1. Product Specifications
Core Technical Specifications
- Part Number: XC2S400E-6FGG456C
- Manufacturer: Xilinx (now AMD)
- Product Family: Spartan-IIE 1.8V FPGA
- System Gates: 400,000 gates
- Logic Cells: 10,800 cells
- Configurable Logic Blocks (CLBs): 2,400 CLBs
- Maximum Frequency: 357 MHz
- Technology: 0.15ฮผm CMOS process
Memory Architecture
- Block RAM: Up to 288K bits
- Distributed RAM: Up to 221,184 bits
- SelectRAM Hierarchical Memory: 16 bits/LUT distributed RAM
- Configurable Block RAM: 4K-bit true dual-port
Package and Electrical Characteristics
- Package Type: 456-Pin Fine-Pitch Ball Grid Array (FBGA)
- Package Code: FGG456
- Supply Voltage: 1.8V core, supports 3.3V I/O
- Operating Temperature Range: Commercial (0ยฐC to +85ยฐC)
- Speed Grade: -6 (Standard performance)
I/O Features
- Selectable I/O Standards: 19 different standards supported
- Delay-Locked Loops (DLLs): 4 DLLs for clock management
- User I/O Pins: 333 maximum user I/O
- Differential Signaling: LVDS, LVPECL support
Advanced Features
- In-System Reprogrammability: Unlimited reconfiguration capability
- Fast Predictable Interconnect: Ensures timing closure across design iterations
- Low Power Consumption: Optimized 1.8V architecture
- Hot-Swappable: Supports live insertion/removal
2. Pricing Information
Current Market Pricing (2025)
The XC2S400E-6FGG456C pricing varies based on quantity and supplier:
Typical Price Ranges:
- 1-9 units: $150-$200 per unit
- 10-99 units: $120-$160 per unit
- 100-499 units: $90-$130 per unit
- 500+ units: $70-$110 per unit
- 1000+ units: Contact for volume pricing
Note: Prices fluctuate based on market conditions, availability, and supplier. The XC2S400E-6FGG456C is marked as “NOT RECOMMENDED for NEW DESIGN” by the manufacturer, which may affect availability and pricing.
Cost Considerations
- Legacy product with limited new design recommendations
- Consider newer Spartan-7 or Artix-7 families for new projects
- Competitive pricing for maintenance and existing design support
3. Documents & Media
Official Documentation
- Spartan-IIE Family Data Sheet (DS077): Complete technical specifications
- Pin Configuration Guide: Detailed pinout diagrams and ball assignments
- Package Mechanical Drawings: Physical dimensions and mounting specifications
- AC/DC Characteristics: Timing parameters and electrical specifications
Development Resources
- ISE Design Suite: Legacy development environment (recommended for Spartan-IIE)
- Vivado Design Suite: Modern development platform with limited Spartan-IIE support
- Application Notes: Design guidelines and best practices
- Reference Designs: Sample projects and implementation examples
Quality Documentation
- Product Change Notifications (PCNs): Important manufacturing updates
- Qualification Reports: Reliability and environmental testing data
- RoHS Compliance: Environmental regulation compliance status
4. Related Resources
Development Tools
- Xilinx ISE WebPACK: Free development software
- ModelSim: Simulation and verification tools
- ChipScope Pro: In-system debugging and analysis
- CORE Generator: IP core integration tools
Evaluation Platforms
- Spartan-IIE Development Boards: Reference designs and starter kits
- Third-Party Evaluation Boards: Compatible development platforms
- Popular Alternatives: Basys 3, Nexys4-DDR, Arty S7 for modern development
Compatible Components
- Configuration Devices: Platform Flash PROMs and Serial Flash
- Clock Management: External oscillators and clock distribution
- Power Management: Voltage regulators and power sequencing
- Interface Components: Level translators and signal conditioning
Migration Path
- Spartan-6 Family: Direct upgrade path with enhanced features
- Spartan-7 Family: Modern replacement with improved performance
- Artix-7 Family: High-performance alternative for demanding applications
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Not RoHS compliant (legacy product)
- REACH Compliance: Meets EU chemical safety regulations
- Conflict Minerals: Compliant with conflict-free sourcing requirements
- WEEE Directive: Electronic waste management compliance
Operating Environment
- Operating Temperature: 0ยฐC to +85ยฐC (Commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 10% to 85% non-condensing
- Altitude: Up to 2000 meters operational
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Schedule B: 8542310001
- Country of Origin: Varies by manufacturing location
Reliability Standards
- MTBF (Mean Time Between Failures): >1,000,000 hours at 55ยฐC
- Quality Grade: Commercial/Industrial
- Qualification Standards: JEDEC, IPC, and MIL standards compliance
- Packaging Standards: JEDEC moisture sensitivity level (MSL-3)
Handling Precautions
- ESD Sensitivity: Class 1A (Human Body Model)
- Moisture Sensitivity: Level 3 (168 hours at 30ยฐC/60% RH)
- Storage Requirements: Anti-static packaging required
- Lead-Free Status: Pb-free terminations available
Important Notice: The XC2S400E-6FGG456C is designated as “NOT RECOMMENDED for NEW DESIGN” by Xilinx/AMD. For new projects, consider migrating to current-generation FPGAs such as Spartan-7, Artix-7, or Kintex-7 families for enhanced performance, lower power consumption, and long-term support.
Availability: While still available through authorized distributors and component brokers, inventory may be limited. Contact suppliers directly for current stock levels and delivery timelines.
