1. Product Specifications
Technical Specifications
| Parameter | Specification |
|---|---|
| Part Number | XC2S600E-6FGG256C |
| Manufacturer | Xilinx (now AMD Xilinx) |
| FPGA Family | Spartan-IIE |
| Logic Gates | 600,000 system gates |
| Logic Elements/Cells | 15,552 cells (estimated) |
| Maximum Frequency | 357MHz |
| Technology Node | 0.15um Technology |
| Supply Voltage | 1.71V ~ 1.89V (1.8V nominal) |
| Package Type | 256-Pin FBGA (Fine-pitch Ball Grid Array) |
| Package Size | 256-FBGA (17x17mm typical) |
| I/O Pins | 208 user I/Os (approximate) |
| Block RAM | Up to 288K bits |
| Distributed RAM | Up to 221,184 bits |
Advanced Features
| Feature | Specification |
|---|---|
| I/O Standards | 19 selectable standards |
| DLLs (Delay-Locked Loops) | 4 DLLs for timing precision |
| Fast Interconnect | Predictable routing for timing closure |
| Configuration Options | Multiple programming modes |
| Speed Grade | -6 (357MHz performance) |
Operating Conditions
| Parameter | Min | Typical | Max | Unit |
|---|---|---|---|---|
| Supply Voltage (VCCINT) | 1.71 | 1.8 | 1.89 | V |
| Operating Temperature | 0 | – | 85 | ยฐC (TJ) |
| Maximum Clock Frequency | – | – | 357 | MHz |
Package Information
- Package Type: 256-FBGA (Fine-pitch Ball Grid Array)
- Mounting Type: Surface Mount
- Pin Count: 256 pins
- Pin Pitch: 1mm (typical)
- Package Material: Plastic Ball Grid Array (PBGA)
- Thermal Performance: Enhanced thermal dissipation
2. Price Information
Market Pricing Overview: The FPGAkey search engine monitors the XC2S600E-6FGG256C inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. Pricing varies significantly based on several factors.
Price Factors:
- Quantity Breaks: Higher volumes typically offer better unit pricing
- Supply Chain Status: Market availability affects pricing
- Lead Time Requirements: Rush orders may incur premium pricing
- Packaging Options: Tray, tube, or reel packaging variations
- Distributor Networks: Authorized vs. independent distributors
Pricing Guidelines:
- Low Volume (1-10 units): Contact distributors for current spot pricing
- Medium Volume (100-999 units): Volume discounts typically available
- High Volume (1000+ units): Significant pricing breaks and contract pricing
- Obsolescence Impact: Limited availability may affect pricing
Cost Optimization Tips:
- Compare pricing across multiple authorized distributors
- Consider alternative package options within the same family
- Evaluate newer FPGA families for cost-effective alternatives
- Plan procurement to avoid last-time-buy scenarios
3. Documents & Media
Official Documentation
Core Technical Documents:
- XC2S600E Technical Support PDF Datasheet (Spartan-IIE Family)
- 256-FBGA Package and Pinout Specifications
- Configuration User Guide and Programming Instructions
- Timing Analysis and Constraints Documentation
Design Resources:
- Pin assignment and constraint files (.UCF format)
- Reference clock management designs
- I/O standards implementation guides
- Power estimation and thermal analysis tools
Software & Development Tools:
- Xilinx Vivado Design Suite: Modern synthesis and implementation
- ISE Design Tools: Legacy support for Spartan-IIE family
- Impact Programming Tool: Device configuration utility
- ChipScope Pro: Real-time debugging and analysis
Design Support Files
Electronic Design Files:
- IBIS models for signal integrity simulation
- SPICE models for analog circuit analysis
- 3D mechanical models for thermal and mechanical design
- Symbol and footprint libraries for major EDA tools (Altium, Cadence, etc.)
