1. Product Specifications
Technical Specifications
| Parameter | Specification |
|---|---|
| Part Number | XC2S600E-6FG676I |
| Manufacturer | Xilinx (now AMD Xilinx) |
| FPGA Family | Spartan-IIE |
| Temperature Grade | Industrial (-40ยฐC to +100ยฐC) |
| Logic Gates | 600,000 system gates |
| Logic Elements/Cells | 15,552 cells |
| CLBs (Configurable Logic Blocks) | 864 CLBs |
| Maximum Frequency | 357MHz |
| Technology Node | 0.15um Technology |
| Supply Voltage | 1.71V ~ 1.89V (1.8V nominal) |
| Package Type | 676-Pin FBGA (Fine-pitch Ball Grid Array) |
| Package Size | FBGA-676 (27mm x 27mm) |
| Pin Pitch | 1mm |
I/O and Memory Specifications
| Parameter | Specification |
|---|---|
| User I/O Pins | 514 I/Os (maximum in family) |
| Input Pins | 514 inputs |
| Output Pins | 514 outputs |
| Total Pins | 676 pins |
| Block RAM | Up to 288K bits |
| Distributed RAM | Up to 221,184 bits |
| I/O Standards | 19 selectable standards |
| DLLs | 4 Delay-Locked Loops |
Advanced Features
| Feature | Specification |
|---|---|
| SelectRAM Memory | Hierarchical memory architecture |
| Distributed RAM | 16 bits/LUT distributed RAM |
| Block RAM | Configurable 4K-bit true dual-port |
| Fast Interconnect | Predictable routing for timing closure |
| Configuration | Unlimited in-system reprogrammability |
| Architecture | Based on Virtex-E FPGA architecture |
Operating Conditions
| Parameter | Min | Typical | Max | Unit |
|---|---|---|---|---|
| Supply Voltage (VCCINT) | 1.71 | 1.8 | 1.89 | V |
| Operating Temperature | -40 | – | +100 | ยฐC (Industrial) |
| Maximum Clock Frequency | – | – | 357 | MHz |
| Junction Temperature | -40 | – | +100 | ยฐC (TJ) |
Package Information
- Package Type: 676-FBGA (Fine-pitch Ball Grid Array)
- Package Code: S-PBGA-B676
- Mounting Type: Surface Mount
- Pin Count: 676 pins
- Pin Pitch: 1mm
- Package Dimensions: 27mm x 27mm
- Package Material: Plastic/Epoxy (PBGA)
- Moisture Sensitivity Level: MSL 3
2. Price Information
Industrial Market Pricing: The FPGAkey search engine monitors the XC2S600E-6FG676I inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. Industrial-grade FPGAs typically command premium pricing due to extended temperature range and enhanced reliability.
