Product Specifications
Core Architecture
- Part Number: XC2S600E-5FGG676C
- Logic Cells: 600,000 system gates
- CLBs (Configurable Logic Blocks): 1,536
- Logic Elements: 13,824
- Block RAM: 288 Kbits total capacity
- Distributed RAM: 55 Kbits
Performance Characteristics
- Speed Grade: -5 (standard performance)
- Maximum Frequency: Up to 180 MHz system clock
- Propagation Delay: 4.2ns typical
- I/O Standards Support: LVTTL, LVCMOS, PCI, GTL, SSTL, HSTL
Package Details
- Package Type: FGG676 (Fine-pitch Ball Grid Array)
- Pin Count: 676 pins
- Package Dimensions: 27mm x 27mm
- Ball Pitch: 1.0mm
- Operating Temperature Range: Commercial (0ยฐC to +85ยฐC)
Memory and Resources
- Block SelectRAM: 72 blocks of 4K bits each
- Multipliers: Dedicated 18×18 multipliers
- Phase-Locked Loops (PLLs): 4 digital clock managers
- I/O Pins: Up to 512 user I/O pins
Power Specifications
- Core Voltage: 2.5V ยฑ5%
- I/O Voltage: 1.2V to 3.3V
- Static Power: <100mW typical
- Dynamic Power: Application dependent
Pricing Information
The XC2S600E-5FGG676C offers competitive pricing in the high-density FPGA market:
- Unit Price (1-99 pieces): Contact authorized distributors
- Volume Pricing (1000+): Significant discounts available
- Engineering Samples: Available for qualified design teams
- Distributor Network: Available through major electronic component distributors worldwide
Note: Pricing varies by region, volume, and current market conditions. Contact Xilinx or authorized distributors for current pricing and availability.
Documents & Media
Technical Documentation
- Datasheet: XC2S600E Complete Product Specification (DS031)
- User Guide: Spartan-II FPGA Family Complete Data Sheet
- Application Notes:
- XAPP154: Spartan-II Coding Techniques
- XAPP155: Spartan-II FPGA Design Considerations
- Reference Manual: Spartan-II Libraries Guide for HDL Designs
Design Resources
- Development Tools: ISE Design Suite compatibility
- IP Cores: Compatible with Xilinx LogiCORE IP portfolio
- Evaluation Boards: Spartan-II Starter Kit available
- Simulation Models: VHDL, Verilog, and SPICE models provided
Software Support
- Design Software: Xilinx ISE WebPACK (free) and ISE Foundation
- Synthesis Tools: XST (Xilinx Synthesis Technology)
- Place & Route: ISE Implementation tools
- Timing Analysis: Static Timing Analyzer included
Related Resources
Compatible Products
- XC2S400E-5FGG676C: Lower density alternative
- XC2S800E-5FGG676C: Higher density option in same package
- Configuration Devices: XC18V04, XC18V08 Serial PROMs
Development Ecosystem
- Programming Cables: Platform Cable USB, Parallel Cable IV
- Debug Tools: ChipScope Pro Analyzer
- Reference Designs: Available from Xilinx and third-party vendors
- Training Resources: Xilinx Education Services courses
Application Areas
- Telecommunications: Base station processing, protocol conversion
- Industrial: Motor control, process automation, HMI systems
- Automotive: Engine control, safety systems, infotainment
- Consumer Electronics: Set-top boxes, gaming systems, audio/video processing
Design Services
- Xilinx Alliance Program: Certified design service providers
- Technical Support: Online forums, knowledge base, direct support
- Design Consultation: Available through Xilinx field application engineers
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- Lead-Free: Uses lead-free solder and manufacturing processes
- REACH Compliant: Complies with EU chemical regulation requirements
- Conflict Minerals: Xilinx conflict minerals reporting available
Quality Standards
- ISO 9001: Manufactured under ISO 9001 quality management system
- Automotive: AEC-Q100 qualified versions available
- Reliability: MTBF >1M hours at 25ยฐC operating temperature
- ESD Protection: Class 1C (>1000V) Human Body Model
Export Classifications
- ECCN: 3A001.a.2 (Export Administration Regulations)
- HTS Code: 8542.39.0001
- Country of Origin: Various (Singapore, Malaysia, China)
- Export License: May require license for certain destinations
Packaging and Handling
- Moisture Sensitivity: Level 3 per JEDEC J-STD-020
- Storage Temperature: -55ยฐC to +150ยฐC
- Shipping: Anti-static packaging, dry pack when required
- Shelf Life: 12 months from date of manufacture in sealed bag
Compliance Certifications
- CE Marking: European Conformity marking where applicable
- FCC Part 15: Class B digital device compliance
- ICES-003: Industry Canada electromagnetic compatibility
- VCCI: Japan Voluntary Control Council for Interference
The XC2S600E-5FGG676C represents an optimal balance of performance, features, and cost-effectiveness in the FPGA market. Its robust architecture, comprehensive tool support, and proven reliability make it an excellent choice for both prototype development and high-volume production applications. With extensive documentation, broad ecosystem support, and global availability, this FPGA enables rapid time-to-market for advanced digital designs across multiple industries.
