1. Product Specifications
Core Architecture
- Device Family: Spartan-IIE FPGA
- Logic Cells: 10,800 cells
- System Gates: 400,000 gates
- Configurable Logic Blocks (CLBs): 2,400 CLBs in 40 x 60 array
- Maximum User I/O: 182 pins
- Block RAM: 160 Kbits total memory
- Distributed RAM: 153,600 bits
Performance Characteristics
- Maximum Operating Frequency: 400MHz
- Speed Grade: -7 (high performance)
- Technology Node: 0.15ฮผm CMOS process
- Temperature Range: Commercial (0ยฐC to +85ยฐC)
Power Requirements
- Core Voltage (VCCINT): 1.8V ยฑ 5%
- I/O Supply Voltage (VCCO): 1.2V to 3.6V (depending on I/O standard)
- Power-efficient design for portable applications
Package Details
- Package Type: FTG256 (Fine-pitch Thin Ball Grid Array)
- Pin Count: 256 pins
- Ball Pitch: 1.0mm
- Package Dimensions: 17 x 17 x 1.55mm
- Package Weight: Approximately 1.0g
I/O Standards Support
- LVTTL, LVCMOS (1.8V, 2.5V, 3.3V)
- HSTL, SSTL (Class I & II)
- GTL, GTL+
- LVDS and LVPECL differential signaling
- PCI 3.3V compliant
- Hot-swap capable I/O
2. Pricing Information
Note: The XC2S400E-7FTG256C has been designated as obsolete by the manufacturer (Xilinx/AMD) as of August 2013. Pricing availability varies significantly based on remaining inventory.
Current Market Pricing
- New Stock: Limited availability from authorized distributors
- Price Range: Contact distributors for current quotations
- Alternative Sources: Surplus/excess inventory suppliers
- Lead Time: Varies by supplier (typically 2-12 weeks for available stock)
Procurement Recommendations
- Consider pin-compatible alternatives from current Xilinx product lines
- Evaluate Spartan-7 family for new designs requiring similar functionality
- Contact authorized distributors for end-of-life inventory availability
- Budget for potential last-time-buy opportunities
3. Documents & Media
Official Documentation
- Datasheet: DS077 Spartan-IIE FPGA Family Complete Data Sheet
- User Guide: UG002 Spartan-IIE FPGA User Guide
- Package Information: Package drawings and mechanical specifications
- Application Notes: XAPP179, XAPP173, XAPP174, XAPP176
Development Resources
- ISE Design Suite: Compatible with Xilinx ISE development tools
- IP Core Library: Access to extensive IP library for rapid development
- Reference Designs: Available through Xilinx design center
- FPGA Editor: For advanced placement and routing control
Technical Documentation
- Pin Assignment Guidelines
- Power Estimation Spreadsheets
- Thermal Management Guidelines
- Signal Integrity Design Rules
4. Related Resources
Development Tools
- Xilinx ISE Design Suite: Primary development environment
- iMPACT Configuration Tool: For device programming
- ChipScope Pro: For in-system debugging
- Platform Flash PROMs: For configuration storage
Compatible Products
- Configuration Memory: Platform Flash PROMs (XC18V04, XC18V08)
- Development Boards: Spartan-IIE evaluation platforms
- Programming Cables: Parallel Cable III, USB Platform Cable
Alternative Solutions
- Spartan-7 Family: Modern replacement with enhanced features
- Spartan-6 Family: Previous generation alternative
- Artix-7 Family: Higher performance option for demanding applications
Support Resources
- Xilinx Support Community: Forums and knowledge base
- Application Engineering Support: Technical consultation services
- Training Resources: Online courses and documentation
- Third-party Design Services: Authorized design partners
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets European RoHS directive requirements
- Lead-Free Package: Pb-free solder ball construction available (FTG256 variant)
- Halogen-Free Options: Available upon request
- REACH Compliant: Meets European REACH regulation requirements
Quality Standards
- ISO 9001: Manufacturing quality certification
- Automotive Grade: Available for automotive applications (extended temperature)
- Industrial Temperature Range: -40ยฐC to +100ยฐC options available
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS Code: 8542.31.0001
- Country of Origin: Varies by manufacturing location
- Export Restrictions: Subject to U.S. Export Administration Regulations (EAR)
Packaging & Logistics
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
- ESD Protection: Electrostatic discharge sensitive device
- Packaging Options: Tape and reel, tubes, trays
- Storage Requirements: Dry storage recommended
End-of-Life Considerations
- Product Status: Obsolete (discontinued August 2013)
- Last Ship Date: Varies by region and distributor
- Recommended Replacements: Consult Xilinx migration guides
- Legacy Support: Limited technical support available
Conclusion
The XC2S400E-7FTG256C represents a proven FPGA solution that served numerous applications during its active production period. While now obsolete, it remains a viable option for legacy system maintenance and specific cost-sensitive applications where new alternatives may not be suitable.
For new designs, engineers should consider migrating to current-generation Xilinx FPGAs that offer superior performance, lower power consumption, and long-term availability. Contact authorized distributors for migration assistance and alternative product recommendations.
Keywords: XC2S400E-7FTG256C, Spartan-IIE FPGA, Xilinx FPGA, 400K gates, FTBGA256, programmable logic, digital design, obsolete FPGA, legacy support
