Product Specifications
Core Features
- Device Family: Spartan-IIE
- Part Number: XC2S600E-5FGG676I
- Logic Cells: 600,000 system gates
- Speed Grade: -5 (highest performance grade)
- Package Type: Fine-pitch Ball Grid Array (FBGA)
- Pin Count: 676 pins
- Package Size: 27mm x 27mm
- Temperature Grade: Industrial (-40ยฐC to +85ยฐC)
Memory Resources
- Block RAM: 288 Kbits total
- Distributed RAM: Integrated within CLBs
- Configuration Memory: SRAM-based
I/O Capabilities
- User I/O Pins: Up to 512
- Differential I/O Standards: LVDS, LVPECL
- Single-ended I/O Standards: LVCMOS, LVTTL, PCI, GTL+
- Voltage Support: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
Clock Management
- Digital Clock Managers (DCMs): 4 units
- Phase-Locked Loops: Integrated timing control
- Clock Frequency: Up to 200+ MHz system performance
Processing Elements
- Configurable Logic Blocks (CLBs): 3,584 units
- 18-bit Multipliers: 32 dedicated units
- Carry Logic: Fast arithmetic operations
Pricing Information
Note: Pricing for the XC2S600E-5FGG676I varies based on quantity, distributor, and current market conditions. Contact authorized Xilinx distributors for current pricing:
- Single Unit Price: Contact for quote
- Bulk Pricing: Volume discounts available
- Lead Time: Typically 12-16 weeks
- Minimum Order Quantity: Varies by distributor
Prices subject to change without notice. Contact your local Xilinx representative for the most current pricing and availability.
Documents & Media
Technical Documentation
- Datasheet: XC2S600E Complete Specifications (DS077)
- User Guide: Spartan-IIE FPGA Family Complete Guide
- Package Information: 676-pin FBGA Package Details
- Pin Assignment: Comprehensive I/O pin mapping
- Timing Specifications: Speed grade performance characteristics
Design Resources
- Reference Designs: Application-specific implementations
- Development Boards: Spartan-IIE evaluation platforms
- Application Notes: Design optimization guidelines
- Migration Guide: Upgrade path documentation
- Errata: Known issues and workarounds
Software Tools
- ISE Design Suite: Complete development environment
- ChipScope Pro: Integrated logic analyzer
- ModelSim: HDL simulation software
- Synthesis Tools: XST and third-party options
Related Resources
Development Tools
- Spartan-IIE Starter Kit: Complete evaluation platform
- Platform Cable: JTAG programming interface
- iMPACT: Configuration and programming software
- CORE Generator: IP core library access
Compatible Products
- XC2S300E: Lower-density alternative
- XC2S800E: Higher-density option
- Configuration PROMs: XCF04S, XCF08P series
- Oscillators: Compatible clock sources
Application Areas
- Digital Signal Processing: High-speed filtering and processing
- Communications: Protocol processing and interface bridging
- Industrial Control: Motor control and automation systems
- Test Equipment: Logic analysis and pattern generation
- Networking: Packet processing and switching applications
Technical Support
- Xilinx Support: Online knowledge base and forums
- Application Engineers: Design consultation services
- Training Courses: FPGA design methodology
- Third-party IP: Verified intellectual property cores
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free manufacturing process
- REACH Regulation: EU chemical safety compliance
- Conflict Minerals: Responsible sourcing certified
- ISO 14001: Environmental management certified facility
Temperature Specifications
- Operating Range: -40ยฐC to +85ยฐC (Industrial grade)
- Storage Range: -65ยฐC to +150ยฐC
- Junction Temperature: 125ยฐC maximum
- Thermal Resistance: ฮธJA = 23ยฐC/W (in airflow)
Reliability Standards
- MTBF: >1,000,000 hours at 55ยฐC
- ESD Protection: Class 1C (>1000V)
- Latch-up Immunity: >100mA
- Qualification Level: Military temperature range tested
Export Control Information
- ECCN Classification: 3A001.a.2
- Export License: May require authorization for certain destinations
- Country of Origin: Manufactured in ISO-certified facilities
- Harmonized Code: 8542.31.0001
Package Environmental Data
- Moisture Sensitivity: Level 3 (168 hours at 30ยฐC/60% RH)
- Lead-free: Pb-free termination finish
- Halogen-free: Compliant with industry standards
- Package Material: BT substrate with copper leadframe
The XC2S600E-5FGG676I represents proven FPGA technology backed by Xilinx’s industry-leading support and extensive ecosystem. Contact your authorized distributor today to discuss your specific application requirements and receive detailed technical consultation.
