FBGA) |
| Package Code | FGG456 |
| Pin Count | 456 pins |
| Package Size | 23mm ร 23mm |
| Ball Pitch | 1.0mm |
| Package Height | 2.6mm max |
Memory Resources
- Block RAM: Multiple 4Kbit dual-port RAM blocks
- Distributed RAM: Configurable within CLBs
- Total RAM Bits: Varies based on configuration
I/O Standards Support
The XC2S600E-6FGG456I supports multiple I/O standards including:
- LVTTL/LVCMOS (3.3V, 2.5V, 1.8V)
- SSTL-2, SSTL-3
- HSTL Class I, III, IV
- GTL, GTL+
- Differential standards (LVDS, LVPECL)
2. Pricing Information
Current Market Pricing
- Unit Price Range: $25 – $478 USD (depending on quantity and distributor)
- Minimum Order Quantity: 1 piece for most distributors
- Volume Discounts: Available for orders over 100 units
- Lead Time: 2-12 weeks (varies by distributor and stock levels)
Pricing Notes
Please note: The XC2S600E-6FGG456I is marked as “NOT RECOMMENDED for NEW DESIGN” by the manufacturer. Consider newer alternatives for new projects. Pricing varies significantly based on market availability and distributor stock levels.
Recommended Distributors:
- Mouser Electronics
- DigiKey
- Octopart (price comparison)
- Authorized Xilinx distributors
3. Documents & Media
Technical Documentation
Primary Datasheets:
- Spartan-IIE 1.8V FPGA Family Datasheet (DS077)
- XC2S600E-6FGG456I Product Brief
- Package and Pinout Information
Design Resources:
- Application Notes for Spartan-IIE implementation
- PCB layout guidelines for FBGA packages
- Power supply design recommendations
- Thermal management guidelines
Software Documentation:
- ISE Design Suite compatibility notes
- Programming and configuration guides
- IP core integration documentation
- Migration guides from legacy designs
Development Tools
- Xilinx ISE WebPack (free development environment)
- ISE Design Suite (advanced commercial tools)
- ChipScope Pro (debugging and analysis)
- PlanAhead (design planning and analysis)
4. Related Resources
Compatible Products
Pin-Compatible Alternatives:
- XC2S600E-6FG456C (commercial grade)
- XC2S600E-6FG456I (alternative package)
- XC2S600E-7FGG456C (slower speed grade)
Recommended Upgrades:
- Spartan-3E family devices (for new designs)
- Spartan-6 family (enhanced features)
- Modern Artix-7 series (current generation)
Development Boards
- Spartan-IIE evaluation kits
- Third-party FPGA development boards
- Educational training platforms
- Custom carrier boards available
Support Resources
- Xilinx Community Forums
- Technical Support Portal
- Application Engineering Services
- Training and Certification Programs
- Third-party IP Core Libraries
Application Examples
Typical Use Cases:
- Digital signal processing applications
- Communication system prototypes
- Industrial control systems
- Consumer electronics development
- Educational and research projects
- Legacy system maintenance
5. Environmental & Export Classifications
Environmental Compliance
RoHS Compliance:
- โ RoHS Compliant – Lead-free manufacturing process
- โ REACH Regulation compliance for European markets
- โ Halogen-free package options available
- โ WEEE Compliant for waste electrical equipment regulations
Operating Conditions
| Parameter | Commercial Grade | Industrial Grade |
|---|---|---|
| Operating Temperature | 0ยฐC to +85ยฐC | -40ยฐC to +100ยฐC |
| Storage Temperature | -65ยฐC to +150ยฐC | -65ยฐC to +150ยฐC |
| Relative Humidity | 10% to 90% non-condensing | 10% to 90% non-condensing |
| Thermal Resistance | ฮธJA = 18ยฐC/W (typical) | ฮธJA = 18ยฐC/W (typical) |
Export Control Information
Export Classifications:
- ECCN: 3A001.a.7 (Export Control Classification Number)
- HTS Code: Available upon request
- Country of Origin: Varies by manufacturing location
- Export License: May be required depending on destination
Quality Standards
- ISO 9001 certified manufacturing processes
- AS9100 aerospace quality standards (where applicable)
- Conflict Minerals reporting available
- Supply Chain Security documentation provided
Package Handling
- Moisture Sensitivity Level (MSL): Level 3
- Storage Requirements: Sealed dry pack recommended
- Reflow Profile: JEDEC J-STD-020 compatible
- ESD Sensitivity: Class 1 (HBM), Class II (CDM)
Important Notice
โ ๏ธ Design Recommendation: The XC2S600E-6FGG456I is marked as “NOT RECOMMENDED for NEW DESIGN” by Xilinx. This device is suitable for:
- Legacy product support and maintenance
- Drop-in replacements for existing designs
- Educational and hobbyist projects
- Cost-sensitive applications where newer features aren’t required
For new designs, consider migrating to newer FPGA families such as Spartan-7, Artix-7, or Zynq-7000 series devices that offer enhanced performance, lower power consumption, and extended product lifecycle support.
For the most current technical specifications, pricing, and availability information for the XC2S600E-6FGG456I, please consult authorized Xilinx distributors or the official AMD-Xilinx documentation portal.
