Product Specifications
Core Architecture
- Device Family: Spartan-II E
- System Gates: 50,000 equivalent gates
- Logic Cells: 1,728 configurable logic blocks
- Package Type: Fine-pitch Ball Grid Array (FTBGA)
- Pin Count: 256 pins
- Speed Grade: -6 (standard performance)
Memory and I/O Features
- Block RAM: 32 KB total distributed RAM
- User I/O Pins: 176 maximum user I/O
- Voltage Standards: Multiple I/O standards supported including LVTTL, LVCMOS
- Operating Voltage: 2.5V core, 3.3V I/O
- Maximum Frequency: Up to 200 MHz system performance
Physical Characteristics
- Package Dimensions: 17mm x 17mm FTBGA256
- Operating Temperature Range: Commercial (0ยฐC to +85ยฐC)
- Storage Temperature: -65ยฐC to +150ยฐC
- Junction Temperature: Up to +125ยฐC
Pricing Information
The XC2S50E-6FTG256C is positioned as a cost-effective FPGA solution. Pricing varies based on quantity and supplier:
- Single Unit Price: Typically $15-25 USD
- Volume Pricing: Available for quantities of 100+ units
- Lead Time: Standard 8-12 weeks for new orders
- Availability: Check with authorized Xilinx distributors for current stock levels
Note: Prices are subject to change based on market conditions and supplier availability.
Documents & Media
Official Documentation
- Datasheet: Spartan-II E FPGA Family Complete Data Sheet
- User Guide: Spartan-II E Configuration User Guide
- Application Notes: AN176 – Using Block SelectRAM+ Memory in Spartan-II FPGAs
- Package Information: FTG256 Package Specifications and PCB Design Guidelines
Development Resources
- Software Support: ISE Design Suite compatibility
- Reference Designs: Digital clock managers, memory controllers
- Evaluation Boards: Spartan-II E Starter Kit available
- Technical Support: Xilinx Answer Database and community forums
Related Resources
Compatible Development Tools
- Xilinx ISE Design Suite: Primary development environment
- ModelSim: Simulation and verification
- ChipScope Pro: On-chip debugging and analysis
- EDK (Embedded Development Kit): Embedded processor design
Complementary Products
- XC2S30E-6FTG256C: Lower gate count alternative
- XC2S100E-6FTG256C: Higher capacity option in same package
- Configuration Memory: Platform Flash PROMs for bitstream storage
- Power Management: Voltage regulators and power sequencing solutions
Application Areas
- Communications: Protocol processing, digital filters
- Industrial Control: Motor control, sensor interfaces
- Automotive: Engine management, safety systems
- Medical Devices: Signal processing, data acquisition
- Consumer Electronics: Audio/video processing, interface bridging
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliant: Complies with European chemical regulation
- Pb-Free: Lead-free package and assembly process
- Halogen-Free: Available in halogen-free package options
Export Control Information
- ECCN Classification: 3A001.a.7 (US Export Administration Regulations)
- HTS Code: 8542.33.0001 (Harmonized Tariff Schedule)
- Country of Origin: Varies by manufacturing location
- Export Restrictions: Subject to US export control regulations
Quality and Reliability
- Quality Standard: ISO 9001:2015 certified manufacturing
- Reliability Testing: JEDEC standard qualification
- Moisture Sensitivity: MSL 3 (Moisture Sensitivity Level)
- ESD Rating: Class 2 (2000V Human Body Model)
The XC2S50E-6FTG256C represents an excellent balance of performance, cost, and flexibility for mid-range FPGA applications. Its proven architecture and comprehensive development ecosystem make it a reliable choice for both prototyping and production designs across multiple industries.
