Product Specifications
Core Features
- Device Family: Xilinx Spartan-II Extended (Spartan-IIE)
- Logic Cells: 50,000 system gates
- Speed Grade: -7 (high-performance grade)
- Package Type: FTG256 (Fine-Pitch Ball Grid Array)
- Pin Count: 256 pins
- Temperature Grade: Commercial (0ยฐC to +85ยฐC)
Technical Specifications
- Configurable Logic Blocks (CLBs): 768
- Total Block RAM: 40 Kbits
- User I/O Pins: 176
- Global Clock Networks: 4
- Maximum User Clock Frequency: Up to 200 MHz
- Supply Voltage: 2.5V core, 3.3V I/O
- Power Consumption: Low-power CMOS technology
Package Details
- Package Dimensions: 17mm x 17mm
- Ball Pitch: 1.0mm
- Mounting Type: Surface Mount
- Lead-Free: RoHS compliant
Pricing Information
The XC2S50E-7FTG256C pricing varies based on quantity and supplier. For current pricing and availability:
- Small Quantities (1-99 units): Contact authorized distributors
- Volume Pricing: Available for quantities over 100 units
- Engineering Samples: May be available for qualified design projects
Note: Prices are subject to change based on market conditions and availability. Contact Xilinx authorized distributors for the most current pricing information.
Documents & Media
Technical Documentation
- Datasheet: Spartan-II FPGA Family Complete Data Sheet
- User Guide: Spartan-II FPGA User Guide
- Package Information: FTG256 Package Details and Pin Assignment
- Migration Guide: Spartan-II to Spartan-3 Migration Guidelines
Design Resources
- Reference Designs: Available through Xilinx Design Center
- Application Notes: Spartan-II implementation guides
- Software Tools: Compatible with Xilinx ISE Design Suite
- Simulation Models: VHDL and Verilog models available
Development Tools
- Xilinx ISE WebPACK: Free development environment
- ChipScope Pro: For embedded logic analysis
- ModelSim: For advanced simulation requirements
Related Resources
Development Boards
- Spartan-II Starter Kit: Complete development platform
- Third-Party Evaluation Boards: Various options from ecosystem partners
- Custom Development Platforms: Available from design service providers
Complementary Products
- XC2S30E-7FTG256C: Lower gate count alternative
- XC2S100E-7FTG256C: Higher capacity option in same package
- Configuration Memory: Compatible PROM and Flash devices
Design Services
- Xilinx Alliance Program Partners: Professional design services
- Training Courses: FPGA design methodology training
- Technical Support: Comprehensive online and phone support
Application Areas
- Digital Signal Processing: Audio/video processing applications
- Communications: Protocol processing and interface bridging
- Industrial Control: Motor control and automation systems
- Automotive Electronics: Advanced driver assistance systems
- Medical Devices: Portable diagnostic equipment
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Lead-free, environmentally friendly
- REACH Regulation: Compliant with EU chemical safety requirements
- Conflict Minerals: Sourced from conflict-free suppliers
- ISO 14001: Manufactured in ISO 14001 certified facilities
Operating Conditions
- Operating Temperature: 0ยฐC to +85ยฐC (Commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Varies by manufacturing location
- Export License: May be required for certain destinations
Quality Standards
- Automotive Grade: Available upon request (XC2S50E-7FTG256I)
- Quality Certification: ISO 9001 manufacturing
- Reliability: Extensive qualification testing performed
- Traceability: Full supply chain traceability maintained
Packaging & Shipping
- Anti-Static Packaging: ESD-safe packaging materials
- Moisture Sensitivity Level: MSL 3
- Shelf Life: 12 months in sealed package
- Shipping Classification: Standard electronic components
The XC2S50E-7FTG256C represents an excellent balance of performance, cost, and flexibility for demanding FPGA applications. Its robust feature set and comprehensive development ecosystem make it a preferred choice for engineers developing next-generation digital systems across multiple industries.
