Product Specifications
Core Features
- Device Family: Xilinx Spartan-IIE
- Logic Cells: 400,000 system gates
- CLBs (Configurable Logic Blocks): 1,200
- Block RAM: 40 Kbits
- I/O Pins: 333 user I/O pins
- Package Type: BGA (Ball Grid Array)
- Pin Count: 456 pins
- Operating Temperature: Industrial (-40ยฐC to +85ยฐC)
- Supply Voltage: 2.5V core, 3.3V I/O
Performance Specifications
- Speed Grade: -6 (high performance)
- Maximum Frequency: Up to 200 MHz
- Propagation Delay: 4.2ns
- Power Consumption: Low power design optimized for battery-operated applications
- Configuration Memory: SRAM-based
Package Details
- Package Code: FG456 (Fine-pitch Ball Grid Array)
- Dimensions: 23mm x 23mm
- Ball Pitch: 1.0mm
- Lead-Free: RoHS compliant
Price Information
The XC2S400E-6FG456I pricing varies based on quantity and supplier. Typical pricing ranges:
- Single Unit: $45-65 USD
- Volume (100+ units): $35-50 USD
- Production Quantities (1000+): Contact authorized distributors for volume pricing
Prices subject to change based on market conditions and availability. Contact authorized Xilinx distributors for current pricing and lead times.
Documents & Media
Technical Documentation
- Datasheet: XC2S400E complete specifications and electrical characteristics
- User Guide: Spartan-IIE FPGA User Guide (UG002)
- Application Notes:
- XAPP151: Spartan-IIE Configuration and Readback
- XAPP154: Using Block RAM in Spartan-IIE Devices
- Package Information: FG456 package drawings and pin assignments
- Errata: Known issues and workarounds document
Design Resources
- Reference Designs: Sample VHDL/Verilog code examples
- Constraint Files: UCF (User Constraints File) templates
- Simulation Models: IBIS and SPICE models for signal integrity analysis
- Footprint Libraries: PCB layout footprints for major CAD tools
Software Tools
- ISE Design Suite: Xilinx integrated development environment
- ChipScope Pro: On-chip debugging and analysis
- CORE Generator: IP core creation and customization tool
Related Resources
Development Boards
- Spartan-IIE Starter Kit: Evaluation board featuring XC2S400E
- Custom Development Platforms: Third-party boards supporting the XC2S400E-6FG456I
Compatible Devices
- XC2S300E-6FG456I: Lower gate count alternative
- XC2S600E-6FG456I: Higher capacity option in same package
- XC2S200E-6PQ208I: Cost-optimized alternative in smaller package
Support Resources
- Xilinx Answer Database: Searchable knowledge base
- Community Forums: User discussion and support
- Technical Support: Direct access to Xilinx applications engineers
- Training Materials: Online courses and webinars
Application Areas
- Digital Signal Processing: FIR/IIR filters, FFT implementations
- Communications: Protocol processing, baseband processing
- Industrial Control: Motor control, sensor interfacing
- Aerospace/Defense: Radar processing, secure communications
- Medical Electronics: Imaging systems, patient monitoring
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free package meets RoHS directive requirements
- REACH Compliant: Complies with EU REACH regulation
- Conflict Minerals: Xilinx conflict minerals policy compliant
- Green Package: Halogen-free package option available
Operating Conditions
- Operating Temperature Range: -40ยฐC to +85ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 85% RH non-condensing
- Altitude: Up to 2000 meters operational
Export Control Information
- ECCN (Export Control Classification Number): 3A001.a.7
- Country of Origin: Varies by manufacturing location
- Export License: May require export license for certain destinations
- HTS Code: 8542.31.0001
Quality Standards
- Automotive Qualified: Not available in automotive grade
- Quality Grade: Industrial temperature range
- Reliability: MTBF > 1 million hours at 25ยฐC
- Manufacturing Standard: ISO 9001:2015 certified facilities
Packaging & Shipping
- Anti-Static Packaging: ESD-safe packaging and handling
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
- Shelf Life: 12 months in original packaging
- Lead Time: Typically 4-12 weeks depending on availability
The XC2S400E-6FG456I represents an excellent balance of performance, features, and cost-effectiveness for demanding FPGA applications. Its robust feature set and industrial-grade reliability make it suitable for a wide range of applications from prototyping to production deployment.
