Product Specifications
Core Architecture
The XC2S50E-6FT256C features a sophisticated architecture built around Xilinx’s proven Spartan-II technology. This FPGA incorporates 50,000 system gates, providing ample logic capacity for complex digital designs. The device utilizes a 4-input Look-Up Table (LUT) based Configurable Logic Block (CLB) architecture, enabling efficient implementation of both combinational and sequential logic functions.
Logic Resources
- System Gates: 50,000 gates
- Logic Cells: 1,728 logic cells
- CLBs (Configurable Logic Blocks): 216 CLBs arranged in a 24×9 array
- Input/Output: 176 user I/O pins
- Block RAM: 32 Kbits of dedicated block SelectRAM
Performance Characteristics
The XC2S50E-6FT256C operates with a speed grade of -6, indicating excellent timing performance for demanding applications. The device supports clock frequencies suitable for high-speed digital processing, with propagation delays optimized for contemporary design requirements.
Package Details
- Package Type: FT256 (Fine-Pitch Ball Grid Array)
- Pin Count: 256 pins
- Package Dimensions: Compact BGA format for space-efficient PCB layouts
- Operating Temperature Range: Commercial grade (0ยฐC to +85ยฐC)
Power and Voltage Requirements
- Core Voltage (VCCINT): 1.8V
- I/O Voltage (VCCO): Supports multiple I/O standards from 1.8V to 3.3V
- Power Consumption: Optimized for low-power applications
Pricing Information
The XC2S50E-6FT256C is positioned as a cost-effective FPGA solution in the mid-range performance category. Pricing varies based on quantity, distributor, and current market conditions. For the most accurate and up-to-date pricing information, we recommend contacting authorized Xilinx distributors or semiconductor suppliers directly.
Typical Price Range: Contact distributor for current pricing Availability: Available through authorized electronic component distributors Lead Time: Standard lead times apply; expedited options may be available
Documents & Media
Technical Documentation
- Data Sheet: Comprehensive specifications and electrical characteristics
- User Guide: Detailed implementation guidelines and design considerations
- Application Notes: Specific use case implementations and optimization techniques
- Packaging Information: Mechanical drawings and assembly guidelines
Development Resources
- Development Kits: Compatible evaluation boards and starter kits
- Reference Designs: Pre-validated design examples and IP cores
- Software Tools: ISE Design Suite compatibility for design entry and implementation
Quality and Reliability Documentation
- Quality and Reliability Reports: Long-term reliability data and quality metrics
- Test Reports: Comprehensive electrical and functional test results
Related Resources
Development Tools
The XC2S50E-6FT256C is fully supported by Xilinx’s ISE (Integrated Software Environment) Design Suite, providing comprehensive tools for design entry, synthesis, implementation, and verification. The device is also compatible with various third-party EDA tools and IP libraries.
Compatible IP Cores
- Processor Cores: Soft processor implementations
- Communication Interfaces: UART, SPI, I2C, and other standard protocols
- DSP Functions: Digital signal processing building blocks
- Memory Controllers: External memory interface solutions
Evaluation Platforms
Several evaluation boards and development kits support the XC2S50E-6FT256C, enabling rapid prototyping and proof-of-concept development. These platforms typically include necessary power supplies, configuration interfaces, and I/O connectivity.
Environmental & Export Classifications
Environmental Compliance
The XC2S50E-6FT256C meets stringent environmental standards and regulations:
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliant: Complies with EU chemical safety regulations
- Halogen-Free: Environmentally conscious packaging materials
- Green Package: Lead-free assembly and environmentally sustainable materials
Operating Conditions
- Operating Temperature: 0ยฐC to +85ยฐC (Commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: Up to 85% relative humidity, non-condensing
- Thermal Resistance: Optimized thermal characteristics for reliable operation
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.2
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Varies by manufacturing location
- Export Restrictions: Subject to applicable export control regulations
Quality Standards
The XC2S50E-6FT256C is manufactured under ISO 9001 quality management systems and undergoes rigorous testing to ensure consistent performance and reliability. The device meets JEDEC standards for semiconductor reliability and is qualified for commercial applications.
The XC2S50E-6FT256C represents an excellent balance of performance, features, and cost-effectiveness in the FPGA market. Its robust architecture, comprehensive development support, and proven reliability make it a preferred choice for engineers developing next-generation digital systems across various industries including telecommunications, automotive, industrial automation, and consumer electronics.