Price Factors:
- Industrial Grade Premium: Higher cost due to extended temperature testing
- High I/O Count Package: 676-pin FBGA commands premium over smaller packages
- Obsolescence Status: Limited availability affects market pricing
- Volume Requirements: Industrial applications often require smaller volumes
- Lead Time Sensitivity: Rush orders for critical applications
Market Dynamics:
- Legacy Product: Marked as “NOT RECOMMENDED for NEW DESIGN”
- Last-Time-Buy Impact: Obsolescence drives strategic purchasing
- Alternative Migration: Customers moving to newer FPGA families
- Inventory Scarcity: Decreasing availability from distributors
Pricing Guidelines:
- Low Volume (1-25 units): Premium pricing for industrial applications
- Medium Volume (100-500 units): Volume discounts with authorized distributors
- High Volume (1000+ units): Contract pricing and last-time-buy opportunities
- Critical Spares: Highest pricing tier for maintenance and repair
Cost Optimization Strategies:
- Lifetime Buy: Strategic inventory for long-term industrial applications
- Alternative Analysis: Evaluate pin-compatible or functional replacements
- Supply Chain Diversification: Multiple distributor relationships
- Design Migration: Plan transition to current-generation FPGAs
3. Documents & Media
Official Documentation
Core Technical Documents:
- XC2S600E Technical Support PDF Datasheet (Spartan-IIE Family)
- 676-FBGA Package and Pinout Specifications (FBGA-676)
- Industrial Temperature Range Qualification Data
- Configuration User Guide and Programming Instructions
- Timing Analysis and Industrial Operating Conditions
Industrial Design Resources:
- Extended temperature design guidelines
- Thermal management for -40ยฐC to +100ยฐC operation
- High I/O count PCB layout best practices
- Signal integrity considerations for 676-pin package
- Power supply design for industrial environments
Software & Development Tools:
- Xilinx Vivado Design Suite: Modern synthesis and implementation
- ISE Design Tools: Native support for Spartan-IIE family
- Impact Programming Tool: Device configuration utility
- ChipScope Pro: Real-time debugging and analysis
- PlanAhead: Floorplanning and I/O assignment tools
Design Support Files
Electronic Design Automation (EDA) Files:
- IBIS models for 676-pin package signal integrity simulation
- SPICE models for analog circuit analysis and thermal simulation
- 3D mechanical models (27mm x 27mm FBGA package)
- Symbol and footprint libraries for major EDA tools
- Constraint files (.UCF format) for industrial timing requirements
Application Notes & Guidelines:
- AN001: Industrial FPGA Design Best Practices
- AN002: High I/O Count PCB Layout Guidelines (676-pin FBGA)
- AN003: Thermal Management for Extended Temperature Operation
- AN004: Power Supply Design for Industrial Applications
- AN005: Configuration Memory Sizing for Industrial Systems
4. Related Resources
Development Platforms
Industrial Development Boards:
- Custom evaluation boards for 676-pin industrial package
- Extended temperature testing platforms
- High I/O count breakout and prototyping boards
- Industrial-grade carrier boards with environmental protection
Compatible Development Systems:
- ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7 (with appropriate adapters)
- Industrial evaluation platforms with extended temperature testing
- Third-party development kits for harsh environment applications
Target Applications
Industrial Applications:
- Automotive Systems: Engine control, transmission control, safety systems
- Industrial Automation: PLCs, motor control, process control systems
- Harsh Environment Systems: Mining equipment, oil & gas exploration
- Aerospace & Defense: Avionics, radar systems, military communications
- Railway Systems: Signaling, control systems, rolling stock electronics
Application Domains:
- Automotive Hybrid, electric & powertrain systems Enterprise systems Data center & enterprise computing Personal electronics Home theater & entertainment
- Industrial control and factory automation
- Test and measurement instrumentation for extreme environments
- Communications infrastructure in harsh climates
- Medical devices requiring extended temperature operation
Pin-Compatible and Functional Alternatives
Same Family Alternatives:
- XC2S600E-6FG676C: Commercial temperature grade (0ยฐC to +85ยฐC)
- XC2S600E-7FG676C: Faster speed grade, commercial temperature
- XC2S600E-7FG676I: Faster speed grade, industrial temperature
Package Size Alternatives:
- XC2S600E-6FG456I: 456-pin FBGA, industrial temperature (fewer I/Os)
- XC2S600E-6FGG456I: 456-pin FBGA, industrial temperature (fine-pitch)
- XC2S600E-6FGG256I: 256-pin FBGA, industrial temperature (compact)
