The XC2S50-FG256AMS is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family, designed to deliver exceptional programmable logic solutions for demanding applications. This advanced FPGA combines flexibility, performance, and cost-effectiveness, making it an ideal choice for engineers and developers seeking reliable programmable hardware solutions.
1. Product Specifications
Core Technical Specifications
- Part Number: XC2S50-FG256AMS
- Manufacturer: Xilinx (now AMD)
- Product Family: Spartan-II FPGA Family
- System Gates: 50,000 gates
- Logic Cells: 1,728 cells
- Operating Frequency: Up to 263 MHz
- Technology Node: 0.18ยตm process technology
- Supply Voltage: 2.5V core voltage
- Package Type: 256-pin Fine Pitch Ball Grid Array (FBGA)
- Package Code: FG256
- Temperature Grade: Automotive grade (AMS suffix)
Memory and I/O Features
- Block RAM: Configurable block memory resources
- Distributed RAM: Flexible distributed memory architecture
- I/O Standards: Support for 16 selectable I/O standards
- User I/O: 176 user I/O pins
- Delay Locked Loops (DLLs): 4 integrated DLLs for clock management
Configuration Options
- Configuration Modes:
- Master Serial Mode (external PROM)
- Slave Serial Mode
- Slave Parallel Mode
- Boundary Scan Mode (JTAG)
- Reprogramming: Unlimited configuration cycles
- Configuration Memory: Internal static memory cells
Physical Characteristics
- Package Dimensions: 17mm x 17mm FBGA
- Pin Count: 256 pins
- Mounting: Surface mount technology
- Weight: Approximately 0.5 grams
2. Price Information
Current Market Pricing
The XC2S50-FG256AMS pricing varies based on quantity, supplier, and market conditions. Based on current market intelligence:
- Unit Price Range: $45 – $85 USD (depending on quantity and supplier)
- Volume Pricing: Significant discounts available for quantities over 100 units
- Lead Time: 2-8 weeks (subject to availability)
- Stock Status: Available through authorized distributors
Cost-Effective Solution Benefits
- Eliminates mask programming costs associated with ASICs
- Reduces development time and risks
- Enables field upgrades without hardware replacement
- Lower total cost of ownership for prototyping and low-volume production
Note: Prices are subject to change based on market conditions. Contact authorized distributors for current pricing and availability.
3. Documents & Media
Technical Documentation
- Official Datasheet: Comprehensive 99-page technical specification document
- User Guide: Detailed implementation and configuration guide
- Application Notes: Design implementation best practices
- PCB Footprint: Standard FBGA-256 footprint specifications
- Pin Configuration: Complete pinout diagrams and signal descriptions
Development Resources
- Design Tools: Compatible with Xilinx ISE Design Suite
- Programming Tools: JTAG boundary scan programming support
- Configuration Files: Bitstream generation and loading utilities
- Simulation Models: VHDL/Verilog simulation libraries
Media Assets
- Product Images: High-resolution package photographs
- Block Diagrams: Internal architecture illustrations
- Package Drawings: Mechanical specifications and dimensions
- Marketing Collateral: Product overview presentations
4. Related Resources
Development Boards and Kits
- Evaluation Boards: Compatible with Spartan-II development platforms
- Reference Designs: Pre-built design examples and templates
- Starter Kits: Complete development environments for beginners
Compatible Products
- Configuration PROMs: Serial configuration memory devices
- Clock Management: External oscillators and clock distribution ICs
- Interface Components: Level shifters and signal conditioning circuits
Software and Tools
- Xilinx ISE Design Suite: Primary development environment
- Vivado Design Suite: Advanced synthesis and implementation tools
- ModelSim: HDL simulation and verification platform
- ChipScope Pro: Integrated logic analyzer for debugging
Technical Support Resources
- Knowledge Base: Comprehensive online documentation library
- Community Forums: Peer-to-peer technical discussion platforms
- Application Engineering: Direct technical support from Xilinx experts
- Training Materials: Webinars, tutorials, and certification programs
Industry Applications
- Communications Equipment: Network infrastructure and telecommunications
- Industrial Automation: Process control and monitoring systems
- Automotive Electronics: Infotainment and control systems
- Consumer Electronics: Digital signal processing applications
- Aerospace & Defense: Mission-critical embedded systems
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS compliant (lead-free manufacturing process)
- Environmental Grade: Automotive qualified (AMS designation)
- Operating Temperature: -40ยฐC to +125ยฐC (automotive grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 85% relative humidity (non-condensing)
Export Control Information
- Export Control Classification Number (ECCN): 3A001.a.7
- HTS Code: 8542.31.0001
- Country of Origin: Various (check specific lot markings)
- Export Restrictions: Subject to U.S. export administration regulations
Quality and Reliability
- Quality Standards: ISO 9001:2015 certified manufacturing
- Reliability Testing: Automotive qualification standards (AEC-Q100)
- Mean Time Between Failures (MTBF): >1 million hours
- Electrostatic Discharge (ESD): Class 1C (>1000V)
Packaging and Handling
- Packaging: Anti-static tray packaging
- Moisture Sensitivity: Level 3 (168 hours at 30ยฐC/60% RH)
- Storage Requirements: Dry storage recommended
- Handling Precautions: ESD-sensitive device – proper handling required
Recycling and Disposal
- Material Composition: Silicon die, lead-free solder balls, organic substrate
- Recycling: Compliant with WEEE directive requirements
- Disposal: Follow local electronic waste disposal regulations
- Material Declaration: Full material composition available upon request
Keywords: XC2S50-FG256AMS, Xilinx FPGA, Spartan-II, programmable logic, 50K gates, 256-pin FBGA, automotive grade, field-programmable gate array, embedded systems, digital signal processing
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