Application Notes:
- Best practices for 256-pin FBGA layout
- Power supply design recommendations
- High-speed I/O design techniques
- Configuration memory sizing guidelines
4. Related Resources
Development Platforms
Compatible Development Boards:
- Custom evaluation boards for 256-pin package
- ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7 (with appropriate adapters)
- Third-party carrier boards and breakout modules
- Educational and prototyping platforms
Target Applications
Optimal Use Cases:
- Space-Constrained Systems: Compact designs requiring 600K gate capacity
- Cost-Sensitive Applications: Balance of features and affordability
- Educational Projects: Learning FPGA design concepts
- Prototyping: Proof-of-concept and development platforms
- Legacy System Support: Maintenance and replacement parts
Application Domains:
- Industrial control and automation systems
- Communications infrastructure equipment
- Test and measurement instrumentation
- Consumer electronics and appliances
- Medical device embedded systems
Pin-Compatible Alternatives
Same Package Family:
- XC2S600E-6FGG256I (Industrial temperature grade)
- XC2S300E-6FGG256C (Lower gate count, similar package)
- XC2S400E-6FGG256C (Mid-range gate count option)
Migration Path Options:
- Spartan-6: XC6SLX25-3FTG256C (modern replacement)
- Spartan-7: XC7S25-1FTGB196C (current generation)
- Artix-7: XC7A25T-1FTG256C (enhanced performance)
Technical Support Resources
Community and Support:
- Xilinx Community Forums and Knowledge Base
- FPGA design tutorials and training materials
- Technical engineer support for pinout information, replacement guidance, datasheet access, programming tools, and starter kits
- Design example repositories and reference designs
Design Assistance:
- Application engineering support
- Design review and optimization services
- Migration assistance to newer FPGA families
- Custom training and workshops
5. Environmental & Export Classifications
Environmental Compliance Standards
RoHS Compliance:
- RoHS 2011/65/EU: Compliant with European environmental standards
- Lead-Free Manufacturing: Pb-free solder and assembly processes
- Halogen-Free Options: Available upon request for environmental sensitivity
- Green Product Classification: Meets Xilinx environmental initiatives
Material Declarations:
- Conflict Minerals: Full compliance reporting available
- REACH Regulation: EU chemical safety compliance
- California Proposition 65: Chemical disclosure compliance
- Material Composition: Detailed material breakdown available
Quality and Reliability Standards
Manufacturing Standards:
- ISO 9001: Certified quality management systems
- ISO 14001: Environmental management certification
- IATF 16949: Automotive quality standards (where applicable)
- AS9100: Aerospace quality standards (where applicable)
Reliability Testing:
- Extended temperature range testing
- Accelerated life testing (ALT)
- Moisture sensitivity level (MSL) characterization
- Electrostatic discharge (ESD) protection validation
Export Control and Trade Classifications
Export Control Information:
- ECCN Classification: Available through authorized distributors
- Country of Origin: Multiple manufacturing locations globally
- Export Licensing: Requirements vary by destination country
- Trade Compliance: Full documentation available for customs
Regulatory Certifications:
- FCC Compliance: Electromagnetic compatibility standards
- CE Marking: European conformity requirements
- UL Recognition: Safety standards compliance
- International Standards: IEC, JEDEC, and industry specifications
Product Lifecycle and Obsolescence
Lifecycle Status: โ ๏ธ Important Notice: This device may be marked as “NOT RECOMMENDED for NEW DESIGN”, indicating mature product status. Consider migration planning for new projects.
Lifecycle Management:
- Product Change Notifications (PCN): Advance notice of changes
- Last Time Buy (LTB): Notifications when applicable
- Alternative Recommendations: Suggested replacement parts
- Long-term Support: Continued technical support for existing designs
Supply Chain Considerations:
- Authorized Distributors: Recommended sources for genuine parts
- Inventory Management: Strategic stocking for critical applications
- Obsolescence Mitigation: Proactive replacement planning
- Design Refresh: Migration to current-generation FPGAs
Packaging and Handling
Standard Packaging:
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
- Packaging Type: Anti-static tray or tape-and-reel
- Storage Requirements: Controlled temperature and humidity
- Handling Precautions: ESD protection during assembly
Shipping and Distribution:
- Global Availability: Through authorized distributor network
- Lead Times: Vary based on demand and supply chain status
- Minimum Order Quantities: Typically starting from single units
- Expedited Options: Rush delivery available through distributors
For Technical Support: Contact AMD Xilinx technical support or authorized distributors for design assistance, pricing, and availability information regarding the XC2S600E-6FGG256C.
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