Modern Migration Options:
- Spartan-6: XC6SLX25-2FGG676I (current generation, industrial)
- Spartan-7: XC7S25-1FTGB676I (advanced architecture, industrial)
- Artix-7: XC7A25T-1FTG676I (enhanced performance, industrial)
- Zynq-7000: XC7Z020-1FTG676I (ARM + FPGA SoC, industrial)
Technical Support Resources
Industrial Support Services:
- Extended lifecycle support for industrial applications
- Application engineering for harsh environment designs
- Thermal analysis and qualification assistance
- Migration planning and design transition support
Community and Documentation:
- Xilinx Industrial Forum and Knowledge Base
- Industrial FPGA design tutorials and training
- Technical engineer support for pinout information, replacement, datasheet in pdf, programming tools, starter kit
- Extended temperature operation guidelines and best practices
5. Environmental & Export Classifications
Environmental Compliance Standards
RoHS and Environmental:
- RoHS Compliance: RoHS (Lead free / RoHS Compliant)
- Lead-Free Manufacturing: Pb-free solder and assembly processes
- Halogen-Free Options: Available for environmentally sensitive applications
- Green Product Classification: Meets AMD Xilinx environmental initiatives
Material Declarations:
- Conflict Minerals: Full compliance reporting available
- REACH Regulation: EU chemical safety compliance
- Material Composition: Detailed breakdown for industrial qualification
- Environmental Impact: Lifecycle assessment data available
Industrial Quality and Reliability Standards
Manufacturing Standards:
- ISO 9001: Quality management systems certification
- ISO 14001: Environmental management standards
- IATF 16949: Automotive quality standards compliance
- AS9100: Aerospace quality standards (where applicable)
Industrial Reliability Testing:
- Extended Temperature Testing: -40ยฐC to +100ยฐC qualification
- Accelerated Life Testing (ALT): Enhanced reliability validation
- Thermal Cycling: Industrial temperature range validation
- Humidity Testing: Industrial environmental conditions
- Vibration and Shock: Mechanical stress testing for industrial use
Export Control and Trade Classifications
Export Control Information:
- ECCN Classification: ECCN Code: 3A991.D
- HTS Code: HTS Code: 8542.39.00.01
- Country of Origin: Multiple manufacturing locations globally
- Export Licensing: Requirements vary by destination and end-use
- Trade Compliance: Full documentation for customs clearance
Regulatory Certifications:
- FCC Compliance: Electromagnetic compatibility standards
- CE Marking: European conformity requirements for industrial use
- UL Recognition: Safety standards compliance for industrial applications
- IEC Standards: International industrial equipment compliance
Product Lifecycle and Obsolescence Management
Lifecycle Status: โ ๏ธ Critical Notice: This device is marked as “NOT RECOMMENDED for NEW DESIGN” and has Part Life Cycle Code: Obsolete
Industrial Lifecycle Considerations:
- Long-term Availability: Limited remaining inventory
- Last-Time-Buy Programs: Strategic purchasing opportunities
- Design Refresh Planning: Migration to current-generation FPGAs
- Alternative Part Qualification: Industrial replacement options
Supply Chain Management:
- Authorized Distributors: Verified sources for genuine industrial parts
- Inventory Stratification: Critical spares and production requirements
- Risk Mitigation: Obsolescence management strategies
- Technical Support: Continued support for existing industrial designs
Industrial Packaging and Handling
Industrial Packaging Standards:
- Moisture Sensitivity Level: Moisture Sensitivity Level: 3
- Industrial Packaging: Enhanced protection for extended storage
- Temperature Storage: Controlled environment requirements
- ESD Protection: Industrial-grade anti-static protection
Handling and Storage:
- Extended Storage Requirements: Industrial inventory management
- Temperature Controlled: Storage and shipping environment control
- Quality Traceability: Full lot tracking for industrial applications
- Documentation Package: Certificate of conformance and test data
Industrial Distribution:
- Global Industrial Distributors: Specialized industrial electronics suppliers
- Technical Support: Industrial application engineering assistance
- Express Logistics: Expedited shipping for critical industrial applications
- Inventory Management: Just-in-time and strategic inventory programs
For Industrial Applications Support: Contact AMD Xilinx Industrial Solutions team or authorized industrial distributors for design assistance, extended temperature qualification data, and long-term availability planning for the XC2S600E-6FG676I.
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