Product Specifications
Core Architecture
- Device Family: Spartan-II E Series
- Logic Cells: 400,000 equivalent gates
- System Gates: Up to 400,000
- CLBs (Configurable Logic Blocks): 1,176 CLBs
- Logic Array: 24 x 49 array of CLBs
- Total I/O Pins: 333 user I/O pins
Memory Configuration
- Block RAM: 40 blocks of 4K bits each (160 Kb total)
- Distributed RAM: Available within CLBs
- Configuration Memory: SRAM-based
Performance Specifications
- Speed Grade: -6 (fastest available for this series)
- Maximum Frequency: Up to 200 MHz+ depending on design
- Propagation Delay: 4.1 ns typical
Package Details
- Package Type: FG456 (Fine-pitch Ball Grid Array)
- Pin Count: 456 pins
- Package Size: 23mm x 23mm
- Ball Pitch: 1.0mm
- Operating Temperature: Commercial (0ยฐC to +85ยฐC)
Power Requirements
- Core Voltage: 2.5V ยฑ5%
- I/O Voltage: 1.8V, 2.5V, 3.3V compatible
- Power Consumption: Low power CMOS technology
Pricing Information
The XC2S400E-6FG456C pricing varies based on quantity and supplier:
- Single Unit: $45-65 USD (depending on distributor)
- Volume Pricing: Available for orders of 100+ units
- Sample Quantities: Contact authorized distributors
- Lead Time: Typically 8-12 weeks for standard orders
Note: Prices are subject to market conditions and availability. Contact authorized Xilinx distributors for current pricing and stock status.
Documents & Media
Technical Documentation
- Datasheet: XC2S400E Complete Product Specification
- User Guide: Spartan-II FPGA Family Complete Data Sheet
- Application Notes:
- XAPP151: Virtex and Spartan-II FPGA Families
- XAPP154: Using Block RAM in Spartan-II FPGAs
- Package Information: FG456 Package Specifications and PCB Guidelines
Design Resources
- IBIS Models: Available for signal integrity analysis
- Footprint Files: PCB layout files for major CAD tools
- 3D Models: STEP files for mechanical design
- Reference Designs: Example projects and tutorials
Software Compatibility
- ISE Design Suite: Versions 6.1i through 14.7
- Vivado: Not supported (legacy device)
- Impact: For device programming and configuration
Related Resources
Development Tools
- Spartan-II Starter Kit: Evaluation board with XC2S200E
- Platform Flash Configuration PROMs: XCF02S, XCF04S
- Programming Cables: Platform Cable USB, Parallel Cable IV
Compatible Devices
- XC2S300E-6FG456C: Lower gate count alternative
- XC2S600E-6FG456C: Higher capacity option in same package
- XC2S400E-7FG456C: Industrial temperature grade version
Design Software
- ModelSim: For functional simulation
- ChipScope Pro: For in-system debugging
- EDK (Embedded Development Kit): For embedded processor designs
Technical Support
- Xilinx Forums: Community support and discussions
- Answer Database: Searchable technical solutions
- Application Engineering: Direct technical support
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU RoHS directive requirements
- REACH Compliant: Complies with EU REACH regulation
- Halogen-Free: Available upon request
- Pb-Free Package: Lead-free solder ball attachment
Operating Conditions
- Operating Temperature Range: 0ยฐC to +85ยฐC (Commercial)
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- MSL Rating: Moisture Sensitivity Level 3
Export Classifications
- ECCN: 3A001.a.7 (Export Control Classification Number)
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
- Country of Origin: Various (check specific lot marking)
- Export License: May be required for certain destinations
Quality Standards
- Qualification Standard: MIL-STD-883 Method 5004
- Quality Grade: Commercial
- Reliability: 1M+ hours MTBF at 55ยฐC junction temperature
The XC2S400E-6FG456C represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based designs requiring substantial logic capacity and high-speed operation. Its proven architecture and extensive development ecosystem make it a reliable choice for both new designs and legacy system maintenance.
