Product Specifications
Core Architecture
- Device Family: Xilinx Spartan-II
- Part Number: XC2S400E-6FG456I
- System Gates: 400,000 gates
- Logic Cells: 10,800 equivalent logic cells
- Configurable Logic Blocks (CLBs): 1,176 CLBs
- Input/Output: 333 user I/O pins
Memory and Storage
- Block RAM: 120 Kbits total block RAM
- Distributed RAM: 15 Kbits
- Configuration Memory: SRAM-based
- Memory Blocks: 30 dedicated block RAM modules
Performance Characteristics
- Speed Grade: -6 (fastest speed grade available)
- Maximum System Frequency: Up to 200 MHz
- Package Type: FG456 (Fine-pitch Ball Grid Array)
- Pin Count: 456 pins
- Operating Temperature: Industrial grade (-40ยฐC to +85ยฐC)
Package Details
- Package: 456-pin Fine-pitch Ball Grid Array (FBGA)
- Ball Pitch: 1.0mm
- Package Dimensions: 23mm ร 23mm
- Height: 2.3mm maximum
- Lead-free: RoHS compliant
Power Requirements
- Core Voltage: 2.5V ยฑ 5%
- I/O Voltage: 1.2V to 3.3V (mixed voltage support)
- Power Consumption: Low power CMOS technology
- Standby Power: Minimal static power consumption
Price Information
The XC2S400E-6FG456I pricing varies based on quantity and supplier. For current pricing and availability:
- Small Quantities (1-99 units): Contact authorized distributors
- Volume Pricing: Available for quantities over 100 units
- Extended Temperature Range: Premium pricing for industrial applications
- Lead Time: Typically 12-16 weeks for standard orders
Note: Prices are subject to change based on market conditions and silicon availability. Contact Xilinx authorized distributors for real-time pricing and stock information.
Documents & Media
Technical Documentation
- XC2S400E-6FG456I Datasheet: Complete electrical and timing specifications
- Spartan-II Family Data Sheet: Comprehensive family overview and features
- Package Drawing: Detailed mechanical specifications and pin assignments
- IBIS Models: Signal integrity simulation models
- BSDL Files: Boundary scan description language files for testing
Design Resources
- Pinout Files: CSV and Excel formats for design tools
- Schematic Symbols: CAD library components
- PCB Footprints: Layout patterns for major CAD systems
- Reference Designs: Example implementations and best practices
- Application Notes: Design guidelines and optimization techniques
Software Tools
- ISE Design Suite: Complete development environment
- WebPACK: Free version with device support
- ChipScope Pro: Logic analyzer for debugging
- CORE Generator: IP core creation tool
Related Resources
Development Boards
- Spartan-II Starter Kit: Evaluation platform with XC2S400E device
- Third-party Development Boards: Compatible evaluation platforms
- Prototyping Solutions: Breadboard and socket adapters
Compatible Devices
- XC2S300E-6FG456I: Lower gate count alternative
- XC2S600E-6FG456I: Higher capacity option in same package
- Migration Path: Spartan-3 family upgrade options
Support Resources
- Xilinx Forums: Community support and discussions
- Application Support: Technical assistance and design consultation
- Training Materials: Webinars, tutorials, and certification programs
- Design Services: Partner network for implementation support
IP Cores and Solutions
- Memory Controllers: DDR, SDRAM interface cores
- Communication Interfaces: UART, SPI, I2C controllers
- DSP Functions: Digital signal processing IP blocks
- Networking Cores: Ethernet MAC and PHY interfaces
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free manufacturing process
- REACH Regulation: EU chemical safety compliance
- Halogen-free: Environmentally friendly packaging materials
- Recycling: Semiconductor recycling program participation
Operating Conditions
- Temperature Range: -40ยฐC to +85ยฐC (Industrial grade)
- Humidity: 85% relative humidity maximum (non-condensing)
- Altitude: Up to 10,000 feet operational
- Vibration Resistance: MIL-STD-883 compliant
- Shock Resistance: Industry standard mechanical specifications
Export Control Classification
- ECCN: 3A001.a.2.a (US Export Administration Regulations)
- HTS Code: 8542.39.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufacturing location dependent
- Export Licensing: May require export license for certain destinations
- ITAR Status: Not subject to International Traffic in Arms Regulations
Quality and Reliability
- Qualification Standards: AEC-Q100 automotive qualified versions available
- Reliability Testing: HTOL, TC, HAST, and ESD testing performed
- Quality System: ISO 9001:2015 certified manufacturing
- MTBF Rating: Mean Time Between Failures data available
- Warranty: Standard semiconductor warranty terms apply
The XC2S400E-6FG456I represents an excellent choice for designers requiring high-performance FPGA capabilities with proven reliability and comprehensive development tool support. Its combination of generous logic resources, flexible I/O options, and robust package design makes it suitable for a wide range of commercial and industrial applications.
