1. Product Specifications
Technical Specifications
| Parameter | Specification |
|---|---|
| Part Number | XC2S600E-6FGG456C |
| Manufacturer | Xilinx (now AMD Xilinx) |
| FPGA Family | Spartan-IIE |
| Logic Gates | 600,000 system gates |
| Logic Elements/Cells | 15,552 cells |
| Maximum Frequency | 357MHz |
| Technology Node | 0.15um Technology |
| Supply Voltage | 1.71V ~ 1.89V (1.8V nominal) |
| Package Type | 456-Pin FBGA (Fine-pitch Ball Grid Array) |
| Package Size | 456-FBGA (23x23mm) |
| I/O Pins | 329 user I/Os |
| LABs/CLBs | 3,456 LABs/CLBs |
| RAM Capacity | 294,912 bits total RAM |
| Block RAM | 36kB |
Operating Conditions
| Parameter | Min | Typical | Max | Unit |
|---|---|---|---|---|
| Supply Voltage (VCCINT) | 1.71 | 1.8 | 1.89 | V |
| Operating Temperature | 0 | – | 85 | ยฐC (TJ) |
| Maximum Clock Frequency | – | – | 357 | MHz |
Package Information
- Package Type: 456-BBGA, 456-FBGA (23×23)
- Mounting Type: Surface Mount
- Pin Count: 456 pins
- Pin Pitch: 1mm
- Package Material: Plastic Ball Grid Array (PBGA)
2. Price Information
Note: Pricing for the XC2S600E-6FGG456C varies significantly based on quantity and supplier. Current market pricing is available from 19 distributors with bulk discounts available.
Price Factors:
- Quantity breaks (higher volumes = lower unit price)
- Lead time requirements
- Packaging options (Tray, Tube, Reel)
- Distributor markup and availability
- Market demand fluctuations
Pricing Guidance:
- Small quantities (1-10 units): Contact distributors for current pricing
- Volume pricing (100+ units): Significant discounts available
- Prices fluctuate frequently due to supply and demand
For current pricing, contact authorized distributors or request quotes through electronic component marketplaces.
3. Documents & Media
Official Documentation
Datasheets & Technical Documents:
- XC2S600E Technical Support PDF Datasheet (Data Sheets, Jul 13, 2020)
- Spartan-IIE FPGA Family User Guide
- Configuration and Programming Documentation
- Package and Pinout Information
- Thermal and Power Management Guidelines
Development Resources:
- Reference designs and application notes
- Getting started guides
- Pin mapping and constraint files
- Timing analysis documentation
Software & Tools:
- Xilinx Vivado Design Suite (synthesis and implementation)
- ISE Design Tools (legacy support)
- Programming and configuration utilities
- Simulation models and libraries
Design Files & Models
- IBIS models for signal integrity analysis
- SPICE models for circuit simulation
- 3D package models for mechanical design
- Symbol and footprint libraries for PCB design
4. Related Resources
Development Platforms
Compatible Development Boards:
- ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7
- Custom carrier boards and evaluation platforms
- Third-party development kits
Application Areas
Target Applications:
- Digital signal processing (DSP), embedded systems, system-on-a-chip (SoC) designs, and consumer electronics
- Industrial automation and control systems
- Communications and networking equipment
- Test and measurement instrumentation
- Prototyping and educational projects
Alternative Parts
Pin-Compatible Alternatives:
- XC2S600E-6FG456I (Industrial temperature range)
- XC2S600E-6FG456Q (Automotive grade)
- XC2S600E-6FGG676C (Higher pin count package)
Modern Replacements:
- Newer Spartan series FPGAs (Spartan-7, Spartan-6)
- Artix-7 family for new designs
- Zynq SoC devices for embedded applications
Technical Support
Community Resources:
- FPGA technical forums and communities
- Design examples and reference implementations
- Troubleshooting guides and FAQs
- Video tutorials and training materials
5. Environmental & Export Classifications
Environmental Compliance
RoHS Compliance:
- RoHS Compliant / Lead-free compliant
- Meets European Union environmental standards
- Halogen-free options available
Environmental Certifications:
- RoHS 2011/65/EU compliant
- REACH regulation compliant
- Green product classification
- Conflict minerals reporting available
Export & Trade Classifications
Export Control Information:
- ECCN (Export Control Classification Number): Available upon request
- Country of origin: Manufactured in various locations
- Export licensing requirements vary by destination
- Risk Rank: 5.82
Quality & Reliability:
- ISO 9001 certified manufacturing
- Military and automotive grade versions available
- Comprehensive reliability testing and qualification
- Long-term supply commitment (subject to product lifecycle)
Lifecycle Status
Important Note: This device is marked as “NOT RECOMMENDED for NEW DESIGN” by some suppliers, indicating it may be in the mature or end-of-life phase. For new projects, consider newer FPGA families with enhanced features and longer-term support.
Product Lifecycle:
- Part Life Cycle Code: Obsolete (from some sources)
- Replacement recommendations available
- Last-time buy opportunities may be announced
- Technical support continues for existing designs
Packaging & Shipping
Standard Packaging:
- Tray packaging standard
- Anti-static packaging for component protection
- Moisture sensitivity level (MSL) rating: Level 3
- Temperature and humidity controlled shipping
Contact Information: For technical support, pricing inquiries, or design assistance with the XC2S600E-6FGG456C, contact authorized Xilinx distributors or AMD Xilinx technical support teams.
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